W25Q256JWFIQ TR
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Winbond Electronics W25Q256JWFIQ TR

Manufacturer No:
W25Q256JWFIQ TR
Manufacturer:
Winbond Electronics
Package:
Tape & Reel (TR)
Description:
SPIFLASH, 1.8V, 256M-BIT, 4KB UN
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The W25Q256JWFIQ TR is a 256M-bit serial flash memory chip produced by Winbond Electronics. This device is part of Winbond's W25Q series, known for its high performance and reliability in various electronic applications. The W25Q256JWFIQ TR features a quad SPI interface, enabling fast data transfer rates and efficient memory access. It is widely used in embedded systems, consumer electronics, and industrial applications where high-density non-volatile memory is required.

Key Specifications

ParameterValue
Part NumberW25Q256JWFIQ TR
ManufacturerWinbond Electronics
Memory Capacity256 Mbits (32 Mbytes)
InterfaceQuad SPI (QSPI)
Supply Voltage1.7V - 1.95V
Package / CaseSOIC-16, Tape & Reel (TR)
Operating Temperature-40°C to +85°C
Read SpeedUp to 133 MHz
Sector Size4 KB Uniform Sector
ECCN3A991B1A

Key Features

  • High-speed Quad SPI interface with up to 133 MHz clock frequency.
  • 256 Mbits (32 Mbytes) of non-volatile memory.
  • Low power consumption with a supply voltage range of 1.7V to 1.95V.
  • Uniform sector size of 4 KB for efficient data management.
  • Support for multiple commands including read, write, erase, and program.
  • Hardware and software write protection to ensure data integrity.
  • Operating temperature range from -40°C to +85°C, making it suitable for a wide range of applications.

Applications

The W25Q256JWFIQ TR is versatile and can be used in various applications, including:

  • Embedded systems requiring high-density non-volatile memory.
  • Consumer electronics such as set-top boxes, digital TVs, and gaming consoles.
  • Industrial control systems and automation devices.
  • Automotive electronics, including infotainment and navigation systems.
  • Internet of Things (IoT) devices and smart home appliances.

Q & A

  1. What is the memory capacity of the W25Q256JWFIQ TR?
    The W25Q256JWFIQ TR has a memory capacity of 256 Mbits (32 Mbytes).
  2. What type of interface does the W25Q256JWFIQ TR use?
    The W25Q256JWFIQ TR uses a Quad SPI (QSPI) interface.
  3. What is the supply voltage range for the W25Q256JWFIQ TR?
    The supply voltage range is 1.7V to 1.95V.
  4. What is the package type of the W25Q256JWFIQ TR?
    The package type is SOIC-16, and it is available in Tape & Reel (TR).
  5. What is the maximum read speed of the W25Q256JWFIQ TR?
    The maximum read speed is up to 133 MHz.
  6. What is the sector size of the W25Q256JWFIQ TR?
    The sector size is 4 KB uniform sector.
  7. Is the W25Q256JWFIQ TR suitable for industrial applications?
    Yes, it is suitable for industrial applications due to its operating temperature range from -40°C to +85°C.
  8. Does the W25Q256JWFIQ TR support write protection?
    Yes, it supports both hardware and software write protection.
  9. What are some common applications of the W25Q256JWFIQ TR?
    Common applications include embedded systems, consumer electronics, industrial control systems, automotive electronics, and IoT devices.
  10. Where can I find detailed specifications and datasheets for the W25Q256JWFIQ TR?
    Detailed specifications and datasheets can be found on official Winbond websites, as well as on distributor sites like Mouser, Digi-Key, and Avnet.

Product Attributes

Memory Type:Non-Volatile
Memory Format:Flash
Technology:FLASH - NOR
Memory Size:256Mb (32M x 8)
Memory Interface:SPI - Quad I/O
Clock Frequency:133 MHz
Write Cycle Time - Word, Page:5ms
Access Time:6 ns
Voltage - Supply:1.7V ~ 1.95V
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:16-SOIC (0.295", 7.50mm Width)
Supplier Device Package:16-SOIC
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Similar Products

Part Number W25Q256JWFIQ TR W25Q256JWPIQ TR W25Q256JWYIQ TR W25Q256JVFIQ TR W25Q256JWBIQ TR W25Q256JWCIQ TR W25Q256JWEIQ TR W25Q256JWFIM TR
Manufacturer Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics
Product Status Active Active Active Active Active Active Active Active
Memory Type Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile
Memory Format Flash Flash Flash Flash Flash Flash Flash Flash
Technology FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR
Memory Size 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8)
Memory Interface SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O, QPI, DTR
Clock Frequency 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz
Write Cycle Time - Word, Page 5ms 5ms 5ms 3ms 5ms 5ms 5ms 5ms
Access Time 6 ns 6 ns 6 ns - 6 ns 6 ns 6 ns 6 ns
Voltage - Supply 1.7V ~ 1.95V 1.7V ~ 1.95V 1.7V ~ 1.95V 2.7V ~ 3.6V 1.7V ~ 1.95V 1.7V ~ 1.95V 1.7V ~ 1.95V 1.7V ~ 1.95V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 16-SOIC (0.295", 7.50mm Width) 8-WDFN Exposed Pad 32-UFBGA, WLCSP 16-SOIC (0.295", 7.50mm Width) 24-TBGA 24-TBGA 8-WDFN Exposed Pad 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package 16-SOIC 8-WSON (6x5) 32-WLCSP (3.98x3.19) 16-SOIC 24-TFBGA (6x8) 24-TFBGA (6x8) 8-WSON (8x6) 16-SOIC

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