TMS5703137CZWTQQ1
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Texas Instruments TMS5703137CZWTQQ1

Manufacturer No:
TMS5703137CZWTQQ1
Manufacturer:
Texas Instruments
Package:
Tray
Description:
IC MCU 16/32B 3MB FLASH 337NFBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The TMS570LS3137, produced by Texas Instruments, is a high-performance automotive-grade microcontroller designed for safety-critical applications. This 16/32-bit RISC Flash microcontroller integrates the ARM Cortex-R4F Floating-Point CPU, offering efficient processing with up to 298 DMIPS at 180 MHz. The device features dual CPUs running in lockstep, ensuring high reliability and safety in real-time control applications. It includes a robust set of communication and control peripherals, making it an ideal solution for automotive and industrial safety systems.

Key Specifications

Parameter Specification
CPU ARM Cortex-R4F 32-Bit RISC CPU
Performance Up to 180 MHz, 1.66 DMIPS/MHz
Memory 3MB Program Flash, 256KB Data RAM, 64KB Flash for Emulated EEPROM
Memory Protection ECC on Flash and RAM, Parity Protection on Peripheral Memories
Communication Interfaces 10/100 Mbps Ethernet MAC (EMAC), FlexRay Controller with 2 Channels, 3 CAN Controllers, LIN Interface, I2C, SPI, MibSPI
Timers Two Next Generation High-End Timer (N2HET) Modules
ADCs Two 12-Bit Multibuffered ADC Modules with up to 24 Channels
Supply Voltages Core Supply Voltage (VCC): 1.2 V Nominal, I/O Supply Voltage (VCCIO): 3.3 V Nominal, ADC Supply Voltage (VCCAD): 3.0 to 5.25 V
Packages 144-Pin Quad Flatpack (PGE), 337-Ball Grid Array (ZWT)

Key Features

  • Dual CPUs Running in Lockstep for High Reliability
  • Built-In Self-Test (BIST) for CPU and On-chip RAMs
  • Error Signaling Module With Error Pin
  • Voltage and Clock Monitoring
  • 12-Region Memory Protection Unit (MPU)
  • Open Architecture With Third-Party Support
  • Multiple Communication Interfaces: EMAC, FlexRay, CAN, LIN, I2C, SPI, MibSPI
  • Two Next Generation High-End Timer (N2HET) Modules
  • Two 12-Bit Multibuffered ADC Modules
  • Embedded Trace Macrocell (ETM-R4), RAM Trace Port (RTP), Data Modification Module (DMM), Parameter Overlay Module (POM)

Applications

The TMS570LS3137 is designed for high-performance real-time control applications with safety-critical requirements, particularly in the automotive and industrial sectors. It is suitable for:

  • Advanced Driver Assistance Systems (ADAS)
  • Automotive Safety Systems (e.g., airbag control, anti-lock braking systems)
  • Industrial Control Systems
  • Medical Devices Requiring High Reliability
  • Aerospace Applications

Q & A

  1. What is the primary CPU used in the TMS570LS3137?

    The TMS570LS3137 uses the ARM Cortex-R4F 32-Bit RISC CPU.

  2. What is the maximum system clock frequency of the TMS570LS3137?

    The maximum system clock frequency is up to 180 MHz.

  3. What type of memory protection does the TMS570LS3137 offer?

    The device offers ECC on Flash and RAM, as well as parity protection on peripheral memories.

  4. What communication interfaces are available on the TMS570LS3137?

    The device includes 10/100 Mbps Ethernet MAC (EMAC), FlexRay Controller with 2 Channels, 3 CAN Controllers, LIN Interface, I2C, SPI, and MibSPI.

  5. How many channels do the N2HET timers have?

    The N2HET1 has 32 programmable channels, and the N2HET2 has 18 programmable channels.

  6. What is the resolution of the ADC modules?

    The ADC modules are 12-bit multibuffered ADCs with up to 24 channels.

  7. What are the supply voltage requirements for the TMS570LS3137?

    The core supply voltage (VCC) is 1.2 V nominal, the I/O supply voltage (VCCIO) is 3.3 V nominal, and the ADC supply voltage (VCCAD) is 3.0 to 5.25 V.

  8. What packages are available for the TMS570LS3137?

    The device is available in 144-Pin Quad Flatpack (PGE) and 337-Ball Grid Array (ZWT) packages.

  9. Does the TMS570LS3137 support any specific safety protocols?

    Yes, it supports safety protocols such as dual CPUs in lockstep, BIST for CPU and RAM, and error signaling modules.

  10. What is the purpose of the Parameter Overlay Module (POM)?

    The POM allows dynamic calibration against production code of parameters and tables without rebuilding the code or halting the processor.

Product Attributes

Core Processor:ARM® Cortex®-R4F
Core Size:16/32-Bit
Speed:180MHz
Connectivity:CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:DMA, POR, PWM, WDT
Number of I/O:120
Program Memory Size:3MB (3M x 8)
Program Memory Type:Flash
EEPROM Size:64K x 8
RAM Size:256K x 8
Voltage - Supply (Vcc/Vdd):1.14V ~ 3.6V
Data Converters:A/D 24x12b
Oscillator Type:External
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:337-LFBGA
Supplier Device Package:337-NFBGA (16x16)
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Similar Products

Part Number TMS5703137CZWTQQ1 TMS5703137DZWTQQ1 TMS5703134CZWTQQ1 TMS5703135CZWTQQ1 TMS5703137BZWTQQ1
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Obsolete Active Obsolete Obsolete Obsolete
Core Processor ARM® Cortex®-R4F ARM® Cortex®-R4F ARM® Cortex®-R4F ARM® Cortex®-R4F ARM® Cortex®-R4F
Core Size 16/32-Bit 16/32-Bit 16/32-Bit 16/32-Bit 16/32-Bit
Speed 180MHz 180MHz 180MHz 180MHz 180MHz
Connectivity CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, MibSPI, SCI, SPI, UART/USART CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, MibSPI, SCI, SPI, UART/USART CANbus, EBI/EMI, I²C, LINbus, MibSPI, SCI, SPI, UART/USART CANbus, EBI/EMI, FlexRay, I²C, LINbus, MibSPI, SCI, SPI, UART/USART CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals DMA, POR, PWM, WDT DMA, POR, PWM, WDT DMA, POR, PWM, WDT DMA, POR, PWM, WDT DMA, POR, PWM, WDT
Number of I/O 120 120 120 120 120
Program Memory Size 3MB (3M x 8) 3MB (3M x 8) 3MB (3M x 8) 3MB (3M x 8) 3MB (3M x 8)
Program Memory Type Flash Flash Flash Flash Flash
EEPROM Size 64K x 8 64K x 8 64K x 8 64K x 8 64K x 8
RAM Size 256K x 8 256K x 8 256K x 8 256K x 8 256K x 8
Voltage - Supply (Vcc/Vdd) 1.14V ~ 3.6V 1.14V ~ 3.6V 1.14V ~ 3.6V 1.14V ~ 3.6V 1.14V ~ 3.6V
Data Converters A/D 24x12b A/D 24x12b A/D 24x12b A/D 24x12b A/D 24x12b
Oscillator Type External External External External External
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 337-LFBGA 337-LFBGA 337-LFBGA 337-LFBGA 337-LFBGA
Supplier Device Package 337-NFBGA (16x16) 337-NFBGA (16x16) 337-NFBGA (16x16) 337-NFBGA (16x16) 337-NFBGA (16x16)

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