Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	117-93-652-41-005000 CONN IC DIP SOCKET 52POS GOLD Mill-Max Manufacturing Corp.	17	$19.19		117	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.070" (1.78mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-91-318-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	22	$19.37			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	104-13-950-41-780000 CONN IC DIP SOCKET 50POS GOLD Mill-Max Manufacturing Corp.	8	$19.72		104	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Thermoplastic	-
	104-13-952-41-770000 CONN IC DIP SOCKET 52POS GOLD Mill-Max Manufacturing Corp.	32	$19.54		104	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Thermoplastic	-
	35-0501-20 CONN SOCKET SIP 35POS TIN Aries Electronics	22	$19.29		501	Bulk	Active	SIP	35 (1 x 35)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	35-0501-30 CONN SOCKET SIP 35POS TIN Aries Electronics	23	$19.47		501	Bulk	Active	SIP	35 (1 x 35)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	116-43-310-61-007000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	17	$19.48			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-310-61-007000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	44	$19.23			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	612-41-950-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	18	$19.58		612	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	612-91-950-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	38	$19.47		612	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	116-43-306-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	40	$19.22			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-306-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	6	$19.29			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-43-308-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	32	$19.35			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-93-308-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	49	$19.36			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-650-41-001000 CONN IC DIP SOCKET 50POS GOLD Mill-Max Manufacturing Corp.	21	$19.55		116	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	116-43-650-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	37	$19.48		116	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	612-93-950-41-001000 SOCKET CARRIER SLDRTL .900 50POS Mill-Max Manufacturing Corp.	42	$19.36		612	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	612-43-950-41-001000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	45	$19.44		612	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	115-44-320-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	4	$19.63			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	117-41-668-41-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	22	$19.64		117	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	68 (2 x 34)	0.070" (1.78mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C