TMS5703137DZWTQQ1
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Texas Instruments TMS5703137DZWTQQ1

Manufacturer No:
TMS5703137DZWTQQ1
Manufacturer:
Texas Instruments
Package:
Tray
Description:
IC MCU 16/32B 3MB FLASH 337NFBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The TMS570LS3137DZWTQQ1, produced by Texas Instruments, is a high-performance automotive-grade microcontroller designed for safety-critical applications. This device integrates the ARM Cortex-R4F 32-bit RISC CPU, which offers efficient processing with up to 298 DMIPS at a clock speed of 180 MHz. The microcontroller features dual CPUs running in lockstep, ensuring high reliability and safety in real-time control applications. It also includes comprehensive safety features such as ECC on flash and RAM, built-in self-test (BIST) logic, and error signaling modules.

Key Specifications

Parameter Specification
CPU ARM Cortex-R4F 32-bit RISC CPU
Clock Speed Up to 180 MHz
DMIPS Up to 298 DMIPS
Flash Memory 3MB with ECC
RAM 256KB with ECC
ADCs Two 12-bit multibuffered ADCs (24 channels and 16 channels shared)
Timers Two Next Generation High-End Timers (N2HET) with 32 and 18 programmable channels
Communication Interfaces 10/100 Mbps Ethernet MAC (EMAC), FlexRay controller with two channels, three CAN controllers, LIN interface, I2C, SPI, and MibSPI
Supply Voltages Core: 1.2 V, I/O: 3.3 V, ADC: 3.0 to 5.25 V
Packages 144-Pin Quad Flatpack (PGE), 337-Ball Grid Array (ZWT)

Key Features

  • Dual CPUs running in lockstep for enhanced safety and reliability
  • ECC on flash and RAM interfaces for error correction and detection
  • Built-in self-test (BIST) logic for CPU and on-chip RAMs
  • Error signaling module with error pin
  • Voltage and clock monitoring
  • ARM Cortex-R4F 32-bit RISC CPU with FPU for single- and double-precision operations
  • 12-region memory protection unit (MPU)
  • Open architecture with third-party support
  • Multiple communication interfaces including Ethernet MAC, FlexRay, CAN, LIN, I2C, SPI, and MibSPI
  • Two 12-bit multibuffered ADC modules with up to 24 channels
  • Two Next Generation High-End Timers (N2HET) with advanced timing functions
  • Frequency-modulated phase-locked loop (FMPLL) with built-in slip detector
  • Trace and calibration capabilities including embedded trace macrocell (ETM-R4) and RAM trace port (RTP)

Applications

The TMS570LS3137DZWTQQ1 is designed for high-performance real-time control applications with safety-critical requirements, particularly in the automotive sector. It is suitable for:

  • Safety-critical automotive systems such as airbag control, anti-lock braking systems (ABS), and electronic stability control (ESC)
  • Industrial control systems requiring high reliability and real-time processing
  • Aerospace and defense applications where safety and performance are paramount
  • Medical devices that demand high precision and reliability

Q & A

  1. What is the primary CPU used in the TMS570LS3137DZWTQQ1?

    The primary CPU is the ARM Cortex-R4F 32-bit RISC CPU.

  2. What is the maximum clock speed of the TMS570LS3137DZWTQQ1?

    The maximum clock speed is up to 180 MHz.

  3. What type of memory protection does the TMS570LS3137DZWTQQ1 feature?

    The device features ECC on flash and RAM, as well as a 12-region memory protection unit (MPU).

  4. What communication interfaces are available on the TMS570LS3137DZWTQQ1?

    The device includes 10/100 Mbps Ethernet MAC, FlexRay controller, three CAN controllers, LIN interface, I2C, SPI, and MibSPI.

  5. What are the supply voltage requirements for the TMS570LS3137DZWTQQ1?

    The core supply voltage is 1.2 V, I/O supply voltage is 3.3 V, and ADC supply voltage ranges from 3.0 to 5.25 V.

