Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	WMS-100Z CONN IC DIP SOCKET 10POS GOLD On Shore Technology Inc.	545	$0.00		WMS	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame, Wash Away	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	-	-40°C ~ 105°C
	4842-6004-CP CONN IC DIP SOCKET 42POS TIN 3M	377	$0.00		4800	Bulk	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Tin	135.0µin (3.43µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	135.0µin (3.43µm)	Phosphor Bronze	Polyester, Glass Filled	-25°C ~ 85°C
	516-AG11D-ES DIP SOCKET T/H 16POS TE Connectivity AMP Connectors	378	$0.00		500	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	-	Copper Alloy	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester	-55°C ~ 105°C
	0473370001 CONN CAM SOCKET 24POS GOLD Molex	99	$0.00		47337	Tape & Reel (TR)	Obsolete	Camera Socket	24 (4 x 6)	0.035" (0.90mm)	Gold	12.0µin (0.30µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.035" (0.90mm)	Gold	Flash	Copper Alloy	Polyamide (PA), Nylon	-55°C ~ 85°C
	WMS-420Z CONN IC DIP SOCKET 42POS GOLD On Shore Technology Inc.	198	$0.00		WMS	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame, Wash Away	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	-	-40°C ~ 105°C
	WMS-480Z CONN IC DIP SOCKET 48POS GOLD On Shore Technology Inc.	387	$0.00		WMS	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame, Wash Away	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	-	-40°C ~ 105°C
	XR2C-2000-HSG CONN IC SOCKET 20POS Omron Electronics Inc-EMC Div	1,013	$0.13		XR2	Bulk	Obsolete	Housing	20 (1 x 20)	0.100" (2.54mm)	-	-	Beryllium Copper	-	Closed Frame	Solder	0.100" (2.54mm)	-	-	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
	XR2C-3200-HSG CONN IC SOCKET 32POS Omron Electronics Inc-EMC Div	531	$0.00		XR2	Bulk	Active	Housing	32 (1 x 32)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	-	-	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
	XR2E-3205 CONN SOCKET SIP 32POS GOLD Omron Electronics Inc-EMC Div	206	$0.00		XR2	Bulk	Obsolete	SIP	32 (1 x 32)	0.100" (2.54mm)	Gold	-	Beryllium Copper	-	-	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
	XR2D-2401-N CONN IC DIP SOCKET 24POS GOLD Omron Electronics Inc-EMC Div	243	$0.00		XR2	Bulk	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier	Solder	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
	XR2D-4001-N CONN IC DIP SOCKET 40POS GOLD Omron Electronics Inc-EMC Div	275	$0.00		XR2	Bulk	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier	Solder	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
	XR2E-3201-N CONN SOCKET SIP 32POS GOLD Omron Electronics Inc-EMC Div	561	$0.00		XR2	Bulk	Obsolete	SIP	32 (1 x 32)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier	Solder	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
	0479890112 CONN SOCKET PGA 989POS GOLD Molex	298	$0.00		47989	Tray	Obsolete	PGA	989 (35 x 36)	0.039" (1.00mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.039" (1.00mm)	-	-	-	Liquid Crystal Polymer (LCP)	-
	0479890122 CONN SOCKET PGA 989POS GOLD Molex	525	$0.00		47989	Tape & Reel (TR)	Obsolete	PGA	989 (35 x 36)	0.039" (1.00mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.039" (1.00mm)	-	-	-	Liquid Crystal Polymer (LCP)	-
	0479890132 CONN SOCKET PGA 989POS GOLD Molex	16	$0.00		47989	Tray	Obsolete	PGA	989 (35 x 36)	0.039" (1.00mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.039" (1.00mm)	-	-	-	Liquid Crystal Polymer (LCP)	-
	0479890142 CONN SOCKET PGA 989POS GOLD Molex	281	$0.00		47989	Tape & Reel (TR)	Obsolete	PGA	989 (35 x 36)	0.039" (1.00mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.039" (1.00mm)	-	-	-	Liquid Crystal Polymer (LCP)	-
	0479890212 CONN SOCKET PGA 989POS GOLD Molex	317	$0.00		47989	Tray	Obsolete	PGA	989 (35 x 36)	0.039" (1.00mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.039" (1.00mm)	-	-	-	Liquid Crystal Polymer (LCP)	-
	0479890222 CONN SOCKET PGA 989POS GOLD Molex	410	$0.00		47989	Tape & Reel (TR)	Obsolete	PGA	989 (35 x 36)	0.039" (1.00mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.039" (1.00mm)	-	-	-	Liquid Crystal Polymer (LCP)	-
	0479890232 CONN SOCKET PGA 989POS GOLD Molex	55	$0.00		47989	Tray	Obsolete	PGA	989 (35 x 36)	0.039" (1.00mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.039" (1.00mm)	-	-	-	Liquid Crystal Polymer (LCP)	-
	0479890242 CONN SOCKET PGA 988POS GOLD Molex	271	$0.00		47989	Tape & Reel (TR)	Obsolete	PGA	988 (35 x 36)	0.039" (1.00mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.039" (1.00mm)	-	-	-	Liquid Crystal Polymer (LCP)	-