STM32MP157FAC1
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STMicroelectronics STM32MP157FAC1

Manufacturer No:
STM32MP157FAC1
Manufacturer:
STMicroelectronics
Package:
Tray
Description:
MPU WITH ARM DUAL CORTEX-A7 800
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The STM32MP157FAC1 is a high-performance microprocessor unit (MPU) from STMicroelectronics, part of the STM32MP1 series. It features a heterogeneous architecture combining a dual-core Arm® Cortex®-A7 processing unit operating at up to 800 MHz and a Cortex®-M4 microcontroller core running at up to 209 MHz. This architecture is designed to provide rich performance in high-end applications while maintaining low power consumption. The device is equipped with a 3D graphics processing unit (GPU) and supports various display interfaces, including TFT and MIPI-DSI. It also includes advanced security features such as Secure Boot, TrustZone® peripherals, and cryptographic acceleration cells, making it suitable for applications requiring high security and performance.

Key Specifications

Parameter Specification
Processor Cores Dual-core Arm® Cortex®-A7 @ up to 800 MHz, Arm® Cortex®-M4 @ up to 209 MHz
Caches 32 Kbytes L1 instruction cache and 32 Kbytes L1 data cache for each Cortex-A7 core, 256 Kbytes unified L2 cache
GPU 3D GPU (Vivante® OpenGL® ES 2.0) @ up to 533 MHz
Memory External DDR memory up to 1 Gbyte (LPDDR2/LPDDR3/DDR3/DDR3L), 708 Kbytes internal SRAM
Display Interfaces TFT, MIPI-DSI
Communication Interfaces 2 x CAN FD, 10/100M or Gigabit Ethernet, 3 x USB 2.0 Host/OTG, 6 x I2C, 4 x UART + 4 x USART, 6 x SPI, 4 x SAI
Security Features Secure Boot, TrustZone® peripherals, cryptographic acceleration cells, active tamper detection
Power Management 1.71 V to 3.6 V I/Os supply, low-power modes (Sleep, Stop, Standby)
Junction Temperature -20°C to 105°C

Key Features

  • Heterogeneous Architecture: Combines dual-core Arm® Cortex®-A7 and single-core Arm® Cortex®-M4 for balanced performance and power efficiency.
  • Advanced Graphics: 3D GPU (Vivante® OpenGL® ES 2.0) for high-performance graphics processing.
  • Security: Secure Boot, TrustZone® peripherals, cryptographic acceleration cells, and active tamper detection for enhanced security.
  • Communication Interfaces: Multiple interfaces including CAN FD, Ethernet, USB, I2C, UART, USART, SPI, and SAI for versatile connectivity.
  • Power Management: Low-power modes (Sleep, Stop, Standby) and on-chip LDOs for efficient power consumption.
  • Memory and Storage: Support for external DDR memory up to 1 Gbyte and internal SRAM of 708 Kbytes.
  • Analog Peripherals: Includes ADCs, DACs, temperature sensor, and digital filters for sigma delta modulators.

Applications

  • Industrial Automation: Suitable for control systems, predictive maintenance, and edge gateway applications.
  • Consumer Electronics: Ideal for high-end wearables, smart home devices, and other consumer electronics requiring rich performance and low power consumption.
  • Automotive Systems: Can be used in automotive infotainment systems, driver assistance systems, and other automotive applications requiring advanced graphics and security.
  • Medical Devices: Applicable in medical devices that need high-performance processing, advanced graphics, and robust security features.
  • IoT Devices: Suitable for Internet of Things (IoT) devices that require balanced performance, low power consumption, and advanced security features.

Q & A

  1. What are the core components of the STM32MP157FAC1?

    The STM32MP157FAC1 features a dual-core Arm® Cortex®-A7 processing unit and a single-core Arm® Cortex®-M4 microcontroller core.

  2. What is the maximum frequency of the Cortex-A7 and Cortex-M4 cores?

    The Cortex-A7 cores operate at up to 800 MHz, and the Cortex-M4 core operates at up to 209 MHz.