  6. What types of timers are included in the TMS570LS3137DZWTQQ1?

    The device includes two Next Generation High-End Timers (N2HET) with 32 and 18 programmable channels.

  7. What is the purpose of the dual CPUs running in lockstep?

    The dual CPUs running in lockstep enhance safety and reliability by ensuring that both CPUs execute the same instructions in parallel.

  8. What safety features are integrated into the TMS570LS3137DZWTQQ1?

    The device includes ECC on flash and RAM, built-in self-test (BIST) logic, error signaling module with error pin, and voltage and clock monitoring.

  9. What are the available packages for the TMS570LS3137DZWTQQ1?

    The device is available in 144-Pin Quad Flatpack (PGE) and 337-Ball Grid Array (ZWT) packages.

  10. What is the significance of the FMPLL with built-in slip detector?

    The frequency-modulated phase-locked loop (FMPLL) with a built-in slip detector ensures stable clock generation and detects any slips in the clock signal.

  11. What trace and calibration capabilities are available on the TMS570LS3137DZWTQQ1?

    The device includes an embedded trace macrocell (ETM-R4) and a RAM trace port (RTP) for high-speed tracing and calibration.

Product Attributes

Core Processor:ARM® Cortex®-R4F
Core Size:16/32-Bit
Speed:180MHz
Connectivity:CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:DMA, POR, PWM, WDT
Number of I/O:120
Program Memory Size:3MB (3M x 8)
Program Memory Type:Flash
EEPROM Size:64K x 8
RAM Size:256K x 8
Voltage - Supply (Vcc/Vdd):1.14V ~ 3.6V
Data Converters:A/D 24x12b
Oscillator Type:External
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:337-LFBGA
Supplier Device Package:337-NFBGA (16x16)
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Similar Products

Part Number TMS5703137DZWTQQ1 TMS5703134DZWTQQ1 TMS5703135DZWTQQ1 TMS5703137BZWTQQ1 TMS5703137CZWTQQ1
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Active Active Obsolete Obsolete Obsolete
Core Processor ARM® Cortex®-R4F ARM® Cortex®-R4F ARM® Cortex®-R4F ARM® Cortex®-R4F ARM® Cortex®-R4F
Core Size 16/32-Bit 16/32-Bit 16/32-Bit 16/32-Bit 16/32-Bit
Speed 180MHz 180MHz 180MHz 180MHz 180MHz
Connectivity CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, MibSPI, SCI, SPI, UART/USART CANbus, EBI/EMI, I²C, LINbus, MibSPI, SCI, SPI, UART/USART CANbus, EBI/EMI, FlexRay, I²C, LINbus, MibSPI, SCI, SPI, UART/USART CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, MibSPI, SCI, SPI, UART/USART CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals DMA, POR, PWM, WDT DMA, POR, PWM, WDT DMA, POR, PWM, WDT DMA, POR, PWM, WDT DMA, POR, PWM, WDT
Number of I/O 120 120 120 120 120
Program Memory Size 3MB (3M x 8) 3MB (3M x 8) 3MB (3M x 8) 3MB (3M x 8) 3MB (3M x 8)
Program Memory Type Flash Flash Flash Flash Flash
EEPROM Size 64K x 8 64K x 8 64K x 8 64K x 8 64K x 8
RAM Size 256K x 8 256K x 8 256K x 8 256K x 8 256K x 8
Voltage - Supply (Vcc/Vdd) 1.14V ~ 3.6V 1.14V ~ 3.6V 1.14V ~ 3.6V 1.14V ~ 3.6V 1.14V ~ 3.6V
Data Converters A/D 24x12b A/D 24x12b A/D 24x12b A/D 24x12b A/D 24x12b
Oscillator Type External External External External External
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 337-LFBGA 337-LFBGA 337-LFBGA 337-LFBGA 337-LFBGA
Supplier Device Package 337-NFBGA (16x16) 337-NFBGA (16x16) 337-NFBGA (16x16) 337-NFBGA (16x16) 337-NFBGA (16x16)

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