Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	84-PGM13042-50 CONN SOCKET PGA GOLD Aries Electronics	44	$22.90		PGM	Bulk	Active	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	84-PGM13053-50 CONN SOCKET PGA GOLD Aries Electronics	2	$23.18		PGM	Bulk	Active	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	104-13-964-41-780000 CONN IC DIP SOCKET 64POS GOLD Mill-Max Manufacturing Corp.	18	$23.01		104	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Thermoplastic	-
	32-3551-11 CONN IC DIP SOCKET ZIF 32POS GLD Aries Electronics	44	$23.06		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	32-3552-11 CONN IC DIP SOCKET ZIF 32POS GLD Aries Electronics	21	$22.88		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	32-3553-11 CONN IC DIP SOCKET ZIF 32POS GLD Aries Electronics	24	$23.24		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	32-6551-11 CONN IC DIP SOCKET ZIF 32POS GLD Aries Electronics	35	$23.31		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	32-6552-11 CONN IC DIP SOCKET ZIF 32POS GLD Aries Electronics	13	$22.85		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	32-3554-11 CONN IC DIP SOCKET ZIF 32POS GLD Aries Electronics	10	$23.21		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	712-13-164-41-001000 SOCKET CARRIER SIP 64POS Mill-Max Manufacturing Corp.	9	$23.12		712	Tube	Active	SIP	64 (1 x 64)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	115-43-648-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	18	$22.86			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	115-93-648-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	35	$23.00			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	510-93-045-08-005001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	22	$23.29		510	Bulk	Active	PGA	45 (8 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-93-045-08-005002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	9	$22.76		510	Bulk	Active	PGA	45 (8 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-93-045-08-005003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	42	$23.34		510	Bulk	Active	PGA	45 (8 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	38-6621-30 CONN IC DIP SOCKET 38POS TIN Aries Electronics	18	$23.10		6621	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	38 (2 x 19)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole, Bottom Entry; Through Board	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	30-0511-11 CONN SOCKET SIP 30POS GOLD Aries Electronics	38	$23.01		511	Bulk	Active	SIP	30 (1 x 30)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	117-43-620-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	42	$23.08			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	123-13-652-41-001000 CONN IC DIP SOCKET 52POS GOLD Mill-Max Manufacturing Corp.	6	$23.32		123	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	127-93-664-41-003000 CONN IC DIP SOCKET 64POS GOLD Mill-Max Manufacturing Corp.	30	$23.45		127	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	64 (2 x 32)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.070" (1.78mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C