PDF
Mfr Part #
Quantity Available
UnitPrice
RFQ
Series
Packaging
Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
220
$0.00
ICO
Bulk
Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
239
$0.00
Textool™
-
Active - - - - - - - - - - - - - - -
79
$0.00
Textool™
-
Active - - - - - - - - - - - - - - -
461
$0.00
OEM
-
Obsolete - - - - - - - - - - - - - - -
162
$0.00
Textool™
Bulk
Active Zig-Zag, ZIF (ZIP) 34 (2 x 17) 0.050" (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
37
$0.00
Textool™
Bulk
Active Zig-Zag, ZIF (ZIP) 34 (2 x 17) 0.050" (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
371
$0.00
Textool™
Bulk
Active Zig-Zag, ZIF (ZIP) 35 (1 x 17, 1 x 18) 0.050" (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
24
$0.00
Textool™
Bulk
Active Zig-Zag, ZIF (ZIP) 35 (1 x 17, 1 x 18) 0.050" (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
35
$0.00
Box
Active - - - - - - - - - - - - - - -
360
$0.00
-
Active - - - - - - - - - - - - - - -
435
$0.00
-
Active - - - - - - - - - - - - - - -
151
$0.00
Textool™
Bulk
Active Zig-Zag, ZIF (ZIP) 51 (1 x 25, 1 x 26) 0.050" (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
60
$0.00
Textool™
Bulk
Active Zig-Zag, ZIF (ZIP) 51 (1 x 25, 1 x 26) 0.050" (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
301
$0.00
D01-950
Bulk
Obsolete SIP 4 (1 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled -55°C ~ 125°C
294
$0.00
D01-950
Tube
Obsolete SIP 5 (1 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled -55°C ~ 125°C
395
$0.00
D01-950
Tube
Obsolete SIP 6 (1 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled -55°C ~ 125°C
580
$0.00
D01-950
Bulk
Obsolete SIP 7 (1 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled -55°C ~ 125°C
184
$0.00
D01-950
Tube
Obsolete SIP 8 (1 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled -55°C ~ 125°C
583
$0.00
D01-950
Tube
Obsolete SIP 9 (1 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled -55°C ~ 125°C
337
$0.00
D01-950
Tube
Obsolete SIP 10 (1 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled -55°C ~ 125°C