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Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available		 UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
36-6556-40
36-6556-40
CONN IC DIP SOCKET 36POS GOLD
Aries Electronics
 16 $48.10
6556 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing36 (2 x 18)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder Cup0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyphenylene Sulfide (PPS), Glass Filled-
36-3570-16
36-3570-16
CONN IC DIP SOCKET ZIF 36POS
Aries Electronics
 13 $47.74
57 Bulk ActiveDIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing36 (2 x 18)0.100" (2.54mm)Nickel Boron50.0µin (1.27µm)Beryllium NickelThrough HoleClosed FrameSolder0.100" (2.54mm)Nickel Boron50.0µin (1.27µm)Beryllium NickelPolyphenylene Sulfide (PPS), Glass Filled-
36-3571-16
36-3571-16
CONN IC DIP SOCKET ZIF 36POS
Aries Electronics
 20 $48.08
57 Bulk ActiveDIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing36 (2 x 18)0.100" (2.54mm)Nickel Boron50.0µin (1.27µm)Beryllium NickelThrough HoleClosed FrameSolder0.100" (2.54mm)Nickel Boron50.0µin (1.27µm)Beryllium NickelPolyphenylene Sulfide (PPS), Glass Filled-
36-3572-16
36-3572-16
CONN IC DIP SOCKET ZIF 36POS
Aries Electronics
 15 $48.71
57 Bulk ActiveDIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing36 (2 x 18)0.100" (2.54mm)Nickel Boron50.0µin (1.27µm)Beryllium NickelThrough HoleClosed FrameSolder0.100" (2.54mm)Nickel Boron50.0µin (1.27µm)Beryllium NickelPolyphenylene Sulfide (PPS), Glass Filled-
36-3573-16
36-3573-16
CONN IC DIP SOCKET ZIF 36POS
Aries Electronics
 18 $47.44
57 Bulk ActiveDIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing36 (2 x 18)0.100" (2.54mm)Nickel Boron50.0µin (1.27µm)Beryllium NickelThrough HoleClosed FrameSolder0.100" (2.54mm)Nickel Boron50.0µin (1.27µm)Beryllium NickelPolyphenylene Sulfide (PPS), Glass Filled-
36-3574-16
36-3574-16
CONN IC DIP SOCKET ZIF 36POS TIN
Aries Electronics
 17 $48.47
57 Bulk ActiveDIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing36 (2 x 18)0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
36-3575-16
36-3575-16
CONN IC DIP SOCKET ZIF 36POS TIN
Aries Electronics
 8 $48.64
57 Bulk ActiveDIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing36 (2 x 18)0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
36-6571-16
36-6571-16
CONN IC DIP SOCKET ZIF 36POS
Aries Electronics
 3 $48.53
57 Bulk ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing36 (2 x 18)0.100" (2.54mm)Nickel Boron50.0µin (1.27µm)Beryllium NickelThrough HoleClosed FrameSolder0.100" (2.54mm)Nickel Boron50.0µin (1.27µm)Beryllium NickelPolyphenylene Sulfide (PPS), Glass Filled-
36-6573-16
36-6573-16
CONN IC DIP SOCKET ZIF 36POS TIN
Aries Electronics
 16 $47.67
57 Bulk ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing36 (2 x 18)0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
36-6574-16
36-6574-16
CONN IC DIP SOCKET ZIF 36POS TIN
Aries Electronics
 20 $48.52
57 Bulk ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing36 (2 x 18)0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
36-6575-16
36-6575-16
CONN IC DIP SOCKET ZIF 36POS TIN
Aries Electronics
 17 $47.52
57 Bulk ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing36 (2 x 18)0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
36-6572-16
36-6572-16
CONN IC DIP SOCKET ZIF 36POS TIN
Aries Electronics
 7 $48.67
57 Bulk ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing36 (2 x 18)0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
224-5809-50-0602
224-5809-50-0602
3M TEXTOOL ZIP STRIP SOCKETS 224
3M
 8 $48.85
Box Active---------------
232-2601-50-0602
232-2601-50-0602
IN-LINE ZIP STRIP POCKETS 32 CON
3M
 5 $48.35
- Active---------------
514-87-560M33-001148
514-87-560M33-001148
CONN SOCKET BGA 560POS GOLD
Preci-Dip
 21 $50.04
514 Bulk ActiveBGA560 (33 x 33)0.100" (2.54mm)GoldFlashBeryllium CopperSurface MountOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
558-10-420M26-001101
558-10-420M26-001101
PGA SOLDER TAIL 1.27MM
Preci-Dip
 6 $49.90
558 Bulk ActivePGA420 (26 x 26)0.050" (1.27mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.050" (1.27mm)Gold10.0µin (0.25µm)BrassFR4 Epoxy Glass-55°C ~ 125°C
518-77-388M26-001106
518-77-388M26-001106
CONN SOCKET PGA 388POS GOLD
Preci-Dip
 11 $50.38
518 Bulk ActivePGA388 (26 x 26)0.050" (1.27mm)GoldFlashBeryllium CopperSurface MountOpen FrameSolder0.050" (1.27mm)GoldFlashBrassFR4 Epoxy Glass-55°C ~ 125°C
558-10-400M20-000104
558-10-400M20-000104
BGA SURFACE MOUNT 1.27MM
Preci-Dip
 9 $50.89
558 Bulk ActiveBGA400 (20 x 20)0.050" (1.27mm)Gold10.0µin (0.25µm)BrassSurface MountClosed FrameSolder0.050" (1.27mm)Gold10.0µin (0.25µm)BrassFR4 Epoxy Glass-55°C ~ 125°C
518-77-400M20-000105
518-77-400M20-000105
CONN SOCKET PGA 400POS GOLD
Preci-Dip
 14 $51.76
518 Bulk ActivePGA400 (20 x 20)0.050" (1.27mm)GoldFlashBeryllium CopperThrough HoleClosed FrameSolder0.050" (1.27mm)GoldFlashBrassFR4 Epoxy Glass-55°C ~ 125°C
510-93-361-19-000002
510-93-361-19-000002
SOCKET SOLDERTAIL 361-PGA
Mill-Max Manufacturing Corp.
 12 $48.89
510 Bulk ActivePGA361 (19 x 19)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)--Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C