MT47H32M16HR-25E:G
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Micron Technology Inc. MT47H32M16HR-25E:G

Manufacturer No:
MT47H32M16HR-25E:G
Manufacturer:
Micron Technology Inc.
Package:
Tray
Description:
IC DRAM 512MBIT PARALLEL 84FBGA
Delivery:
Payment:
iso14001
iso45001
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Product Introduction

Overview

The MT47H32M16HR-25E:G is a DDR2 SDRAM memory module produced by Micron Technology Inc. This component is part of Micron's extensive range of memory solutions, designed to meet the high-performance requirements of various electronic systems. The MT47H32M16HR-25E:G features a 512Mb capacity, configured as 32M x 16, making it suitable for applications that demand robust memory performance.

Key Specifications

ParameterValue
Memory TypeDDR2 SDRAM
Memory Size512Mb (32M x 16)
Clock Frequency400MHz
Access Time400ps
Voltage - Supply1.7 V ~ 1.9 V
Operating Temperature0°C ~ 85°C (Commercial), -40°C ~ 95°C (Industrial)
Package / Case84-TFBGA (8x12.5mm)
Mounting TypeSurface Mount
Refresh Count64ms, 8192-cycle
CAS LatencyProgrammable (CL = 3, 4, 5, 6)

Key Features

  • JEDEC-standard 1.8V I/O SSTL_18-compatible
  • Differential data strobe DQS, DQS# option
  • 4n-bit prefetch architecture
  • Duplicate output strobe RDQS option for x8
  • DLL to align DQ and DQS transitions with CK
  • 4 internal banks for concurrent operation
  • Selectable burst lengths 4 or 8
  • Adjustable data-output drive strength
  • On-die termination ODT
  • Industrial and Automotive temperature options
  • RoHS-compliant

Applications

The MT47H32M16HR-25E:G is suitable for a wide range of applications that require high-performance memory, including but not limited to:

  • Server and data center systems
  • High-performance computing
  • Embedded systems
  • Automotive systems
  • Industrial control systems

Q & A

  1. What is the memory capacity of the MT47H32M16HR-25E:G? The memory capacity is 512Mb, configured as 32M x 16.
  2. What is the clock frequency of this DDR2 SDRAM? The clock frequency is 400MHz.
  3. What is the access time of the MT47H32M16HR-25E:G? The access time is 400ps.
  4. What are the operating temperature ranges for this component? The operating temperature ranges are 0°C ~ 85°C (Commercial) and -40°C ~ 95°C (Industrial).
  5. What package type is used for the MT47H32M16HR-25E:G? The package type is 84-TFBGA (8x12.5mm).
  6. Is the MT47H32M16HR-25E:G RoHS-compliant? Yes, it is RoHS-compliant.
  7. What are the refresh characteristics of this DDR2 SDRAM? The refresh count is 64ms, with 8192 cycles.
  8. Can the CAS latency be programmed? Yes, the CAS latency is programmable (CL = 3, 4, 5, 6).
  9. Does the MT47H32M16HR-25E:G support on-die termination? Yes, it supports on-die termination (ODT).
  10. What are the burst length options for this component? The burst length options are 4 or 8.

Product Attributes

Memory Type:Volatile
Memory Format:DRAM
Technology:SDRAM - DDR2
Memory Size:512Mb (32M x 16)
Memory Interface:Parallel
Clock Frequency:400 MHz
Write Cycle Time - Word, Page:15ns
Access Time:400 ps
Voltage - Supply:1.7V ~ 1.9V
Operating Temperature:0°C ~ 85°C (TC)
Mounting Type:Surface Mount
Package / Case:84-TFBGA
Supplier Device Package:84-FBGA (8x12.5)
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Similar Products

Part Number MT47H32M16HR-25E:G MT47H32M16HW-25E:G
Manufacturer Micron Technology Inc. Micron Technology Inc.
Product Status Obsolete Obsolete
Memory Type Volatile Volatile
Memory Format DRAM DRAM
Technology SDRAM - DDR2 SDRAM - DDR2
Memory Size 512Mb (32M x 16) 512Mb (32M x 16)
Memory Interface Parallel Parallel
Clock Frequency 400 MHz 400 MHz
Write Cycle Time - Word, Page 15ns 15ns
Access Time 400 ps 400 ps
Voltage - Supply 1.7V ~ 1.9V 1.7V ~ 1.9V
Operating Temperature 0°C ~ 85°C (TC) 0°C ~ 85°C (TC)
Mounting Type Surface Mount Surface Mount
Package / Case 84-TFBGA 84-TFBGA
Supplier Device Package 84-FBGA (8x12.5) 84-FBGA (8x12.5)

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