Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	48-6573-10 CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics	8	$23.89		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	48-6575-10 CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics	4	$23.41		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	48-6574-10 CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics	30	$23.79		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	48-3574-10 CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics	20	$23.27		57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	48-6570-10 CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics	19	$23.52		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	110-43-950-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	42	$23.61			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-93-950-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	30	$23.56			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	APA-628-G-Q ADAPTER PLUG Samtec Inc.	3	$23.35		APA	Tube	Active	-	28 (2 x 14)	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
	510-91-073-11-042001 SOCKET SOLDERTAIL 73-PGA Mill-Max Manufacturing Corp.	28	$23.40		510	Bulk	Active	PGA	73 (11 x 11)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-073-11-061001 SOCKET SOLDERTAIL 73-PGA Mill-Max Manufacturing Corp.	32	$23.27		510	Bulk	Active	PGA	73 (11 x 11)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-073-11-042002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	15	$23.28		510	Bulk	Active	PGA	73 (11 x 11)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-073-11-042003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	13	$23.33		510	Bulk	Active	PGA	73 (11 x 11)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-073-11-061002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	17	$23.33		510	Bulk	Active	PGA	73 (11 x 11)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-073-11-061003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	19	$23.72		510	Bulk	Active	PGA	73 (11 x 11)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	116-43-324-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	38	$23.77			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-43-424-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	39	$23.43			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-43-624-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	4	$23.69			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-324-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2	$23.76			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-424-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	41	$23.65			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-624-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	31	$23.57			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-