TMS320C6711DGDP200
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Texas Instruments TMS320C6711DGDP200

Manufacturer No:
TMS320C6711DGDP200
Manufacturer:
Texas Instruments
Package:
Tray
Description:
IC DIG SIG PROCESSOR 272-BGA
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Payment:
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Product Introduction

Overview

The TMS320C6711DGDP200 is a high-performance floating-point Digital Signal Processor (DSP) from Texas Instruments, part of the TMS320C6000 DSP platform. This device is based on the advanced very-long-instruction-word (VLIW) architecture, making it an excellent choice for multichannel and multifunction applications. The C6711D offers significant performance with up to 1200 million floating-point operations per second (MFLOPS) at a clock rate of 200 MHz and up to 1500 MFLOPS at 250 MHz. It combines the operational flexibility of high-speed controllers with the numerical capability of array processors, making it a cost-effective solution for high-performance DSP programming challenges.

Key Specifications

Parameter Specification
Clock Rates 167 MHz, 200 MHz, 250 MHz
Instruction Cycle Time 6 ns (167 MHz), 5 ns (200 MHz), 4 ns (250 MHz)
Performance Up to 1200 MFLOPS (200 MHz), up to 1500 MFLOPS (250 MHz)
Functional Units Eight highly independent functional units: four floating-/fixed-point ALUs, two fixed-point ALUs, two floating-/fixed-point multipliers
General-Purpose Registers 32 registers of 32-bit word length
Cache Architecture Level 1 program cache (L1P): 32-Kbit direct mapped cache; Level 1 data cache (L1D): 32-Kbit 2-way set-associative cache; Level 2 memory/cache (L2): 512-Kbit unified mapped RAM/cache
Peripherals Two multichannel buffered serial ports (McBSPs), two general-purpose timers, host-port interface (HPI), glueless external memory interface (EMIF)
Package 272-Pin Ball Grid Array (BGA)
Process Technology 0.13 µm CMOS technology
Voltage Core: 1.20 V or 1.4 V; I/O: 3.3 V

Key Features

  • High-Performance VLIW Architecture: Supports up to eight 32-bit instructions per cycle.
  • Advanced Functional Units: Includes four floating-/fixed-point ALUs, two fixed-point ALUs, and two floating-/fixed-point multipliers.
  • Cache and Memory: Two-level cache-based architecture with 32-Kbit L1P and L1D caches and a 512-Kbit L2 unified mapped RAM/cache.
  • Peripheral Set: Features two McBSPs, two general-purpose timers, an HPI, and a glueless EMIF for interfacing with various memory types.
  • Development Tools: Includes a new C compiler, an assembly optimizer, and a Windows debugger interface for efficient programming and debugging.
  • Flexible Clock Generator: PLL-based clock generator module with prescaler, multiplier, and postscaler options.
  • GPIO Module: Dedicated general-purpose input/output module with 5 pins.
  • JTAG Compatibility: IEEE-1149.1 (JTAG) boundary-scan-compatible.

Applications

The TMS320C6711DGDP200 is suitable for a wide range of applications that require high-performance digital signal processing, including:

  • Telecommunications: Supports interfaces like T1/E1, MVIP, and SCSA framers.
  • Audio and Video Processing: Ideal for real-time audio and video processing due to its high MFLOPS performance.
  • Medical Imaging: Can be used in medical imaging applications requiring intensive numerical computations.
  • Industrial Automation: Suitable for control and monitoring systems in industrial environments.
  • Radar and Sonar Systems: Can handle complex signal processing tasks in radar and sonar systems.

Q & A

  1. What is the clock rate range of the TMS320C6711DGDP200?

    The clock rate range is 167 MHz, 200 MHz, and 250 MHz.

  2. What is the performance of the TMS320C6711DGDP200 in terms of MFLOPS?

    It offers up to 1200 MFLOPS at 200 MHz and up to 1500 MFLOPS at 250 MHz.

  3. How many functional units does the TMS320C6711DGDP200 have?

    It has eight highly independent functional units.

  4. What type of cache architecture does the TMS320C6711DGDP200 use?

    It uses a two-level cache-based architecture with L1P, L1D, and L2 caches.

  5. What peripherals are included in the TMS320C6711DGDP200?

    It includes two McBSPs, two general-purpose timers, an HPI, and a glueless EMIF.

  6. What is the package type of the TMS320C6711DGDP200?

    It is packaged in a 272-Pin Ball Grid Array (BGA).

  7. What is the process technology used in the TMS320C6711DGDP200?

    It uses 0.13 µm CMOS technology.

  8. What are the voltage requirements for the TMS320C6711DGDP200?

    The core voltage is 1.20 V or 1.4 V, and the I/O voltage is 3.3 V.

  9. Is the TMS320C6711DGDP200 JTAG compatible?

    Yes, it is IEEE-1149.1 (JTAG) boundary-scan-compatible.

  10. What development tools are available for the TMS320C6711DGDP200?

    It includes a new C compiler, an assembly optimizer, and a Windows debugger interface.

Product Attributes

Type:Floating Point
Interface:Host Interface, McBSP
Clock Rate:200MHz
Non-Volatile Memory:External
On-Chip RAM:72kB
Voltage - I/O:3.30V
Voltage - Core:1.26V
Operating Temperature:0°C ~ 90°C (TC)
Mounting Type:Surface Mount
Package / Case:272-BBGA
Supplier Device Package:272-BGA (27x27)
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Similar Products

Part Number TMS320C6711DGDP200 TMS320C6711DZDP200 TMS320C6711DGDP250 TMS320C6711CGDP200
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Active Active Active Obsolete
Type Floating Point Floating Point Floating Point Floating Point
Interface Host Interface, McBSP Host Interface, McBSP Host Interface, McBSP Host Interface, McBSP
Clock Rate 200MHz 200MHz 250MHz 200MHz
Non-Volatile Memory External External External External
On-Chip RAM 72kB 72kB 72kB 72kB
Voltage - I/O 3.30V 3.30V 3.30V 3.30V
Voltage - Core 1.26V 1.26V 1.26V 1.26V
Operating Temperature 0°C ~ 90°C (TC) 0°C ~ 90°C (TC) 0°C ~ 90°C (TC) 0°C ~ 90°C
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 272-BBGA 272-BBGA 272-BBGA 272-BBGA
Supplier Device Package 272-BGA (27x27) 272-BGA (27x27) 272-BGA (27x27) 272-BGA (27x27)

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