TMS320C6670XCYPA2
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Texas Instruments TMS320C6670XCYPA2

Manufacturer No:
TMS320C6670XCYPA2
Manufacturer:
Texas Instruments
Package:
Tube
Description:
IC DSP FIX/FLOAT POINT 841FCBGA
Delivery:
Payment:
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Product Introduction

Overview

The TMS320C6670XCYPA2 is a high-performance, multicore digital signal processor (DSP) developed by Texas Instruments. This System-on-Chip (SoC) is designed for demanding real-time applications, offering advanced fixed-point and floating-point processing capabilities. The processor features a multicore architecture, enabling parallel data processing and real-time response, making it ideal for complex signal processing and data analysis tasks.

Key Specifications

Specification Value
Processor Type Digital Signal Processor (DSP)
Core Architecture Multicore (4 cores)
Clock Speed Up to 1.2 GHz
Processing Performance Up to 9600 MIPS (Million Instructions Per Second)
Package Type FCBGA (Flip Chip Ball Grid Array) - 841 pins
Operating Temperature -40°C to 100°C
Memory Interface DDR3, HyperLink, and other high-speed interfaces
Power Consumption Low power consumption with SmartReflex technology

Key Features

  • High-Performance Processing: The TMS320C6670XCYPA2 offers high processing performance with up to 1.2 GHz clock speed and 9600 MIPS, making it suitable for complex signal processing tasks.
  • Multicore Architecture: The processor features a multicore architecture with four cores, enabling parallel data processing and real-time response.
  • Advanced Memory Interfaces: Supports DDR3, HyperLink, and other high-speed memory interfaces for efficient data transfer.
  • Low Power Consumption: Equipped with SmartReflex technology to optimize power consumption while maintaining high performance.
  • Robust Peripheral Support: Includes a variety of peripherals such as UART, SPI, I2C, and more for comprehensive system integration.

Applications

  • Telecommunications: Ideal for high-speed wireless networks, base stations, and other telecommunications infrastructure.
  • Audio and Video Processing: Suitable for real-time audio and video processing applications, including codecs and transcoding.
  • Industrial Automation: Used in control systems, machine learning, and other industrial automation tasks requiring high processing power.
  • Automotive Systems: Applied in advanced driver-assistance systems (ADAS), autonomous vehicles, and other automotive applications.
  • Consumer Electronics: Found in various consumer electronics such as set-top boxes, digital TVs, and gaming consoles.

Q & A

  1. What is the TMS320C6670XCYPA2?

    The TMS320C6670XCYPA2 is a high-performance, multicore digital signal processor (DSP) developed by Texas Instruments.

  2. What is the clock speed of the TMS320C6670XCYPA2?

    The clock speed of the TMS320C6670XCYPA2 can go up to 1.2 GHz.

  3. How many cores does the TMS320C6670XCYPA2 have?

    The TMS320C6670XCYPA2 features a multicore architecture with four cores.

  4. What type of memory interfaces does the TMS320C6670XCYPA2 support?

    The processor supports DDR3, HyperLink, and other high-speed memory interfaces.

  5. What is the operating temperature range of the TMS320C6670XCYPA2?

    The operating temperature range is -40°C to 100°C.

  6. What are some common applications of the TMS320C6670XCYPA2?

    Common applications include telecommunications, audio and video processing, industrial automation, automotive systems, and consumer electronics.

  7. Does the TMS320C6670XCYPA2 support low power consumption?

    Yes, it is equipped with SmartReflex technology to optimize power consumption while maintaining high performance.

  8. What package type does the TMS320C6670XCYPA2 use?

    The processor is packaged in a Flip Chip Ball Grid Array (FCBGA) with 841 pins.

  9. What is the processing performance of the TMS320C6670XCYPA2?

    The processing performance is up to 9600 MIPS (Million Instructions Per Second).

  10. Is the TMS320C6670XCYPA2 suitable for real-time applications?

    Yes, it is designed for demanding real-time applications due to its multicore architecture and high processing performance.

Product Attributes

Type:Fixed/Floating Point
Interface:EBI/EMI, Ethernet MAC, PCIe, I²C, SPI, SRIO, UART
Clock Rate:1.2GHz
Non-Volatile Memory:ROM (128kB)
On-Chip RAM:6.25MB
Voltage - I/O:1.0V, 1.5V, 1.8V
Voltage - Core:1.00V
Operating Temperature:-40°C ~ 100°C (TC)
Mounting Type:Surface Mount
Package / Case:841-BFBGA, FCBGA
Supplier Device Package:841-FCBGA (24x24)
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Similar Products

Part Number TMS320C6670XCYPA2 TMS320C6670ACYPA2 TMS320C6670AXCYPA2 TMS320C6670CYPA2 TMS320C6670XCYPA
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Discontinued at Digi-Key Active Active Discontinued at Digi-Key Discontinued at Digi-Key
Type Fixed/Floating Point Fixed/Floating Point Fixed/Floating Point Fixed/Floating Point Fixed/Floating Point
Interface EBI/EMI, Ethernet MAC, PCIe, I²C, SPI, SRIO, UART EBI/EMI, Ethernet MAC, PCIe, I²C, SPI, SRIO, UART EBI/EMI, Ethernet MAC, PCIe, I²C, SPI, SRIO, UART EBI/EMI, Ethernet MAC, PCIe, I²C, SPI, SRIO, UART EBI/EMI, Ethernet MAC, PCIe, I²C, SPI, SRIO, UART
Clock Rate 1.2GHz 1.2GHz 1.2GHz 1.2GHz 1GHz
Non-Volatile Memory ROM (128kB) ROM (128kB) ROM (128kB) ROM (128kB) ROM (128kB)
On-Chip RAM 6.25MB 6.25MB 6.25MB 6.25MB 6.25MB
Voltage - I/O 1.0V, 1.5V, 1.8V 1.0V, 1.5V, 1.8V 1.0V, 1.5V, 1.8V 1.0V, 1.5V, 1.8V 1.0V, 1.5V, 1.8V
Voltage - Core 1.00V 1.00V 1.00V 1.00V 1.00V
Operating Temperature -40°C ~ 100°C (TC) -40°C ~ 100°C (TC) -40°C ~ 100°C (TC) -40°C ~ 100°C (TC) -40°C ~ 100°C (TC)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 841-BFBGA, FCBGA 841-BFBGA, FCBGA 841-BFBGA, FCBGA 841-BFBGA, FCBGA 841-BFBGA, FCBGA
Supplier Device Package 841-FCBGA (24x24) 841-FCBGA (24x24) 841-FCBGA (24x24) 841-FCBGA (24x24) 841-FCBGA (24x24)

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