STM32MP157DAD1
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STMicroelectronics STM32MP157DAD1

Manufacturer No:
STM32MP157DAD1
Manufacturer:
STMicroelectronics
Package:
Tray
Description:
MPU WITH ARM DUAL CORTEX-A7 800
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The STM32MP157DAD1, produced by STMicroelectronics, is a high-performance microprocessor unit (MPU) that integrates a dual-core Arm Cortex-A7 and a single-core Arm Cortex-M4. This device is designed for demanding applications requiring rich performance, low power consumption, and advanced security features. The Cortex-A7 cores operate at up to 800 MHz, while the Cortex-M4 core runs at up to 209 MHz. The MPU also includes a 3D graphics processing unit (GPU) and a wide range of peripherals, making it suitable for various embedded and consumer applications.

Key Specifications

Parameter Specification
Processor Cores Dual-core Arm Cortex-A7 (up to 800 MHz) + Single-core Arm Cortex-M4 (up to 209 MHz)
Cache Memory 32-Kbyte L1 instruction and data cache for each Cortex-A7 core, 256-Kbyte unified level 2 cache
Internal SRAM 708 Kbytes (256 Kbytes AXI SYSRAM + 384 Kbytes AHB SRAM + 64 Kbytes AHB SRAM in Backup domain + 4 Kbytes SRAM in Backup domain)
External Memory Up to 1 Gbyte LPDDR2/LPDDR3-1066 or DDR3/DDR3L-1066, 16/32-bit
Graphics Processing Unit (GPU) Vivante OpenGL ES 2.0, up to 533 MHz, 26 Mtriangle/s, 133 Mpixel/s
Communication Interfaces 6 x I2C, 4 x UART + 4 x USART, 6 x SPI, 4 x SAI, 2 x CAN, 2 x USB 2.0, 10/100M or Gigabit Ethernet
Power Management 1.71 V to 3.6 V I/Os supply, POR, PDR, PVD, BOR, on-chip LDOs, backup regulator (~0.9 V)
Low-Power Modes Sleep, Stop, Standby; total current consumption down to 2 µA in Standby mode
Package Options TFBGA 257 (10 x 10 mm), LFBGA 448 (18 x 18 mm), LFBGA 354 (16 x 16 mm), TFBGA 361 (12 x 12 mm)

Key Features

  • Dual-core Arm Cortex-A7 with NEON and TrustZone support
  • Arm Cortex-M4 with FPU and MPU, supporting DSP instructions
  • 3D GPU (Vivante OpenGL ES 2.0) for high-performance graphics
  • Extensive range of communication peripherals (I2C, UART, USART, SPI, SAI, CAN, USB, Ethernet)
  • Advanced security features including TrustZone, active tamper, and Cortex-M4 resources isolation
  • Low-power modes and low-power consumption (down to 2 µA in Standby mode)
  • Internal temperature sensors and backup regulator
  • High-speed interconnect matrices (64-bit AXI, 32-bit AHB)
  • Multiple DMA controllers and high-speed general-purpose master DMA

Applications

  • High-end wearables and consumer electronics
  • Industrial automation and control systems
  • Medical devices requiring advanced graphics and low power consumption
  • Automotive systems, including infotainment and driver assistance
  • IoT devices with complex processing and communication requirements

Q & A

  1. What are the core components of the STM32MP157DAD1?

    The STM32MP157DAD1 features a dual-core Arm Cortex-A7 and a single-core Arm Cortex-M4, along with a 3D GPU.

  2. What is the maximum operating frequency of the Cortex-A7 cores?

    The Cortex-A7 cores operate at up to 800 MHz.

  3. What types of external memory does the STM32MP157DAD1 support?

    The device supports up to 1 Gbyte of LPDDR2/LPDDR3-1066 or DDR3/DDR3L-1066, with 16/32-bit data bus.

  4. What are the key security features of the STM32MP157DAD1?

    The device includes TrustZone, active tamper, and Cortex-M4 resources isolation for enhanced security.

  5. What are the low-power modes available on the STM32MP157DAD1?

    The device supports Sleep, Stop, and Standby modes, with total current consumption down to 2 µA in Standby mode.

  6. What communication interfaces are available on the STM32MP157DAD1?

    The device includes I2C, UART, USART, SPI, SAI, CAN, USB, and Ethernet interfaces.

  7. What is the maximum resolution of the ADCs on the STM32MP157DAD1?

    The ADCs have a maximum resolution of 16 bits, with different sampling rates depending on the resolution.

  8. Does the STM32MP157DAD1 support Gigabit Ethernet?

    Yes, the device supports 10/100M or Gigabit Ethernet.

  9. What are the package options for the STM32MP157DAD1?

    The device is available in TFBGA 257, LFBGA 448, LFBGA 354, and TFBGA 361 packages.

  10. What is the operating temperature range for the STM32MP157DAD1?

    The device operates within a temperature range that can be specified based on the specific package and application requirements.

Product Attributes

Core Processor:ARM® Cortex®-A7
Number of Cores/Bus Width:2 Core, 32-Bit
Speed:209MHz, 800MHz
Co-Processors/DSP:ARM® Cortex®-M4
RAM Controllers:DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:Yes
Display & Interface Controllers:HDMI-CEC, LCD
Ethernet:10/100Mbps, GbE
SATA:- 
USB:USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage - I/O:2.5V, 3.3V
Operating Temperature:-20°C ~ 105°C (TJ)
Security Features:ARM TZ
Package / Case:257-TFBGA
Supplier Device Package:257-TFBGA (10x10)
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Similar Products

Part Number STM32MP157DAD1 STM32MP157FAD1 STM32MP151DAD1 STM32MP153DAD1 STM32MP157DAA1 STM32MP157DAB1 STM32MP157DAC1
Manufacturer STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Product Status Active Active Active Active Active Active Active
Core Processor ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7
Number of Cores/Bus Width 2 Core, 32-Bit 2 Core, 32-Bit 1 Core, 32-Bit 2 Core, 32-Bit 2 Core, 32-Bit 2 Core, 32-Bit 2 Core, 32-Bit
Speed 209MHz, 800MHz 209MHz, 800MHz 209MHz, 800MHz 209MHz, 800MHz 209MHz, 800MHz 209MHz, 800MHz 209MHz, 800MHz
Co-Processors/DSP ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4
RAM Controllers DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration Yes Yes Yes Yes Yes Yes Yes
Display & Interface Controllers HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD
Ethernet 10/100Mbps, GbE 10/100Mbps, GbE 10/100Mbps (1) 10/100Mbps (1) 10/100Mbps, GbE 10/100Mbps, GbE 10/100Mbps, GbE
SATA - - - - - - -
USB USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage - I/O 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V
Operating Temperature -20°C ~ 105°C (TJ) -20°C ~ 105°C (TJ) -20°C ~ 105°C (TJ) -20°C ~ 105°C (TJ) -20°C ~ 105°C (TJ) -20°C ~ 105°C (TJ) -20°C ~ 105°C (TJ)
Security Features ARM TZ ARM TZ ARM TZ ARM TZ ARM TZ ARM TZ ARM TZ
Package / Case 257-TFBGA 257-TFBGA 257-TFBGA 257-TFBGA 448-LFBGA 354-LFBGA 361-TFBGA
Supplier Device Package 257-TFBGA (10x10) 257-TFBGA (10x10) 257-TFBGA (10x10) 257-TFBGA (10x10) 448-LFBGA (18x18) 354-LFBGA (16x16) 361-TFBGA (12x12)

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