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Mfr Part #
Quantity Available
UnitPrice
RFQ
Series
Packaging
Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
90
$0.00
IC
Bulk
Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyester, Glass Filled -55°C ~ 125°C
227
$0.00
ICA
Tube
Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
425
$0.00
ICA
Tube
Obsolete DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Liquid Crystal Polymer (LCP) -55°C ~ 125°C
549
$0.00
ICO
Tube
Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
527
$0.00
Textool™
Bulk
Active PGA, ZIF (ZIP) 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
178
$0.00
Textool™
Bulk
Active PGA, ZIF (ZIP) 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
353
$0.00
Bulk
Active Zig-Zag 39 (1 x 19, 1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 150°C
245
$1.46
800
Bulk
Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
399
$0.00
47594
Tray
Obsolete LGA 1366 (32 x 41) - Nickel 3.00µin (0.076µm) - Surface Mount Closed Frame Solder - Nickel 3.00µin (0.076µm) - - -
84
$0.00
47594
Tray
Obsolete LGA 1366 (32 x 41) 0.040" (1.02mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.040" (1.01mm) - - - Liquid Crystal Polymer (LCP) -
2,259
$0.23
Tape & Reel (TR)
Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze - -40°C ~ 105°C
456
$0.00
Textool™
-
Active BGA Custom 0.026" ~ 0.050" (0.65mm ~ 1.27mm) Custom Custom - Through Hole Custom - - - - - - -
283
$0.00
47594
Tray
Obsolete LGA 1366 (32 x 41) 0.040" (1.02mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.040" (1.01mm) - - - Liquid Crystal Polymer (LCP) -
585
$0.00
47594
Tray
Obsolete LGA 1356 (32 x 41) 0.040" (1.02mm) Gold 15.0µin (0.38µm) - Surface Mount Open Frame - - - - - - -
90
$0.00
47596
Tray
Obsolete LGA 1156 (40 x 40) 0.036" (0.91mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.036" (0.91mm) - - - Thermoplastic -
565
$0.00
47596
Tray
Obsolete LGA 1155 (40 x 40) 0.036" (0.91mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.036" (0.91mm) - - - Thermoplastic -
244
$0.00
47596
Tray
Obsolete LGA 1155 (40 x 40) 0.036" (0.91mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.036" (0.91mm) - - - Thermoplastic -
52
$0.00
SA
Tube
Obsolete DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
515
$0.00
SA
Tube
Obsolete DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 80.0µin (2.03µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
228
$0.00
ICO
Bulk
Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C