MT53D512M32D2DS-053 AIT:D TR
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Micron Technology Inc. MT53D512M32D2DS-053 AIT:D TR

Manufacturer No:
MT53D512M32D2DS-053 AIT:D TR
Manufacturer:
Micron Technology Inc.
Package:
Tape & Reel (TR)
Description:
IC DRAM 16GBIT 1866MHZ 200WFBGA
Delivery:
Payment:
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Product Introduction

Overview

The MT53D512M32D2DS-053 AIT:D TR is a high-performance DRAM chip designed by Micron Technology Inc. This component is part of the LPDDR4 SDRAM family, specifically tailored for automotive applications. Introduced on October 31, 2017, it is known for its robust performance and compliance with industry standards such as AEC-Q100. The chip operates at a clock frequency of 1866 MHz and is packaged in a 200-pin Very Fine Ball Grid Array (VFBGA) format, making it suitable for a variety of automotive and industrial systems that require reliable and high-speed memory solutions.

Key Specifications

Parameter Value
Part Number MT53D512M32D2DS-053 AIT:D TR
Manufacturer Micron Technology Inc.
Memory Type SDRAM - Mobile LPDDR4
Memory Size 16 Gbit (512M x 32)
Package / Case 200-WFBGA (10x14.5)
Data Bus Width 32 bit
Maximum Clock Frequency 1866 MHz
Supply Voltage - Max 1.1 V
Minimum Operating Temperature -40°C
Maximum Operating Temperature +105°C
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Mounting Style SMD/SMT
RoHS Status Lead free / RoHS Compliant

Key Features

  • High-Speed Performance: The MT53D512M32D2DS-053 AIT:D TR operates at a clock frequency of 1866 MHz, ensuring high-speed data transfer and processing.
  • Automotive Grade: This component is qualified to the AEC-Q100 standard, making it suitable for demanding automotive applications.
  • Low Power Consumption: With a supply voltage of 1.1 V, it is designed to be power-efficient, which is crucial for battery-powered devices.
  • Robust Operating Temperature Range: The chip can operate in temperatures ranging from -40°C to +105°C, ensuring reliability in various environmental conditions.
  • Compact Packaging: The 200-pin VFBGA package is compact and suitable for space-constrained designs.

Applications

  • Automotive Systems: Ideal for advanced driver-assistance systems (ADAS), infotainment systems, and other automotive electronics that require high-speed and reliable memory.
  • Industrial Control Systems: Suitable for industrial control systems, IoT devices, and other applications that demand robust and high-performance memory solutions.
  • Embedded Systems: Can be used in various embedded systems that require low power consumption and high-speed data processing.

Q & A

  1. What is the memory size of the MT53D512M32D2DS-053 AIT:D TR?

    The memory size is 16 Gbit, organized as 512M x 32.

  2. What is the clock frequency of this DRAM chip?

    The clock frequency is 1866 MHz.

  3. What is the package type of this component?

    The package type is 200-WFBGA (10x14.5).

  4. Is this component RoHS compliant?
  5. What is the operating temperature range of this chip?

    The operating temperature range is -40°C to +105°C.

  6. What is the supply voltage for this component?

    The supply voltage is 1.1 V.

  7. Is this component suitable for automotive applications?
  8. What is the data bus width of this DRAM chip?

    The data bus width is 32 bits.

  9. What is the moisture sensitivity level (MSL) of this component?

    The MSL is 3 (168 Hours).

  10. What mounting style does this component use?

    The mounting style is SMD/SMT.

Product Attributes

Memory Type:Volatile
Memory Format:DRAM
Technology:SDRAM - Mobile LPDDR4
Memory Size:16Gb (512M x 32)
Memory Interface:- 
Clock Frequency:1.866 GHz
Write Cycle Time - Word, Page:- 
Access Time:- 
Voltage - Supply:1.1V
Operating Temperature:-40°C ~ 95°C (TC)
Mounting Type:Surface Mount
Package / Case:200-WFBGA
Supplier Device Package:200-WFBGA (10x14.5)
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Similar Products

Part Number MT53D512M32D2DS-053 AIT:D TR MT53D512M32D2DS-053 AUT:D TR MT53D512M32D2DS-053 AAT:D TR
Manufacturer Micron Technology Inc. Micron Technology Inc. Micron Technology Inc.
Product Status Active Active Active
Memory Type Volatile Volatile Volatile
Memory Format DRAM DRAM DRAM
Technology SDRAM - Mobile LPDDR4 SDRAM - Mobile LPDDR4 SDRAM - Mobile LPDDR4
Memory Size 16Gb (512M x 32) 16Gb (512M x 32) 16Gb (512M x 32)
Memory Interface - - -
Clock Frequency 1.866 GHz 1.866 GHz 1.866 GHz
Write Cycle Time - Word, Page - - -
Access Time - - -
Voltage - Supply 1.1V 1.1V 1.1V
Operating Temperature -40°C ~ 95°C (TC) -40°C ~ 125°C (TC) -40°C ~ 105°C (TC)
Mounting Type Surface Mount Surface Mount Surface Mount
Package / Case 200-WFBGA 200-WFBGA 200-WFBGA
Supplier Device Package 200-WFBGA (10x14.5) 200-WFBGA (10x14.5) 200-WFBGA (10x14.5)

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