TMS320DM8147BCYE2
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Texas Instruments TMS320DM8147BCYE2

Manufacturer No:
TMS320DM8147BCYE2
Manufacturer:
Texas Instruments
Package:
Tray
Description:
IC DGTL MEDIA PROCESSR 684FCBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The TMS320DM8147BCYE2 is a highly integrated Digital Media System-on-Chip (DMSoC) from Texas Instruments, part of the DaVinci video processor family. This device is designed to meet the demanding processing needs of various multimedia applications, including high-definition video conferencing, rich user interfaces, and high-performance video and audio processing. It combines an ARM Cortex-A8 RISC CPU with a TI C674x VLIW floating-point DSP core and high-definition video and imaging coprocessors, making it a powerful solution for multimedia processing.

Key Specifications

SpecificationDetails
Processor CoresARM Cortex-A8 RISC CPU, TI C674x VLIW floating-point DSP core
Clock SpeedUp to 1 GHz
Cache and RAM32KB of L1D RAM/Cache, 256KB of L2 Unified Mapped RAM/Caches, 48KB of Boot ROM, 64KB of RAM
PeripheralsCAN, Ethernet, I2C, McASP, McBSP, MMC/SD/SDIO, SATA, SPI, UART, USB
Supply Voltages1.1V, 1.2V, 1.5V, 1.8V, 3.3V
Package Type684-FCBGA
Operating Temperature0 to 90°C
Graphics EngineSGX530 3D graphics engine
Video and Imaging CoprocessorHDVICP2 (High-Definition Video and Imaging Coprocessor 2)

Key Features

  • High-performance ARM Cortex-A8 RISC CPU with Neon extension for efficient processing of control functions.
  • TI C674x VLIW floating-point DSP core for high-performance video and audio processing.
  • HDVICP2 (High-Definition Video and Imaging Coprocessor 2) for off-loading video and imaging tasks from the DSP core.
  • SGX530 3D graphics engine for enhanced graphics performance.
  • A rich set of peripherals including CAN, Ethernet, I2C, McASP, McBSP, MMC/SD/SDIO, SATA, SPI, UART, and USB.
  • Support for various interfaces such as HDMI, PCI Express, and SATA.
  • Comprehensive development tools including C compilers, DSP assembly optimizer, and a Microsoft Windows debugger interface.

Applications

  • High-definition video conferencing and Skype endpoints.
  • Rich user interfaces and multimedia applications.
  • Video and audio processing in various devices such as set-top boxes, digital video recorders, and media players.
  • Industrial control and automation systems requiring high-performance processing.
  • Medical imaging and diagnostic equipment.

Q & A

  1. What is the TMS320DM8147BCYE2?
    The TMS320DM8147BCYE2 is a Digital Media System-on-Chip (DMSoC) from Texas Instruments, designed for high-performance multimedia processing.
  2. What processor cores does it include?
    It includes an ARM Cortex-A8 RISC CPU and a TI C674x VLIW floating-point DSP core.
  3. What is the clock speed of the processor?
    The processor can operate up to 1 GHz.
  4. What peripherals are supported by this device?
    The device supports CAN, Ethernet, I2C, McASP, McBSP, MMC/SD/SDIO, SATA, SPI, UART, and USB.
  5. What is the operating temperature range of the TMS320DM8147BCYE2?
    The operating temperature range is 0 to 90°C.
  6. Does it have a graphics engine?
    Yes, it includes an SGX530 3D graphics engine.
  7. What is the purpose of the HDVICP2?
    The HDVICP2 (High-Definition Video and Imaging Coprocessor 2) is used to off-load video and imaging tasks from the DSP core.
  8. What development tools are available for this device?
    Comprehensive development tools include C compilers, DSP assembly optimizer, and a Microsoft Windows debugger interface.
  9. What are some common applications of the TMS320DM8147BCYE2?
    Common applications include high-definition video conferencing, rich user interfaces, video and audio processing, industrial control, and medical imaging.
  10. What is the package type of the TMS320DM8147BCYE2?
    The package type is 684-FCBGA.

Product Attributes

Type:Digital Media System-on-Chip (DMSoC)
Interface:CAN, Ethernet, I²C, McASP, McBSP, MMC/SD/SDIO, SATA, SPI, UART, USB
Clock Rate:700MHz DSP, 1GHz ARM®
Non-Volatile Memory:ROM (48kB)
On-Chip RAM:1.08MB
Voltage - I/O:1.5V, 1.8V, 3.3V
Voltage - Core:1.1V, 1.2V, 1.35V
Operating Temperature:0°C ~ 90°C (TJ)
Mounting Type:Surface Mount
Package / Case:684-BFBGA, FCBGA
Supplier Device Package:684-FCBGA (23x23)
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Similar Products

Part Number TMS320DM8147BCYE2 TMS320DM8147SCYE2 TMS320DM8148BCYE2 TMS320DM8127BCYE2 TMS320DM8147BCYE0 TMS320DM8147BCYE1
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Obsolete Active Obsolete Obsolete Obsolete Obsolete
Type Digital Media System-on-Chip (DMSoC) Digital Media System-on-Chip (DMSoC) Digital Media System-on-Chip (DMSoC) Digital Media System-on-Chip (DMSoC) Digital Media System-on-Chip (DMSoC) Digital Media System-on-Chip (DMSoC)
Interface CAN, Ethernet, I²C, McASP, McBSP, MMC/SD/SDIO, SATA, SPI, UART, USB CAN, Ethernet, I²C, McASP, McBSP, MMC/SD/SDIO, SATA, SPI, UART, USB CAN, Ethernet, I²C, McASP, McBSP, MMC/SD/SDIO, SATA, SPI, UART, USB CAN, Ethernet, I²C, McASP, McBSP, MMC/SD, SPI, UART, USB CAN, Ethernet, I²C, McASP, McBSP, MMC/SD/SDIO, SATA, SPI, UART, USB CAN, Ethernet, I²C, McASP, McBSP, MMC/SD/SDIO, SATA, SPI, UART, USB
Clock Rate 700MHz DSP, 1GHz ARM® 700MHz DSP, 1GHz ARM® 700MHz DSP, 1GHz ARM® 600MHz DSP, 1GHz ARM® 600MHz DSP, 720MHz ARM® 700MHz DSP, 1GHz ARM®
Non-Volatile Memory ROM (48kB) ROM (48kB) ROM (48kB) ROM (48kB) ROM (48kB) ROM (48kB)
On-Chip RAM 1.08MB 1.08MB 1.08MB 832kB 1.08MB 1.08MB
Voltage - I/O 1.5V, 1.8V, 3.3V 1.5V, 1.8V, 3.3V 1.5V, 1.8V, 3.3V 1.5V, 1.8V, 3.3V 1.5V, 1.8V, 3.3V 1.5V, 1.8V, 3.3V
Voltage - Core 1.1V, 1.2V, 1.35V 1.1V, 1.2V, 1.35V 1.1V, 1.2V, 1.35V 1.15V 1.1V, 1.2V, 1.35V 1.1V, 1.2V, 1.35V
Operating Temperature 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 684-BFBGA, FCBGA 684-BFBGA, FCBGA 684-BFBGA, FCBGA 684-BFBGA, FCBGA 684-BFBGA, FCBGA 684-BFBGA, FCBGA
Supplier Device Package 684-FCBGA (23x23) 684-FCBGA (23x23) 684-FCBGA (23x23) 684-FCBGA (23x23) 684-FCBGA (23x23) 684-FCBGA (23x23)

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