SPC5777CDK3MMO4
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NXP USA Inc. SPC5777CDK3MMO4

Manufacturer No:
SPC5777CDK3MMO4
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 32BIT 8MB FLASH 516MAPBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The SPC5777CDK3MMO4 is a 32-bit microcontroller (MCU) from NXP USA Inc., designed specifically for high-end automotive and industrial powertrain applications. This MCU is part of the MPC5777C family, which is renowned for its advanced engine control, functional safety, and security features. The device leverages a high-performance multicore architecture and includes industry-standard eTPU (Enhanced Time Processing Unit) based timer systems, making it ideal for demanding applications that require precise timing and robust performance.

Key Specifications

SpecificationDetails
ArchitecturePower Architecture
Package TypeBGA516
Flash Memory8 MB
Functional SafetyISO 26262, ASIL D
Moisture Sensitivity Level (MSL)3
Peak Package Body Temperature (PPT)260°C
Maximum Time at Peak Temperature40 seconds
PbFree and EU RoHS ComplianceYes
Halogen FreeYes

Key Features

  • High-Performance Multicore Architecture: Designed to handle complex engine control and industrial applications.
  • eTPU Based Timer System: Industry-standard timer system for precise timing and control.
  • Advanced Security Module: Enhances the security of the system with robust security features.
  • Functional Safety Compliance: Meets ISO 26262 standards with ASIL D certification, ensuring the highest level of functional safety.
  • Flash Memory Support: 8 MB of flash memory for code expansion and storage.

Applications

The SPC5777CDK3MMO4 is primarily used in high-end automotive and industrial powertrain applications, including advanced engine control systems, transmission control, and other safety-critical systems. Its robust performance, timing accuracy, and high level of functional safety make it an ideal choice for these demanding environments.

Q & A

  1. What is the primary application of the SPC5777CDK3MMO4 MCU?
    The primary application is in high-end automotive and industrial powertrain applications, including advanced engine control and transmission control.
  2. What type of architecture does the SPC5777CDK3MMO4 use?
    The SPC5777CDK3MMO4 uses the Power Architecture.
  3. How much flash memory does the SPC5777CDK3MMO4 have?
    The SPC5777CDK3MMO4 has 8 MB of flash memory.
  4. What is the functional safety certification of the SPC5777CDK3MMO4?
    The SPC5777CDK3MMO4 is certified to ISO 26262 with ASIL D.
  5. What is the package type of the SPC5777CDK3MMO4?
    The package type is BGA516.
  6. Is the SPC5777CDK3MMO4 PbFree and EU RoHS compliant?
    Yes, it is PbFree and EU RoHS compliant.
  7. What is the peak package body temperature (PPT) for the SPC5777CDK3MMO4?
    The PPT is 260°C.
  8. How long can the SPC5777CDK3MMO4 be exposed to the peak temperature?
    It can be exposed for up to 40 seconds.
  9. Does the SPC5777CDK3MMO4 include an eTPU based timer system?
    Yes, it includes an eTPU based timer system.
  10. What level of moisture sensitivity does the SPC5777CDK3MMO4 have?
    The moisture sensitivity level (MSL) is 3.

Product Attributes

Core Processor:e200z7
Core Size:32-Bit Tri-Core
Speed:264MHz
Connectivity:CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:DMA, LVD, POR, Zipwire
Number of I/O:- 
Program Memory Size:8MB (8M x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:512K x 8
Voltage - Supply (Vcc/Vdd):3V ~ 5.5V
Data Converters:A/D 16b Sigma-Delta, eQADC
Oscillator Type:Internal
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:516-BGA
Supplier Device Package:516-MAPBGA (27x27)
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Similar Products

Part Number SPC5777CDK3MMO4 SPC5777CDK3MMO4R SPC5777CDK3MME4 SPC5777CDK3MMO3
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active
Core Processor e200z7 e200z7 e200z7 e200z7
Core Size 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Tri-Core
Speed 264MHz 264MHz 264MHz 264MHz
Connectivity CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire
Number of I/O - - - -
Program Memory Size 8MB (8M x 8) 8MB (8M x 8) 8MB (8M x 8) 8MB (8M x 8)
Program Memory Type Flash Flash Flash Flash
EEPROM Size - - - -
RAM Size 512K x 8 512K x 8 512K x 8 512K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V
Data Converters A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC
Oscillator Type Internal Internal Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 516-BGA 516-BGA 416-BGA 516-BGA
Supplier Device Package 516-MAPBGA (27x27) 516-MAPBGA (27x27) 416-MAPBGA (27x27) 516-MAPBGA (27x27)

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