Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	510-91-072-11-042003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	22	$23.85		510	Bulk	Active	PGA	72 (11 x 11)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-072-11-061002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	39	$23.51		510	Bulk	Active	PGA	72 (11 x 11)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-072-11-061003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	24	$23.82		510	Bulk	Active	PGA	72 (11 x 11)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	416-93-264-41-001000 SOCKET DUAL INLINE ELEVATD 64POS Mill-Max Manufacturing Corp.	15	$23.43		416	Tube	Active	DIP, 0.1" (2.54mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	-	-	Closed Frame	-	-	-	-	-	-	-
	558-10-192M16-001104 BGA SURFACE MOUNT 1.27MM Preci-Dip	17	$24.20		558	Bulk	Active	BGA	192 (16 x 16)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	510-93-049-07-000002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	16	$23.66		510	Bulk	Active	PGA	49 (7 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-93-049-07-000003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	40	$23.31		510	Bulk	Active	PGA	49 (7 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	111-43-648-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	23	$23.69			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	111-93-648-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	17	$23.32			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-43-642-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	24	$23.50			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-93-642-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	43	$23.79			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	115-43-650-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	5	$23.46			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	115-93-650-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	18	$23.52			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	48-3570-10 CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics	3	$23.59		57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	48-3571-10 CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics	3	$23.32		57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	48-3572-10 CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics	14	$23.43		57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	48-3573-10 CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics	22	$23.57		57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	48-3575-10 CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics	24	$23.92		57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	48-6571-10 CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics	39	$23.41		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	48-6572-10 CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics	2	$23.68		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-