Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	514-83-480M29-001148 CONN SOCKET BGA 480POS GOLD Preci-Dip	8	$53.70		514	Bulk	Active	BGA	480 (29 x 29)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	28-6554-16 CONN IC DIP SOCKET ZIF 28POS Aries Electronics	3	$51.80		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	28-3551-16 CONN IC DIP SOCKET ZIF 28POS Aries Electronics	15	$51.84		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	28-3553-16 CONN IC DIP SOCKET ZIF 28POS Aries Electronics	2	$51.45		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	28-6551-16 CONN IC DIP SOCKET ZIF 28POS Aries Electronics	9	$51.67		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	28-6552-16 CONN IC DIP SOCKET ZIF 28POS Aries Electronics	3	$51.45		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	28-3554-16 CONN IC DIP SOCKET ZIF 24POS Aries Electronics	15	$51.56		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-55°C ~ 250°C
	550-10-478M26-131152 BGA SOLDER TAIL Preci-Dip	19	$54.73		550	Bulk	Active	BGA	478 (26 x 26)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Open Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	200-6310-9UN-1900 CONN SOCKET PGA ZIF 100POS GOLD 3M	15	$52.80		Textool™	Bulk	Obsolete	PGA, ZIF (ZIP)	100 (10 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES)	-55°C ~ 150°C
	550-10-480M29-001152 BGA SOLDER TAIL Preci-Dip	16	$55.01		550	Bulk	Active	BGA	480 (29 x 29)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	558-10-456M26-001101 PGA SOLDER TAIL 1.27MM Preci-Dip	5	$54.71		558	Bulk	Active	PGA	456 (26 x 26)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	518-77-420M26-001106 CONN SOCKET PGA 420POS GOLD Preci-Dip	7	$54.98		518	Bulk	Active	PGA	420 (26 x 26)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	510-93-400-20-000001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2	$52.78		510	Bulk	Active	PGA	400 (20 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-93-400-20-000002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3	$53.34		510	Bulk	Active	PGA	400 (20 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-93-400-20-000003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	9	$52.87		510	Bulk	Active	PGA	400 (20 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	132-PGM13038-50 CONN SOCKET PGA GOLD Aries Electronics	15	$52.00		PGM	-	Active	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	558-10-432M31-001104 BGA SURFACE MOUNT 1.27MM Preci-Dip	16	$54.96		558	Bulk	Active	BGA	432 (31 x 31)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	510-11-256-16-000001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	12	$53.46		510	Bulk	Active	PGA	256 (16 x 16)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-11-256-16-000002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	19	$53.21		510	Bulk	Active	PGA	256 (16 x 16)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	518-77-432M31-001105 CONN SOCKET PGA 432POS GOLD Preci-Dip	17	$54.90		518	Bulk	Active	PGA	432 (31 x 31)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C