Overview
The SZESD9X5.0ST5G is an ESD protection diode manufactured by onsemi, designed to protect voltage-sensitive components from electrostatic discharge (ESD) and transient voltage events. This device is part of the ESD9X series, which is known for its excellent clamping capability, low leakage, and fast response time. The SZ prefix indicates that this device is AEC-Q101 qualified and meets unique site and control change requirements, making it suitable for automotive and other demanding applications.
Key Specifications
| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| Stand-off Voltage | VRWM | 5.0 | V |
| Maximum Reverse Leakage Current @ VRWM | IR | 1.0 | μA |
| Breakdown Voltage @ IT | VBR | 6.2 | V |
| Maximum Reverse Peak Pulse Current | IPP | 8.7 | A |
| Clamping Voltage @ IPP | VC | 12.3 | V |
| Peak Power Dissipation (8 x 20 μs) | Ppk | 107 | W |
| Maximum Capacitance @ VR = 0 and f = 1 MHz | C | 65 | pF |
| IEC 61000-4-2 (ESD) Contact/Air | ±30/±30 | kV | |
| Junction and Storage Temperature Range | TJ, Tstg | -55 to +150 | °C |
| Lead Solder Temperature - Maximum (10 Second Duration) | TL | 260 | °C |
| Package Dimensions | 0.039" x 0.024" (1.0 mm x 0.60 mm) | ||
| Body Height | 0.017" (0.43 mm) Max |
Key Features
- Low Clamping Voltage: Effective in limiting the voltage exposed to sensitive components during ESD events.
- Small Body Outline Dimensions: 0.039" x 0.024" (1.0 mm x 0.60 mm) and low body height of 0.017" (0.43 mm) Max, ideal for space-constrained applications.
- Low Leakage: Minimizes current draw when not in use, conserving power.
- Fast Response Time: Typically less than 1 ns, ensuring quick protection against ESD events.
- IEC 61000-4-2 Level 4 ESD Protection: Capable of withstanding ±30 kV contact and ±30 kV air discharge.
- AEC-Q101 Qualified and PPAP Capable: Suitable for automotive and other applications requiring stringent quality standards.
- Pb-Free and RoHS Compliant: Environmentally friendly and compliant with regulatory standards.
Applications
The SZESD9X5.0ST5G is designed for use in various applications where ESD protection is critical, including:
- Cellular phones
- MP3 players
- Digital cameras
- Automotive electronics
- High-speed data lines such as USB
- Other portable electronic devices where board space is limited.
Q & A
- What is the primary function of the SZESD9X5.0ST5G?
The primary function of the SZESD9X5.0ST5G is to protect voltage-sensitive components from electrostatic discharge (ESD) and transient voltage events.
- What are the key specifications of the SZESD9X5.0ST5G?
Key specifications include a stand-off voltage of 5.0 V, maximum reverse leakage current of 1.0 μA, breakdown voltage of 6.2 V, and clamping voltage of 12.3 V at maximum peak pulse current.
- What is the maximum ESD protection level of the SZESD9X5.0ST5G?
The device provides IEC 61000-4-2 Level 4 ESD protection, capable of withstanding ±30 kV contact and ±30 kV air discharge.
- Is the SZESD9X5.0ST5G suitable for automotive applications?
Yes, it is AEC-Q101 qualified and PPAP capable, making it suitable for automotive and other demanding applications.
- What are the package dimensions of the SZESD9X5.0ST5G?
The package dimensions are 0.039" x 0.024" (1.0 mm x 0.60 mm) with a body height of 0.017" (0.43 mm) Max.
- Is the SZESD9X5.0ST5G environmentally friendly?
Yes, it is Pb-Free and RoHS compliant.
- What is the response time of the SZESD9X5.0ST5G?
The response time is typically less than 1 ns.
- What is the maximum junction and storage temperature range for the SZESD9X5.0ST5G?
The junction and storage temperature range is -55 to +150 °C.
- What is the maximum lead solder temperature for the SZESD9X5.0ST5G?
The maximum lead solder temperature is 260 °C for a 10-second duration.
- What types of applications can benefit from using the SZESD9X5.0ST5G?
Applications include cellular phones, MP3 players, digital cameras, automotive electronics, and high-speed data lines such as USB.
