Overview
The BALF-SPI2-02D3 is an ultra-miniature balun produced by STMicroelectronics, designed to optimize RF performance in sub-GHz wireless applications. This component utilizes STMicroelectronics' IPD (Integrated Passive Device) technology on a non-conductive glass substrate, which enhances RF integration and system performance. It is specifically tailored for use with ST's S2-LP sub-GHz RF transceiver, operating within the 433-470 MHz frequency range.
Key Specifications
Parameter | Value | Description |
---|---|---|
Frequency Range | 433-470 MHz | Operating frequency range of the balun |
Package Type | UFBGA-6 | Ultra Fine Pitch Ball Grid Array package |
Size | 2.1 mm x 1.55 mm | Physical dimensions of the component |
Integrated Filter | Yes | Includes an integrated harmonic filter |
Input Impedance | 50 Ω nominal | Nominal input impedance of the balun |
Substrate | Non-conductive glass | Material used for the substrate |
Key Features
- Ultra-miniature design: Compact size of 2.1 mm x 1.55 mm, making it ideal for space-constrained applications.
- Integrated harmonic filter: Reduces harmonic emissions and aids in compliance with major EMC regulations like CCC, FCC, ETSI, and ARIB.
- Optimized RF performance: Uses STMicroelectronics' IPD technology on a non-conductive glass substrate to enhance RF integration and system performance.
- Matching network: Includes a matching network to optimize impedance matching and RF power transmission.
- Low insertion loss and high linearity: Ensures efficient and reliable RF signal transmission.
Applications
- Sub-GHz wireless applications: Specifically designed for use with ST's S2-LP sub-GHz RF transceiver.
- ISM Radio SubGHz: Suitable for Industrial, Scientific, and Medical (ISM) radio applications in the sub-GHz frequency range.
- Sigfox, ZigBee, Bluetooth Low Energy, LoRa, and 802.15.4 OpenThread: Can be used in various wireless communication protocols and standards.
- Human Machine Interface (HMI) and WM-BUS: Applicable in HMI and wireless metering bus (WM-BUS) systems).
Q & A
- What is the BALF-SPI2-02D3 used for?
The BALF-SPI2-02D3 is used as a balun to transform a balanced RF signal to an unbalanced signal, specifically designed for ST's S2-LP sub-GHz RF transceiver).
- What is the frequency range of the BALF-SPI2-02D3?
The frequency range of the BALF-SPI2-02D3 is 433-470 MHz).
- What type of package does the BALF-SPI2-02D3 use?
The BALF-SPI2-02D3 uses a UFBGA-6 (Ultra Fine Pitch Ball Grid Array) package).
- Does the BALF-SPI2-02D3 include an integrated harmonic filter?
Yes, the BALF-SPI2-02D3 includes an integrated harmonic filter to reduce harmonic emissions and comply with major EMC regulations).
- What is the size of the BALF-SPI2-02D3?
The physical dimensions of the BALF-SPI2-02D3 are 2.1 mm x 1.55 mm).
- What substrate material is used in the BALF-SPI2-02D3?
The BALF-SPI2-02D3 uses a non-conductive glass substrate).
- What are some common applications of the BALF-SPI2-02D3?
Common applications include sub-GHz wireless, ISM Radio SubGHz, Sigfox, ZigBee, Bluetooth Low Energy, LoRa, and 802.15.4 OpenThread).
- How does the BALF-SPI2-02D3 optimize RF performance?
The BALF-SPI2-02D3 optimizes RF performance through STMicroelectronics' IPD technology on a non-conductive glass substrate, which enhances RF integration and system performance).
- Does the BALF-SPI2-02D3 simplify RF design?
Yes, the BALF-SPI2-02D3 simplifies RF design by integrating matching networks and harmonic filters, reducing the complexity of RFIC-to-antenna matching networks).
- What are the benefits of using STMicroelectronics' IPD technology in the BALF-SPI2-02D3?
The benefits include higher system integration, improved reliability, and a significant reduction in the bill-of-materials compared to discrete solutions).