SPC5777CDK3MMO4R
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NXP USA Inc. SPC5777CDK3MMO4R

Manufacturer No:
SPC5777CDK3MMO4R
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
IC MCU 32BIT 8MB FLASH 516MAPBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The SPC5777CDK3MMO4R is a high-performance microcontroller from NXP USA Inc., part of the MPC57xx family. This Power Architecture MCU is designed to meet the demanding requirements of industrial and automotive engine control applications. It offers advanced performance, sophisticated timing systems, and robust security features, making it an ideal choice for complex control systems.

Key Specifications

SpecificationDetails
Microcontroller FamilyMPC57xx
Core ArchitecturePower Architecture
Core Typee200z7
Operating FrequencyUp to 200 MHz
Memory4 MB Flash, 512 KB SRAM
InterfacesUART, SPI, CAN, LIN, Ethernet, FlexRay
Security FeaturesHardware Security Module (HSM), Secure Boot
Operating Temperature-40°C to 125°C
Package TypeLBGA 416

Key Features

  • High-performance e200z7 core with up to 200 MHz operating frequency
  • Advanced timing systems including GTM (Generic Timer Module) and eTPU (Enhanced Time Processing Unit)
  • Robust security features including Hardware Security Module (HSM) and Secure Boot
  • Extensive communication interfaces such as UART, SPI, CAN, LIN, Ethernet, and FlexRay
  • High reliability and durability with an operating temperature range of -40°C to 125°C

Applications

The SPC5777CDK3MMO4R is primarily targeted at industrial and automotive engine control applications. It is well-suited for use in:

  • Automotive engine control units (ECUs)
  • Industrial control systems
  • Advanced driver-assistance systems (ADAS)
  • Automotive safety and security systems

Q & A

  1. What is the core architecture of the SPC5777CDK3MMO4R?
    The core architecture is Power Architecture.
  2. What is the maximum operating frequency of the SPC5777CDK3MMO4R?
    The maximum operating frequency is up to 200 MHz.
  3. What types of memory does the SPC5777CDK3MMO4R have?
    The SPC5777CDK3MMO4R has 4 MB Flash and 512 KB SRAM.
  4. What are the key security features of the SPC5777CDK3MMO4R?
    The key security features include Hardware Security Module (HSM) and Secure Boot.
  5. What are the primary applications of the SPC5777CDK3MMO4R?
    The primary applications include automotive engine control units (ECUs), industrial control systems, ADAS, and automotive safety and security systems.
  6. What is the operating temperature range of the SPC5777CDK3MMO4R?
    The operating temperature range is -40°C to 125°C.
  7. What package type does the SPC5777CDK3MMO4R come in?
    The package type is LBGA 416.
  8. Does the SPC5777CDK3MMO4R support advanced timing systems?
    Yes, it supports advanced timing systems including GTM and eTPU.
  9. What communication interfaces are available on the SPC5777CDK3MMO4R?
    The available interfaces include UART, SPI, CAN, LIN, Ethernet, and FlexRay.
  10. Where can I find detailed specifications for the SPC5777CDK3MMO4R?
    Detailed specifications can be found on the official NXP website, Digi-Key, and other authorized distributors.

Product Attributes

Core Processor:e200z7
Core Size:32-Bit Tri-Core
Speed:264MHz
Connectivity:CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:DMA, LVD, POR, Zipwire
Number of I/O:- 
Program Memory Size:8MB (8M x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:512K x 8
Voltage - Supply (Vcc/Vdd):3V ~ 5.5V
Data Converters:A/D 16b Sigma-Delta, eQADC
Oscillator Type:Internal
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:516-BGA
Supplier Device Package:516-MAPBGA (27x27)
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Similar Products

Part Number SPC5777CDK3MMO4R SPC5777CDK3MME4R SPC5777CDK3MMO3R SPC5777CDK3MMO4
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active
Core Processor e200z7 e200z7 e200z7 e200z7
Core Size 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core
Speed 264MHz 264MHz 264MHz 264MHz
Connectivity CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire
Number of I/O - - - -
Program Memory Size 8MB (8M x 8) 8MB (8M x 8) 8MB (8M x 8) 8MB (8M x 8)
Program Memory Type Flash Flash Flash Flash
EEPROM Size - - - -
RAM Size 512K x 8 512K x 8 512K x 8 512K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V
Data Converters A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC
Oscillator Type Internal Internal Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 516-BGA 416-BGA 516-BGA 516-BGA
Supplier Device Package 516-MAPBGA (27x27) 416-MAPBGA (27x27) 516-MAPBGA (27x27) 516-MAPBGA (27x27)

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