MT53D512M32D2DS-053 WT:D TR
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Micron Technology Inc. MT53D512M32D2DS-053 WT:D TR

Manufacturer No:
MT53D512M32D2DS-053 WT:D TR
Manufacturer:
Micron Technology Inc.
Package:
Tape & Reel (TR)
Description:
IC DRAM 16GBIT 1866MHZ 200WFBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The MT53D512M32D2DS-053 WT:D TR, manufactured by Micron Technology Inc., is a high-density, low-power DDR4 SDRAM module designed for mobile and embedded applications. This memory chip offers a balance of high-speed operation and energy efficiency, making it suitable for a wide range of electronic devices. Introduced on October 31, 2017, this component is part of Micron's LPDDR4 SDRAM family, known for its compact form factor and robust performance in various environmental conditions.

Key Specifications

Specification Value
Memory Type DDR4 SDRAM
Capacity 16 Gb (512M x 32)
Data Rate Up to 3200 Mbps
Operating Voltage 1.2V
Operating Temperature Range -40°C to +95°C
Clock Frequency 1.866 GHz
Package Type WFBGA-200
No. of Pins 200 Pins
IC Mounting Surface Mount
RoHS Compliance Yes

Key Features

  • High Density: Offers 16 Gb of storage capacity in a compact form factor.
  • Low Power Consumption: Operates at 1.2V, reducing energy usage in mobile and embedded devices.
  • High Data Rate: Supports data rates of up to 3200 Mbps for fast and responsive performance.
  • Wide Temperature Range: Suitable for operation in harsh environmental conditions from -40°C to +95°C.
  • On-Die Termination (ODT): Improves signal integrity and reduces system noise.

Applications

The MT53D512M32D2DS-053 WT:D TR is well-suited for various applications demanding high-speed and energy-efficient memory access. These include:

  • Mobile Devices: Smartphones, tablets, and other mobile devices requiring high-density storage and low power consumption.
  • Embedded Systems: IoT devices, automotive systems, and other embedded applications with limited power budgets.
  • Networking Equipment: Servers and networking devices handling high volumes of data traffic efficiently and reliably.

Q & A

  1. What is the main purpose of the MT53D512M32D2DS-053 WT:D TR?

    The main purpose of this component is to provide high-density, low-power DDR4 SDRAM for mobile and embedded applications, offering a balance of performance and energy efficiency.

  2. What are the key specifications of the MT53D512M32D2DS-053 WT:D TR?

    The key specifications include a capacity of 16 Gb (512M x 32), data rate up to 3200 Mbps, operating voltage of 1.2V, and an operating temperature range of -40°C to +95°C.

  3. What are the advantages of using the MT53D512M32D2DS-053 WT:D TR?

    The advantages include high-density storage, low power consumption, high-speed data access, a wide temperature operating range, and on-die termination for improved signal integrity.

  4. What are the potential disadvantages of the MT53D512M32D2DS-053 WT:D TR?

    Potential disadvantages include the need for careful PCB layout for optimal signal integrity and increased heat dissipation considerations due to higher density.

  5. Can the MT53D512M32D2DS-053 WT:D TR be used in place of other DDR4 SDRAM modules?

    While it can be used in similar applications, the MT53D512M32D2DS-053 WT:D TR is optimized for mobile and embedded applications and may have specific features that differ from other DDR4 SDRAM modules.

  6. What is the package type of the MT53D512M32D2DS-053 WT:D TR?

    The package type is WFBGA-200, suitable for surface-mount technology and ideal for space-constrained applications.

  7. Is the MT53D512M32D2DS-053 WT:D TR RoHS compliant?

    Yes, the component is RoHS compliant.

  8. What is the clock frequency of the MT53D512M32D2DS-053 WT:D TR?

    The clock frequency is 1.866 GHz.

  9. What are the typical applications for the MT53D512M32D2DS-053 WT:D TR?

    Typical applications include mobile devices, embedded systems, and networking equipment.

  10. How does the MT53D512M32D2DS-053 WT:D TR compare to similar DDR4 SDRAM modules?

    The MT53D512M32D2DS-053 WT:D TR is optimized for mobile and embedded applications, offering specific features tailored to these needs, such as high-density storage and low power consumption.

Product Attributes

Memory Type:Volatile
Memory Format:DRAM
Technology:SDRAM - Mobile LPDDR4
Memory Size:16Gb (512M x 32)
Memory Interface:- 
Clock Frequency:1.866 GHz
Write Cycle Time - Word, Page:- 
Access Time:- 
Voltage - Supply:1.1V
Operating Temperature:-30°C ~ 85°C (TC)
Mounting Type:Surface Mount
Package / Case:200-WFBGA
Supplier Device Package:200-WFBGA (10x14.5)
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