  3. What type of GPU does the STM32MP157FAC1 include?

    The device includes a 3D GPU (Vivante® OpenGL® ES 2.0) running at up to 533 MHz.

  4. What are the key security features of the STM32MP157FAC1?

    The device features Secure Boot, TrustZone® peripherals, cryptographic acceleration cells, and active tamper detection.

  5. What types of memory does the STM32MP157FAC1 support?

    The device supports external DDR memory up to 1 Gbyte and has 708 Kbytes of internal SRAM.

  6. What communication interfaces are available on the STM32MP157FAC1?

    The device includes interfaces such as CAN FD, Ethernet, USB, I2C, UART, USART, SPI, and SAI.

  7. What are the power management features of the STM32MP157FAC1?

    The device includes low-power modes (Sleep, Stop, Standby) and on-chip LDOs for efficient power consumption.

  8. What is the operating temperature range of the STM32MP157FAC1?

    The operating temperature range is from -20°C to 105°C.

  9. What development tools are available for the STM32MP157FAC1?

    STMicroelectronics provides development kits such as the STM32MP157F-DK2, which includes an ST-LINK embedded debug tool and various connectors for development.

  10. What are some typical applications of the STM32MP157FAC1?

    The device is suitable for industrial automation, consumer electronics, automotive systems, medical devices, and IoT devices.

Product Attributes

Core Processor:ARM® Cortex®-A7
Number of Cores/Bus Width:2 Core, 32-Bit
Speed:209MHz, 800MHz
Co-Processors/DSP:ARM® Cortex®-M4
RAM Controllers:DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:Yes
Display & Interface Controllers:HDMI-CEC, LCD
Ethernet:10/100Mbps, GbE
SATA:- 
USB:USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage - I/O:2.5V, 3.3V
Operating Temperature:-20°C ~ 105°C (TJ)
Security Features:ARM TZ
Package / Case:361-TFBGA
Supplier Device Package:361-TFBGA (12x12)
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Similar Products

Part Number STM32MP157FAC1 STM32MP157FAD1 STM32MP151FAC1 STM32MP153FAC1 STM32MP157DAC1 STM32MP157FAA1 STM32MP157FAB1
Manufacturer STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Product Status Active Active Active Active Active Active Active
Core Processor ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7
Number of Cores/Bus Width 2 Core, 32-Bit 2 Core, 32-Bit 1 Core, 32-Bit 2 Core, 32-Bit 2 Core, 32-Bit 2 Core, 32-Bit 2 Core, 32-Bit
Speed 209MHz, 800MHz 209MHz, 800MHz 209MHz, 800MHz 209MHz, 800MHz 209MHz, 800MHz 209MHz, 800MHz 209MHz, 800MHz
Co-Processors/DSP ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4
RAM Controllers DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration Yes Yes Yes Yes Yes Yes Yes
Display & Interface Controllers HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD
Ethernet 10/100Mbps, GbE 10/100Mbps, GbE 10/100Mbps, GbE 10/100Mbps (1) 10/100Mbps, GbE 10/100Mbps, GbE 10/100Mbps, GbE
SATA - - - - - - -
USB USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage - I/O 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V
Operating Temperature -20°C ~ 105°C (TJ) -20°C ~ 105°C (TJ) -20°C ~ 105°C (TJ) -20°C ~ 105°C (TJ) -20°C ~ 105°C (TJ) -20°C ~ 105°C (TJ) -20°C ~ 105°C (TJ)
Security Features ARM TZ ARM TZ ARM TZ ARM TZ ARM TZ ARM TZ ARM TZ
Package / Case 361-TFBGA 257-TFBGA 361-TFBGA 361-TFBGA 361-TFBGA 448-LFBGA 354-LFBGA
Supplier Device Package 361-TFBGA (12x12) 257-TFBGA (10x10) 361-TFBGA (12x12) 361-TFBGA (12x12) 361-TFBGA (12x12) 448-LFBGA (18x18) 354-LFBGA (16x16)

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