Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	517-83-401-19-101111 CONN SOCKET PGA 401POS GOLD Preci-Dip	3	$24.91		517	Bulk	Active	PGA	401 (19 x 19)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	30-6503-21 CONN IC DIP SOCKET 30POS GOLD Aries Electronics	13	$23.90		503	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	30 (2 x 15)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	30-6503-31 CONN IC DIP SOCKET 30POS GOLD Aries Electronics	40	$23.85		503	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	30 (2 x 15)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	518-77-192M16-001105 CONN SOCKET PGA 192POS GOLD Preci-Dip	4	$24.83		518	Bulk	Active	PGA	192 (16 x 16)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	117-43-642-61-005000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	42	$23.38			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	117-93-642-61-005000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	41	$23.71			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	48-6823-90 CONN IC DIP SOCKET 48POS GOLD Aries Electronics	8	$23.56		Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
	28-0511-11 CONN SOCKET SIP 28POS GOLD Aries Electronics	21	$23.30		511	Bulk	Active	SIP	28 (1 x 28)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	32-C182-20 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	24	$23.73		EJECT-A-DIP™	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	32-C182-30 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	9	$23.60		EJECT-A-DIP™	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	32-C212-20 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	16	$23.88		EJECT-A-DIP™	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	32-C212-30 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	13	$23.81		EJECT-A-DIP™	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	32-C300-20 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	3	$23.60		EJECT-A-DIP™	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	32-C300-30 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	10	$23.68		EJECT-A-DIP™	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	116-43-328-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	22	$23.58			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-43-428-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	21	$23.61			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-43-628-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	16	$23.64			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-328-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	24	$23.94			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-428-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	10	$23.76			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-628-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	8	$23.34			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-