Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	24-6508-212 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	24	$22.95		508	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	24-6508-312 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	34	$23.51		508	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	510-91-059-11-001001 SOCKET SOLDERTAIL 59-PGA Mill-Max Manufacturing Corp.	31	$23.16		510	Bulk	Active	PGA	59 (11 x 11)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-059-11-001002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	14	$23.10		510	Bulk	Active	PGA	59 (11 x 11)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-059-11-001003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	21	$23.24		510	Bulk	Active	PGA	59 (11 x 11)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-43-318-61-801000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	42	$22.97			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-93-318-61-801000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	9	$23.43			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	117-43-316-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	37	$23.40			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-41-964-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	18	$23.34			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-91-964-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	36	$23.04			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-43-640-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	7	$23.11			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-93-640-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	39	$23.30			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	510-41-069-11-061001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	37	$23.55		510	Bulk	Active	PGA	69 (11 x 11)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	20-4508-21 CONN IC DIP SOCKET 20POS GOLD Aries Electronics	31	$23.03		508	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	20-4508-31 CONN IC DIP SOCKET 20POS GOLD Aries Electronics	35	$22.93		508	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	510-91-069-11-061001 SOCKET SOLDERTAIL 69-PGA Mill-Max Manufacturing Corp.	28	$22.91		510	Bulk	Active	PGA	69 (11 x 11)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-069-11-061002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	38	$23.51		510	Bulk	Active	PGA	69 (11 x 11)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-069-11-061003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	38	$22.98		510	Bulk	Active	PGA	69 (11 x 11)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	115-43-650-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	30	$23.16			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	115-93-650-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	6	$23.32			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-