Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	110-93-652-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2	$22.71			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	126-93-652-41-003000 CONN IC DIP SOCKET 52POS GOLD Mill-Max Manufacturing Corp.	10	$23.14		126	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	126-93-952-41-003000 CONN IC DIP SOCKET 52POS GOLD Mill-Max Manufacturing Corp.	31	$22.57		126	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	126-43-652-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	20	$22.54		126	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	126-43-952-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	38	$22.87		126	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	111-43-642-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	9	$22.51			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	111-93-642-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	31	$23.14			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	28-6556-21 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	27	$22.96		6556	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
	28-6556-31 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	39	$22.55		6556	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
	116-43-324-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	11	$22.80			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-43-424-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	15	$22.92			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-43-624-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	39	$22.94			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-324-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	42	$22.97			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-424-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	44	$22.66			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-624-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	16	$22.73			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	510-41-064-10-051001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	15	$22.76		510	Bulk	Active	PGA	64 (10 x 10)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	77-PGM10015-11 CONN SOCKET PGA GOLD Aries Electronics	2	$22.83		PGM	Bulk	Active	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	121-11-964-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	19	$23.07		121	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	24-C182-21 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	35	$23.14		EJECT-A-DIP™	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	24-C182-31 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	4	$23.09		EJECT-A-DIP™	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C