Overview
The 1PS66SB82115 is a semiconductor component produced by NXP USA Inc., a leading global semiconductor company known for its innovative solutions in various industries including automotive, IoT, and industrial sectors. This component is part of NXP's extensive portfolio of discrete semiconductors, which are crucial for enabling the functionality and performance of a wide range of electronic devices.
Key Specifications
| Parameter | Value |
|---|---|
| Manufacturer | NXP USA Inc. |
| Part Number | 1PS66SB82115 |
| Package Type | Tape & Reel (TR) |
| RoHS Status | ROHS3 |
| HTSUS Code | 8541.10.0070 |
Key Features
- Part of NXP's discrete semiconductor portfolio, which provides essential functionality for various electronic devices.
- Package type: Tape & Reel (TR), which offers mechanical support and prevents damage due to vibration or shock.
- Compliant with ROHS3 standards, ensuring environmental sustainability.
- Used in a wide range of applications including computers, smartphones, televisions, cars, and medical devices.
Applications
The 1PS66SB82115 is versatile and can be used in multiple electronic devices across different industries. Some of the key applications include:
- Computers and smartphones: Enhancing computational power and functionality.
- Televisions and consumer electronics: Supporting various electronic functions.
- Automotive systems: Used in vehicles for various electronic control systems.
- Medical devices: Providing critical functionality in medical equipment.
Q & A
- What is the part number of this component?
The part number is 1PS66SB82115. - Who is the manufacturer of this component?
The manufacturer is NXP USA Inc. - What is the package type of this component?
The package type is Tape & Reel (TR).
Yes, it is compliant with ROHS3 standards.- What is the HTSUS code for this component?
The HTSUS code is 8541.10.0070. - In which industries is this component commonly used?
This component is used in industries such as automotive, consumer electronics, medical devices, and more. - What kind of support does the Tape & Reel package provide?
The Tape & Reel package provides mechanical support to the IC chip, ensuring proper alignment and preventing damage due to vibration or shock. - Can this component be used in high-vibration environments?
Yes, due to its Tape & Reel packaging, it can withstand environments with vibration or shock. - Is this component suitable for environmentally sensitive applications?
Yes, it is ROHS3 compliant, making it suitable for environmentally sensitive applications. - Where can I find more detailed specifications and datasheets for this component?
You can find detailed specifications and datasheets on the NXP website or through authorized distributors like Ersa Electronics and Integrated Aviation Hardware.
