Overview
The STMicroelectronics BALF-NRF01D3 is an ultraminiature balun designed to optimize RF performance. It integrates a matching network on a monolithic glass substrate, specifically tailored for the nRF51822-QFAA/QFAB and nRF51422-QFAA/QFAB RF transceivers from Nordic Semiconductor. This component utilizes STMicroelectronics' IPD (Integrated Passive Device) technology on a non-conductive glass substrate, enhancing RF performance and reducing the complexity of RFIC-to-antenna matching networks.
Key Specifications
| Parameter | Value | Unit | Min. | Typ. | Max. |
|---|---|---|---|---|---|
| Operating Temperature | -40 to 105 | °C | -40 | - | 105 |
| Input Power (RFIN) | 20 | dBm | - | - | 20 |
| ESD Ratings (HBM) | 2000 | V | - | - | 2000 |
| ESD Ratings (CDM) | 500 | V | - | - | 500 |
| ESD Ratings (MM) | 500 | V | - | - | 500 |
| Frequency Range | 2400 to 2540 | MHz | 2400 | - | 2540 |
| Insertion Loss | 1.35 to 1.46 | dB | 1.35 | - | 1.46 |
| Return Loss | 16.5 to 17.5 | dB | 16.5 | - | 17.5 |
| Phase Imbalance | 4.5 to 5.5 | ° | 4.5 | - | 5.5 |
| Amplitude Imbalance | 0.15 to 0.25 | dB | 0.15 | - | 0.25 |
| 2nd Harmonic Filtering | -15 to -14 | dB | -15 | - | -14 |
| 3rd Harmonic Filtering | -42 to -41 | dB | -42 | - | -41 |
| Package Type | Chip Scale Package 0.4mm pitch | - | - | - | - |
| Footprint Size | < 1.5 mm² | - | - | - | - |
| Profile Height | < 560 µm after reflow | - | - | - | - |
Key Features
- Low insertion loss
- Low amplitude imbalance
- Low phase imbalance
- Coated Flip-Chip on Glass
- Small footprint: < 1.5 mm²
- Very low profile: < 560 µm after reflow
- High RF performance
- PCB space saving versus discrete solution
- BOM count reduction
- Efficient manufacturability
Applications
The BALF-NRF01D3 is designed for various wireless communication applications, including:
- Bluetooth Low Energy (BLE)
- ISM Radio SubGHz
- ZigBee
- LoRa
- Sigfox
- 802.15.4 OpenThread
- Human Machine Interface
It is particularly optimized for use with Nordic Semiconductor's nRF51822-QFAA/QFAB and nRF51422-QFAA/QFAB RF transceivers.
Q & A
- What is the BALF-NRF01D3?
The BALF-NRF01D3 is an ultraminiature balun from STMicroelectronics, designed to optimize RF performance for Nordic Semiconductor's nRF51822-QFAA/QFAB and nRF51422-QFAA/QFAB RF transceivers. - What technology does the BALF-NRF01D3 use?
The BALF-NRF01D3 uses STMicroelectronics' IPD technology on a non-conductive glass substrate. - What are the key specifications of the BALF-NRF01D3?
Key specifications include an operating temperature range of -40 to 105°C, input power of up to 20 dBm, and a frequency range of 2400 to 2540 MHz. - What are the benefits of using the BALF-NRF01D3?
Benefits include low insertion loss, low amplitude and phase imbalance, high RF performance, PCB space saving, BOM count reduction, and efficient manufacturability. - What applications is the BALF-NRF01D3 suited for?
The BALF-NRF01D3 is suited for Bluetooth Low Energy, ISM Radio SubGHz, ZigBee, LoRa, Sigfox, and 802.15.4 OpenThread applications. - How does the BALF-NRF01D3 integrate with other components?
The BALF-NRF01D3 integrates a matching network on a monolithic glass substrate, specifically tailored for Nordic Semiconductor's RF transceivers. - What is the footprint size of the BALF-NRF01D3?
The footprint size is less than 1.5 mm². - What is the profile height of the BALF-NRF01D3 after reflow?
The profile height is less than 560 µm after reflow. - Is the BALF-NRF01D3 RoHS compliant?
Yes, the BALF-NRF01D3 is RoHS compliant with an Ecopack2 grade. - Where can I find CAD symbols, footprints, and 3D models for the BALF-NRF01D3?
You can find these resources on the STMicroelectronics website under the product page for the BALF-NRF01D3.
