Overview
The STMicroelectronics BAL-NRF01D3 is an ultraminiature balun designed to optimize RF performance for specific Nordic Semiconductor circuits. This device integrates a matching network and harmonics filter, making it a compact and efficient solution for wireless connectivity applications. The BAL-NRF01D3 is customized for use with Nordic Semiconductor chips such as the nRF24LE1, nRF24AP2, nRF51422, and nRF51822 series. It utilizes STMicroelectronics’ IPD technology on a non-conductive glass substrate to enhance RF performance.
Key Specifications
| Parameter | Value | Unit | Min. | Typ. | Max. |
|---|---|---|---|---|---|
| Operating Temperature | -40 to +105 | °C | -40 | - | +105 |
| Input Power | -20 | dBm | - | - | -20 |
| Insertion Loss in Bandwidth | 2.25 | dB | - | - | 2.25 |
| Return Loss in Bandwidth | 10 | dB | - | - | 10 |
| Phase Imbalance | 3 | ° | - | - | 3 |
| Amplitude Imbalance | 0.1 | dB | - | - | 0.1 |
| 2nd Harmonic Filtering | -15 | dB | - | - | -15 |
| 3rd Harmonic Filtering | -42 | dB | - | - | -42 |
| Package Type | Chip Scale Package 0.4mm pitch | - | - | - | - |
| Footprint Size | < 1.5 mm² | - | - | - | - |
Key Features
- 50 Ω nominal input / conjugate match to Nordic Semiconductor chips such as nRF24LE1, nRF24AP2, nRF51422, and nRF51822 series.
- Low insertion loss, amplitude imbalance, and phase imbalance.
- Small footprint of less than 1.5 mm² and very low profile of less than 595 μm after reflow.
- High RF performance optimized by STMicroelectronics’ IPD technology on a non-conductive glass substrate.
- Integrated harmonics filter for 2nd and 3rd harmonic suppression.
- BOM count reduction and efficient manufacturability compared to traditional discrete solutions.
Applications
The BAL-NRF01D3 is optimized for use in 2.45 GHz wireless connectivity applications, particularly with Nordic Semiconductor’s ultralow power transceivers such as the nRF24LE1, nRF24AP2, nRF51422, and nRF51822 series. It is ideal for use in modules like the nRF2723 and nRF2752 nRFgo modules from Nordic Semiconductor.
Key application areas include:
- Wireless sensor networks
- Bluetooth Low Energy (BLE) devices
- Internet of Things (IoT) devices
- Low-power wireless communication systems
Q & A
- What is the BAL-NRF01D3?
The BAL-NRF01D3 is an ultraminiature balun from STMicroelectronics, integrating a matching network and harmonics filter for use with Nordic Semiconductor’s RF transceivers.
- Which Nordic Semiconductor chips is the BAL-NRF01D3 compatible with?
The BAL-NRF01D3 is compatible with nRF24LE1, nRF24AP2, nRF51422, and nRF51822 series from Nordic Semiconductor.
- What are the key features of the BAL-NRF01D3?
The key features include 50 Ω nominal input match, low insertion loss, low amplitude and phase imbalance, small footprint, and high RF performance.
- How does the BAL-NRF01D3 optimize RF performance?
The BAL-NRF01D3 uses STMicroelectronics’ IPD technology on a non-conductive glass substrate to optimize RF performance.
- What is the typical operating temperature range of the BAL-NRF01D3?
The operating temperature range is from -40°C to +105°C.
- How does the BAL-NRF01D3 reduce BOM count?
The BAL-NRF01D3 reduces the BOM count by integrating multiple components into a single device, decreasing the component count by up to 80% compared to traditional discrete solutions.
- What are the benefits of using the BAL-NRF01D3 in terms of PCB space?
The BAL-NRF01D3 saves PCB space due to its small footprint and low profile, making it ideal for compact designs.
- Has the BAL-NRF01D3 been tested and approved by Nordic Semiconductor?
Yes, the BAL-NRF01D3 has been tested and approved by Nordic Semiconductor in their nRF2723 and nRF2752 nRFgo modules.
- What is the recommended layout for high power output (4dBm mode) with the BAL-NRF01D3?
For high power output, adding a 0.8 pF high Q capacitor close to the single port of the BAL-NRF01D3 and connected to ground is recommended to optimize performance.
- What are the typical applications of the BAL-NRF01D3?
The BAL-NRF01D3 is typically used in wireless sensor networks, Bluetooth Low Energy (BLE) devices, Internet of Things (IoT) devices, and other low-power wireless communication systems.
