Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	44-6575-10 CONN IC DIP SOCKET ZIF 44POS TIN Aries Electronics	24	$22.72		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	26-0511-11 CONN SOCKET SIP 26POS GOLD Aries Electronics	30	$22.87		511	Bulk	Active	SIP	26 (1 x 26)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	44-6571-10 CONN IC DIP SOCKET ZIF 44POS TIN Aries Electronics	33	$22.67		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	514-83-321-19-121154 CONN SOCKET PGA 321POS GOLD Preci-Dip	4	$23.98		514	Bulk	Active	PGA	321 (19 x 19)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	517-87-565-21-111111 CONN SOCKET PGA 565POS GOLD Preci-Dip	25	$23.92		517	Bulk	Active	PGA	565 (21 x 21)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	110-43-320-61-801000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	9	$22.85			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-43-318-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	6	$22.62			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-318-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	29	$22.85			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	612-43-964-41-003000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	44	$22.45		612	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	612-93-964-41-003000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	35	$22.47		612	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-13-432-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	6	$23.07			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-13-632-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	34	$22.99			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	117-43-430-61-005000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	21	$23.05			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	117-93-430-61-005000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	43	$22.55			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	37-0501-21 CONN SOCKET SIP 37POS GOLD Aries Electronics	40	$23.05		501	Bulk	Active	SIP	37 (1 x 37)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	37-0501-31 CONN SOCKET SIP 37POS GOLD Aries Electronics	26	$23.11		501	Bulk	Active	SIP	37 (1 x 37)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	110-43-316-61-801000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	37	$22.66			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-41-964-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	14	$22.50		116	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	116-91-964-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	15	$22.71		116	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-43-652-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	5	$22.75			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-