Overview
The STM32MP157DAD1, produced by STMicroelectronics, is a high-performance microprocessor unit (MPU) that integrates a dual-core Arm Cortex-A7 and a single-core Arm Cortex-M4. This device is designed for demanding applications requiring rich performance, low power consumption, and advanced security features. The Cortex-A7 cores operate at up to 800 MHz, while the Cortex-M4 core runs at up to 209 MHz. The MPU also includes a 3D graphics processing unit (GPU) and a wide range of peripherals, making it suitable for various embedded and consumer applications.
Key Specifications
| Parameter | Specification |
|---|---|
| Processor Cores | Dual-core Arm Cortex-A7 (up to 800 MHz) + Single-core Arm Cortex-M4 (up to 209 MHz) |
| Cache Memory | 32-Kbyte L1 instruction and data cache for each Cortex-A7 core, 256-Kbyte unified level 2 cache |
| Internal SRAM | 708 Kbytes (256 Kbytes AXI SYSRAM + 384 Kbytes AHB SRAM + 64 Kbytes AHB SRAM in Backup domain + 4 Kbytes SRAM in Backup domain) |
| External Memory | Up to 1 Gbyte LPDDR2/LPDDR3-1066 or DDR3/DDR3L-1066, 16/32-bit |
| Graphics Processing Unit (GPU) | Vivante OpenGL ES 2.0, up to 533 MHz, 26 Mtriangle/s, 133 Mpixel/s |
| Communication Interfaces | 6 x I2C, 4 x UART + 4 x USART, 6 x SPI, 4 x SAI, 2 x CAN, 2 x USB 2.0, 10/100M or Gigabit Ethernet |
| Power Management | 1.71 V to 3.6 V I/Os supply, POR, PDR, PVD, BOR, on-chip LDOs, backup regulator (~0.9 V) |
| Low-Power Modes | Sleep, Stop, Standby; total current consumption down to 2 µA in Standby mode |
| Package Options | TFBGA 257 (10 x 10 mm), LFBGA 448 (18 x 18 mm), LFBGA 354 (16 x 16 mm), TFBGA 361 (12 x 12 mm) |
Key Features
- Dual-core Arm Cortex-A7 with NEON and TrustZone support
- Arm Cortex-M4 with FPU and MPU, supporting DSP instructions
- 3D GPU (Vivante OpenGL ES 2.0) for high-performance graphics
- Extensive range of communication peripherals (I2C, UART, USART, SPI, SAI, CAN, USB, Ethernet)
- Advanced security features including TrustZone, active tamper, and Cortex-M4 resources isolation
- Low-power modes and low-power consumption (down to 2 µA in Standby mode)
- Internal temperature sensors and backup regulator
- High-speed interconnect matrices (64-bit AXI, 32-bit AHB)
- Multiple DMA controllers and high-speed general-purpose master DMA
Applications
- High-end wearables and consumer electronics
- Industrial automation and control systems
- Medical devices requiring advanced graphics and low power consumption
- Automotive systems, including infotainment and driver assistance
- IoT devices with complex processing and communication requirements
Q & A
- What are the core components of the STM32MP157DAD1?
The STM32MP157DAD1 features a dual-core Arm Cortex-A7 and a single-core Arm Cortex-M4, along with a 3D GPU.
- What is the maximum operating frequency of the Cortex-A7 cores?
The Cortex-A7 cores operate at up to 800 MHz.
- What types of external memory does the STM32MP157DAD1 support?
The device supports up to 1 Gbyte of LPDDR2/LPDDR3-1066 or DDR3/DDR3L-1066, with 16/32-bit data bus.
- What are the key security features of the STM32MP157DAD1?
The device includes TrustZone, active tamper, and Cortex-M4 resources isolation for enhanced security.
- What are the low-power modes available on the STM32MP157DAD1?
The device supports Sleep, Stop, and Standby modes, with total current consumption down to 2 µA in Standby mode.
- What communication interfaces are available on the STM32MP157DAD1?
The device includes I2C, UART, USART, SPI, SAI, CAN, USB, and Ethernet interfaces.
- What is the maximum resolution of the ADCs on the STM32MP157DAD1?
The ADCs have a maximum resolution of 16 bits, with different sampling rates depending on the resolution.
- Does the STM32MP157DAD1 support Gigabit Ethernet?
Yes, the device supports 10/100M or Gigabit Ethernet.
- What are the package options for the STM32MP157DAD1?
The device is available in TFBGA 257, LFBGA 448, LFBGA 354, and TFBGA 361 packages.
- What is the operating temperature range for the STM32MP157DAD1?
The device operates within a temperature range that can be specified based on the specific package and application requirements.
