Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	24-0503-31 CONN SOCKET SIP 24POS GOLD Aries Electronics	6	$19.14		0503	Bulk	Active	SIP	24 (1 x 24)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA), Nylon, Glass Filled	-
	124-93-642-41-002000 CONN IC DIP SOCKET 42POS GOLD Mill-Max Manufacturing Corp.	29	$19.38		124	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	411-13-264-41-001000 SOCKET DUAL IN-LINE SLDRTL 64POS Mill-Max Manufacturing Corp.	24	$19.71		411	Tube	Active	DIP, 0.1" (2.54mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	124-43-642-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	26	$19.62		124	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-41-420-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	6	$19.19			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-91-420-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	28	$19.27			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	550-10-256M16-000166 BGA PIN ADAPTER 1.27MM SMD Preci-Dip	12	$20.33		550	Bulk	Active	BGA	256 (16 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	550-10-256M20-001166 BGA PIN ADAPTER 1.27MM SMD Preci-Dip	23	$20.54		550	Bulk	Active	BGA	256 (20 x 20)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	48-6503-20 CONN IC DIP SOCKET 48POS GOLD Aries Electronics	19	$19.65		503	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	48-6503-30 CONN IC DIP SOCKET 48POS GOLD Aries Electronics	25	$19.56		503	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	122-11-648-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	48	$19.46		122	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	116-43-308-61-006000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	18	$19.61			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-308-61-006000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	39	$19.19			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-43-306-61-007000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2	$19.25			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-306-61-007000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	37	$19.42			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-43-210-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	8	$19.25			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-210-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	11	$19.68			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	126-93-636-41-003000 CONN IC DIP SOCKET 36POS GOLD Mill-Max Manufacturing Corp.	30	$19.37		126	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	126-43-636-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	46	$19.21		126	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	210815-4 CONN SOCKET PGA 223POS GOLD TE Connectivity AMP Connectors	34	$24.48			Tube	Obsolete	PGA	223 (18 x 18)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin-Lead	196.9µin (5.00µm)	Phosphor Bronze	Thermoplastic, Polyester, Glass Filled	-