MC9S08SH4CPJ
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NXP USA Inc. MC9S08SH4CPJ

Manufacturer No:
MC9S08SH4CPJ
Manufacturer:
NXP USA Inc.
Package:
Tube
Description:
IC MCU 8BIT 4KB FLASH 20DIP
Delivery:
Payment:
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Product Introduction

Overview

The MC9S08SH4CPJ is an 8-bit microcontroller from NXP USA Inc., part of the S08SH family. This microcontroller is designed to offer a low-end solution for applications operating in the 5-volt range. It features a 40-MHz HCS08 CPU and supports various power-saving modes, making it suitable for a wide range of embedded systems.

Key Specifications

Parameter Value
Package / Case 20-DIP (0.300", 7.62mm)
Mounting Type Through Hole
Speed 40MHz
Program Memory Size 4KB (4K x 8)
RAM Size 256 x 8
Clock Source Options Oscillator (XOSC), Internal Clock Source (ICS)
Power-Saving Modes Two very low power stop modes, Reduced power wait mode, Very low power real time interrupt

Key Features

  • 40-MHz HCS08 CPU: Provides high processing speed for various applications.
  • HC08 Instruction Set: Includes added BGND instruction for enhanced functionality.
  • On-Chip Memory: FLASH read/program/erase over full operating voltage and temperature, 256 bytes of RAM.
  • Power-Saving Modes: Two very low power stop modes, reduced power wait mode, and very low power real time interrupt.
  • Clock Source Options: Oscillator (XOSC) and Internal Clock Source (ICS) with precision trimming of internal reference.
  • Configurable I/O Pins: Hysteresis and configurable pull-up devices on all input pins; configurable slew rate and drive strength on all output pins.

Applications

The MC9S08SH4CPJ microcontroller is suitable for a variety of applications, including:

  • Industrial Control Systems: For controlling and monitoring industrial processes.
  • Consumer Electronics: In devices such as home appliances, remote controls, and other consumer products.
  • Automotive Systems: For various automotive applications requiring low power and high reliability.
  • Medical Devices: In medical equipment that requires precise control and low power consumption.

Q & A

  1. What is the maximum operating speed of the MC9S08SH4CPJ microcontroller?

    The maximum operating speed is 40MHz.

  2. What is the program memory size of the MC9S08SH4CPJ?

    The program memory size is 4KB (4K x 8).

  3. What are the power-saving modes available in the MC9S08SH4CPJ?

    The available power-saving modes include two very low power stop modes, reduced power wait mode, and very low power real time interrupt.

  4. What types of clock sources are supported by the MC9S08SH4CPJ?

    The microcontroller supports Oscillator (XOSC) and Internal Clock Source (ICS).

  5. What is the package type of the MC9S08SH4CPJ?

    The package type is 20-DIP (0.300", 7.62mm).

  6. How much RAM does the MC9S08SH4CPJ have?

    The MC9S08SH4CPJ has 256 bytes of RAM.

  7. What are some common applications of the MC9S08SH4CPJ?

    Common applications include industrial control systems, consumer electronics, automotive systems, and medical devices.

  8. Does the MC9S08SH4CPJ support configurable I/O pins?
  9. What is the significance of the HC08 instruction set in the MC9S08SH4CPJ?

    The HC08 instruction set includes added BGND instruction for enhanced functionality and compatibility with various applications.

  10. How does the MC9S08SH4CPJ manage power consumption?

    The microcontroller manages power consumption through its various power-saving modes, including stop modes, wait mode, and real-time interrupt modes.

Product Attributes

Core Processor:S08
Core Size:8-Bit
Speed:40MHz
Connectivity:I²C, LINbus, SCI, SPI
Peripherals:LVD, POR, PWM, WDT
Number of I/O:17
Program Memory Size:4KB (4K x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:256 x 8
Voltage - Supply (Vcc/Vdd):2.7V ~ 5.5V
Data Converters:A/D 12x10b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Through Hole
Package / Case:20-DIP (0.300", 7.62mm)
Supplier Device Package:20-DIP
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Similar Products

Part Number MC9S08SH4CPJ MC9S08SH4CTJ MC9S08SH4MPJ MC9S08SH4CWJ MC9S08SH8CPJ
Manufacturer NXP USA Inc. NXP USA Inc. Freescale Semiconductor NXP USA Inc. NXP USA Inc.
Product Status Obsolete Active Active Active Obsolete
Core Processor S08 S08 S08 S08 S08
Core Size 8-Bit 8-Bit 8-Bit 8-Bit 8-Bit
Speed 40MHz 40MHz 40MHz 40MHz 40MHz
Connectivity I²C, LINbus, SCI, SPI I²C, LINbus, SCI, SPI I²C, LINbus, SCI, SPI I²C, LINbus, SCI, SPI I²C, LINbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 17 17 17 17 17
Program Memory Size 4KB (4K x 8) 4KB (4K x 8) 4KB (4K x 8) 4KB (4K x 8) 8KB (8K x 8)
Program Memory Type Flash Flash Flash Flash Flash
EEPROM Size - - - - -
RAM Size 256 x 8 256 x 8 256 x 8 256 x 8 512 x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V 2.7V ~ 5.5V 2.7V ~ 5.5V 2.7V ~ 5.5V 2.7V ~ 5.5V
Data Converters A/D 12x10b A/D 12x10b A/D 12x10b A/D 12x10b A/D 12x10b
Oscillator Type Internal Internal Internal Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 125°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Through Hole Surface Mount Through Hole Surface Mount Through Hole
Package / Case 20-DIP (0.300", 7.62mm) 20-TSSOP (0.173", 4.40mm Width) 20-DIP (0.300", 7.62mm) 20-SOIC (0.295", 7.50mm Width) 20-DIP (0.300", 7.62mm)
Supplier Device Package 20-DIP 20-TSSOP 20-DIP 20-SOIC 20-DIP

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