Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	510-93-361-19-000001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	15	$48.93		510	Bulk	Active	PGA	361 (19 x 19)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-93-361-19-000003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	14	$49.44		510	Bulk	Active	PGA	361 (19 x 19)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-13-196-14-000001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	19	$49.75		510	Bulk	Active	PGA	196 (14 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-13-196-14-000002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	20	$48.62		510	Bulk	Active	PGA	196 (14 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-13-196-14-000003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	9	$48.74		510	Bulk	Active	PGA	196 (14 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	514-83-456M26-001148 CONN SOCKET BGA 456POS GOLD Preci-Dip	3	$51.42		514	Bulk	Active	BGA	456 (26 x 26)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	144-PGM12001-51 CONN SOCKET PGA GOLD Aries Electronics	19	$50.25		PGM	Bulk	Active	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	550-10-456M26-001152 BGA SOLDER TAIL Preci-Dip	20	$52.05		550	Bulk	Active	BGA	456 (26 x 26)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	510-91-441-21-000001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	13	$49.10		510	Bulk	Active	PGA	441 (21 x 21)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-441-21-000002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	9	$50.13		510	Bulk	Active	PGA	441 (21 x 21)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-441-21-000003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	11	$50.30		510	Bulk	Active	PGA	441 (21 x 21)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	514-87-576M30-001148 CONN SOCKET BGA 576POS GOLD Preci-Dip	17	$52.52		514	Bulk	Active	BGA	576 (30 x 30)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	558-10-432M31-001101 PGA SOLDER TAIL 1.27MM Preci-Dip	12	$52.65		558	Bulk	Active	PGA	432 (31 x 31)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	518-77-400M20-000106 CONN SOCKET PGA 400POS GOLD Preci-Dip	19	$51.83		518	Bulk	Active	PGA	400 (20 x 20)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	239-5605-01-0602 CONN ZIG-ZAG 39POS GOLD 3M	14	$50.17			Bulk	Active	Zig-Zag	39 (1 x 19, 1 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 150°C
	48-6508-21 CONN IC DIP SOCKET 48POS GOLD Aries Electronics	15	$50.09		508	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	48-6508-31 CONN IC DIP SOCKET 48POS GOLD Aries Electronics	17	$50.60		508	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	40-3574-16 CONN IC DIP SOCKET ZIF 40POS GLD Aries Electronics	4	$49.85		57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	40-6574-16 CONN IC DIP SOCKET ZIF 40POS TIN Aries Electronics	13	$50.05		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	40-3570-16 CONN IC DIP SOCKET ZIF 40POS Aries Electronics	15	$50.17		57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyphenylene Sulfide (PPS), Glass Filled	-