MT53D512M32D2DS-053 AUT:D TR
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Micron Technology Inc. MT53D512M32D2DS-053 AUT:D TR

Manufacturer No:
MT53D512M32D2DS-053 AUT:D TR
Manufacturer:
Micron Technology Inc.
Package:
Tape & Reel (TR)
Description:
IC DRAM 16GBIT 1.866GHZ 200WFBGA
Delivery:
Payment:
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Product Introduction

Overview

The MT53D512M32D2DS-053 AUT:D TR is a low-power, high-density memory module produced by Micron Technology Inc. This component is part of the LPDDR4 DRAM family, designed to meet the demanding requirements of mobile and cloud computing devices. It offers enhanced data transfer and processing capabilities, making it ideal for applications that require fast and efficient storage.

Key Specifications

ParameterValue
Part NumberMT53D512M32D2DS-053 AUT:D TR
ManufacturerMicron Technology Inc.
Memory TypeLPDDR4 DRAM
Capacity16 Gbit
Package Type200-WFBGA (10x14.5 mm)
Clock Speed2.133 GHz
Operating Voltage1.1 V
Temperature Range-40°C to 85°C

Key Features

  • Low power consumption to reduce heat generation and enhance battery life in mobile devices.
  • High-density storage with 16 Gbit capacity.
  • Fast data transfer rates with a clock speed of 2.133 GHz.
  • Compact 200-WFBGA package (10x14.5 mm) for space-efficient designs.
  • Reliable and secure memory storage suitable for mission-critical systems.

Applications

  • Mobile devices such as smartphones and tablets.
  • Cloud computing infrastructure.
  • Industrial applications requiring reliable and efficient memory solutions.
  • Data-intensive applications in IoT and edge computing.

Q & A

  1. What is the part number of this memory module?
    The part number is MT53D512M32D2DS-053 AUT:D TR.
  2. Who is the manufacturer of this component?
    The manufacturer is Micron Technology Inc.
  3. What type of memory does this component use?
    This component uses LPDDR4 DRAM.
  4. What is the capacity of this memory module?
    The capacity is 16 Gbit.
  5. What is the clock speed of this memory module?
    The clock speed is 2.133 GHz.
  6. What is the operating voltage of this component?
    The operating voltage is 1.1 V.
  7. What is the package type and size of this component?
    The package type is 200-WFBGA, and the size is 10x14.5 mm.
  8. What are the typical applications for this memory module?
    Typical applications include mobile devices, cloud computing infrastructure, industrial applications, and data-intensive IoT and edge computing.
  9. Is this component suitable for mission-critical systems?
    Yes, this component is reliable and secure, making it suitable for mission-critical systems.
  10. What is the temperature range for this component?
    The temperature range is -40°C to 85°C.

Product Attributes

Memory Type:Volatile
Memory Format:DRAM
Technology:SDRAM - Mobile LPDDR4
Memory Size:16Gb (512M x 32)
Memory Interface:- 
Clock Frequency:1.866 GHz
Write Cycle Time - Word, Page:- 
Access Time:- 
Voltage - Supply:1.1V
Operating Temperature:-40°C ~ 125°C (TC)
Mounting Type:Surface Mount
Package / Case:200-WFBGA
Supplier Device Package:200-WFBGA (10x14.5)
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Similar Products

Part Number MT53D512M32D2DS-053 AUT:D TR MT53D512M32D2DS-053 AAT:D TR MT53D512M32D2DS-053 AIT:D TR
Manufacturer Micron Technology Inc. Micron Technology Inc. Micron Technology Inc.
Product Status Active Active Active
Memory Type Volatile Volatile Volatile
Memory Format DRAM DRAM DRAM
Technology SDRAM - Mobile LPDDR4 SDRAM - Mobile LPDDR4 SDRAM - Mobile LPDDR4
Memory Size 16Gb (512M x 32) 16Gb (512M x 32) 16Gb (512M x 32)
Memory Interface - - -
Clock Frequency 1.866 GHz 1.866 GHz 1.866 GHz
Write Cycle Time - Word, Page - - -
Access Time - - -
Voltage - Supply 1.1V 1.1V 1.1V
Operating Temperature -40°C ~ 125°C (TC) -40°C ~ 105°C (TC) -40°C ~ 95°C (TC)
Mounting Type Surface Mount Surface Mount Surface Mount
Package / Case 200-WFBGA 200-WFBGA 200-WFBGA
Supplier Device Package 200-WFBGA (10x14.5) 200-WFBGA (10x14.5) 200-WFBGA (10x14.5)

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