Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	40-9513-11H CONN IC DIP SOCKET 40POS GOLD Aries Electronics	3	$19.13		Lo-PRO®file, 513	Bulk	Active	DIP, 0.9" (22.86mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	126-93-650-41-001000 CONN IC DIP SOCKET 50POS GOLD Mill-Max Manufacturing Corp.	33	$19.33		126	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	126-43-650-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	37	$19.35		126	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	116-43-306-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	27	$19.11			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-306-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	16	$19.21			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	550-10-255M16-001166 BGA PIN ADAPTER 1.27MM SMD Preci-Dip	47	$20.38		550	Bulk	Active	BGA	255 (16 x 16)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	121-13-648-41-001000 CONN IC DIP SOCKET 48POS GOLD Mill-Max Manufacturing Corp.	5	$19.56		121	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	115-44-316-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	4	$19.18			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	145-PGM15023-10 CONN SOCKET PGA GOLD Aries Electronics	22	$19.26		PGM	Bulk	Active	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	145-PGM15024-10 CONN SOCKET PGA GOLD Aries Electronics	5	$19.18		PGM	Bulk	Active	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	110-99-424-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	36	$19.23			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	123-93-318-41-801000 CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp.	15	$19.65		123	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	614-41-964-31-018000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	4	$19.60		614	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	614-91-964-31-018000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	32	$19.25		614	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	34-6501-21 CONN IC DIP SOCKET 34POS GOLD Aries Electronics	2	$19.25		501	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	34 (2 x 17)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	34-6501-31 CONN IC DIP SOCKET 34POS GOLD Aries Electronics	44	$19.25		501	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	34 (2 x 17)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	17-0511-11 CONN SOCKET SIP 17POS GOLD Aries Electronics	35	$19.21		511	Bulk	Active	SIP	17 (1 x 17)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	40-0501-20 CONN SOCKET SIP 40POS TIN Aries Electronics	47	$19.25		501	Bulk	Active	SIP	40 (1 x 40)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	40-0501-30 CONN SOCKET SIP 40POS TIN Aries Electronics	6	$19.61		501	Bulk	Active	SIP	40 (1 x 40)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	24-0503-21 CONN SOCKET SIP 24POS GOLD Aries Electronics	30	$19.13		0503	Bulk	Active	SIP	24 (1 x 24)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA), Nylon, Glass Filled	-