STM32MP157DAC1
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STMicroelectronics STM32MP157DAC1

Manufacturer No:
STM32MP157DAC1
Manufacturer:
STMicroelectronics
Package:
Tray
Description:
MPU WITH ARM DUAL CORTEX-A7 800
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The STM32MP157DAC1, produced by STMicroelectronics, is a high-performance microprocessor part of the STM32MP1 series. It is based on a dual-core Arm Cortex-A7 32-bit RISC core operating at up to 800 MHz and a Cortex-M4 32-bit RISC core operating at up to 209 MHz. This device is designed to provide rich performance in high-end wearables and other low-power embedded and consumer applications. It incorporates advanced features such as a 3D graphics processing unit (GPU), MIPI DSI protocol support, and extensive memory and peripheral capabilities.

Key Specifications

Parameter Specification
Cortex-A7 Core 32-bit dual-core, up to 800 MHz, L1 32-Kbyte I / 32-Kbyte D for each core, 256-Kbyte unified level 2 cache
Cortex-M4 Core 32-bit, up to 209 MHz, FPU/MPU, up to 703 CoreMark
3D GPU Vivante OpenGL ES 2.0, up to 533 MHz, 26 Mtriangle/s, 133 Mpixel/s
External Memory Up to 1 Gbyte, LPDDR2/LPDDR3-1066 16/32-bit, DDR3/DDR3L-1066 16/32-bit
Internal SRAM 708 Kbytes: 256 Kbytes of AXI SYSRAM + 384 Kbytes of AHB SRAM + 64 Kbytes of AHB SRAM in Backup domain + 4 Kbytes of SRAM in Backup domain
Communication Interfaces 6 × I2C FM+, 4 × UART + 4 × USART, 6 × SPI, 4 × SAI, HDMI-CEC, MDIO Slave, 3 × SDMMC, 2 × CAN controllers, 2 × USB 2.0 high-speed Host + 1 × USB 2.0 full-speed OTG
Power Management 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os), POR, PDR, PVD, BOR, on-chip LDOs, backup regulator (~0.9 V)
Operating Temperature -20°C to 105°C
Package TFBGA 361 (12 × 12 mm), min Pitch 0.5mm

Key Features

  • Mainlined OpenSTLinux Distribution with expansion packages for additional components.
  • 3D graphics processing unit (Vivante OpenGL ES 2.0) for accelerated graphics.
  • MIPI DSI protocol support for high-resolution displays.
  • Arm NEON and Arm TrustZone for enhanced security and performance.
  • Extensive memory options including external DDR memory and internal SRAM.
  • Flexible external memory controller with up to 16-bit data bus.
  • Low-power modes: Sleep, Stop, and Standby with DDR memory retention in Standby mode.
  • High-speed communication interfaces including USB, CAN, SPI, and I2C.
  • Advanced analog peripherals including ADCs, DACs, and digital filters for sigma delta modulators.
  • Internal temperature sensors and backup regulator for power management.

Applications

  • High-end wearables and consumer electronics.
  • Industrial automation and control systems.
  • Medical devices requiring high performance and low power consumption.
  • Automotive systems, including infotainment and driver assistance.
  • IoT devices and smart home applications.
  • Industrial and commercial embedded systems.

Q & A

  1. What is the core architecture of the STM32MP157DAC1?

    The STM32MP157DAC1 features a dual-core Arm Cortex-A7 32-bit RISC core operating at up to 800 MHz and a Cortex-M4 32-bit RISC core operating at up to 209 MHz.

  2. What type of GPU does the STM32MP157DAC1 include?

    The device includes a Vivante OpenGL ES 2.0 3D GPU running at up to 533 MHz.

  3. What are the memory options for the STM32MP157DAC1?

    The device supports up to 1 Gbyte of external DDR memory and has 708 Kbytes of internal SRAM.

  4. What communication interfaces are available on the STM32MP157DAC1?

    The device includes various interfaces such as I2C, UART, USART, SPI, SAI, HDMI-CEC, MDIO Slave, SDMMC, CAN, and USB.

  5. What are the power management features of the STM32MP157DAC1?

    The device features low-power modes (Sleep, Stop, and Standby), on-chip LDOs, and a backup regulator (~0.9 V).

  6. What is the operating temperature range of the STM32MP157DAC1?

    The operating temperature range is -20°C to 105°C.

  7. What is the package type for the STM32MP157DAC1?

    The device is available in a TFBGA 361 package (12 × 12 mm) with a minimum pitch of 0.5mm.

  8. Does the STM32MP157DAC1 support any specific operating systems?

    Yes, it supports the mainlined OpenSTLinux Distribution with expansion packages for additional components.

  9. What are some of the key security features of the STM32MP157DAC1?

    The device includes Arm TrustZone, Cortex-M4 resources isolation, and active tamper detection.

  10. What are the typical applications for the STM32MP157DAC1?

    It is used in high-end wearables, industrial automation, medical devices, automotive systems, IoT devices, and other embedded systems.

Product Attributes

Core Processor:ARM® Cortex®-A7
Number of Cores/Bus Width:2 Core, 32-Bit
Speed:209MHz, 800MHz
Co-Processors/DSP:ARM® Cortex®-M4
RAM Controllers:DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:Yes
Display & Interface Controllers:HDMI-CEC, LCD
Ethernet:10/100Mbps, GbE
SATA:- 
USB:USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage - I/O:2.5V, 3.3V
Operating Temperature:-20°C ~ 105°C (TJ)
Security Features:ARM TZ
Package / Case:361-TFBGA
Supplier Device Package:361-TFBGA (12x12)
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Similar Products

Part Number STM32MP157DAC1 STM32MP157FAC1 STM32MP157DAD1 STM32MP151DAC1 STM32MP153DAC1 STM32MP157DAA1 STM32MP157DAB1
Manufacturer STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Product Status Active Active Active Active Active Active Active
Core Processor ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7
Number of Cores/Bus Width 2 Core, 32-Bit 2 Core, 32-Bit 2 Core, 32-Bit 1 Core, 32-Bit 2 Core, 32-Bit 2 Core, 32-Bit 2 Core, 32-Bit
Speed 209MHz, 800MHz 209MHz, 800MHz 209MHz, 800MHz 209MHz, 800MHz 209MHz, 800MHz 209MHz, 800MHz 209MHz, 800MHz
Co-Processors/DSP ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4
RAM Controllers DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration Yes Yes Yes Yes Yes Yes Yes
Display & Interface Controllers HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD
Ethernet 10/100Mbps, GbE 10/100Mbps, GbE 10/100Mbps, GbE 10/100Mbps, GbE 10/100Mbps (1) 10/100Mbps, GbE 10/100Mbps, GbE
SATA - - - - - - -
USB USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage - I/O 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V
Operating Temperature -20°C ~ 105°C (TJ) -20°C ~ 105°C (TJ) -20°C ~ 105°C (TJ) -20°C ~ 105°C (TJ) -20°C ~ 105°C (TJ) -20°C ~ 105°C (TJ) -20°C ~ 105°C (TJ)
Security Features ARM TZ ARM TZ ARM TZ ARM TZ ARM TZ ARM TZ ARM TZ
Package / Case 361-TFBGA 361-TFBGA 257-TFBGA 361-TFBGA 361-TFBGA 448-LFBGA 354-LFBGA
Supplier Device Package 361-TFBGA (12x12) 361-TFBGA (12x12) 257-TFBGA (10x10) 361-TFBGA (12x12) 361-TFBGA (12x12) 448-LFBGA (18x18) 354-LFBGA (16x16)

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