S9S12GN16BMTJ
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NXP USA Inc. S9S12GN16BMTJ

Manufacturer No:
S9S12GN16BMTJ
Manufacturer:
NXP USA Inc.
Package:
Tube
Description:
IC MCU 16BIT 16KB FLASH 20TSSOP
Delivery:
Payment:
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Product Introduction

Overview

The S9S12GN16BMTJ is a 16-bit microcontroller from NXP USA Inc., part of the HCS12 family. This microcontroller is designed for various automotive and industrial applications, offering a robust set of features and communication protocols. The CPU12V1 core operates at a speed of 25MHz, making it suitable for a wide range of control and monitoring tasks.

Key Specifications

SpecificationValue
Core ProcessorCPU12V1
Core Size16-Bit
Speed25MHz
Memory16KB (16K x 8) FLASH
Package Type20-TSSOP
ConnectivityIrDA, LINbus, SCI, SPI

Key Features

  • 16-bit CPU12V1 core with a clock speed of 25MHz
  • 16KB of FLASH memory (16K x 8)
  • Support for various communication protocols: IrDA, LINbus, SCI, and SPI
  • Compact 20-TSSOP package
  • Suitable for high-reliability applications in automotive and industrial sectors

Applications

The S9S12GN16BMTJ microcontroller is well-suited for a variety of applications, including:

  • Automotive body controllers
  • Occupant detection systems
  • Door modules
  • Seat controllers
  • RKE (Remote Keyless Entry) receivers
  • Smart actuators
  • Lighting modules
  • Smart junction boxes

Q & A

  1. What is the core processor of the S9S12GN16BMTJ microcontroller?
    The core processor is the CPU12V1.
  2. What is the clock speed of the S9S12GN16BMTJ microcontroller?
    The clock speed is 25MHz.
  3. How much FLASH memory does the S9S12GN16BMTJ have?
    The microcontroller has 16KB (16K x 8) of FLASH memory.
  4. What package type is the S9S12GN16BMTJ available in?
    The microcontroller is available in a 20-TSSOP package.
  5. What communication protocols does the S9S12GN16BMTJ support?
    The microcontroller supports IrDA, LINbus, SCI, and SPI.
  6. In which sectors is the S9S12GN16BMTJ commonly used?
    The microcontroller is commonly used in automotive and industrial sectors.
  7. What are some typical applications of the S9S12GN16BMTJ?
    Typical applications include automotive body controllers, occupant detection systems, door modules, seat controllers, RKE receivers, smart actuators, lighting modules, and smart junction boxes.
  8. Where can I find detailed specifications for the S9S12GN16BMTJ?
    Detailed specifications can be found on the official NXP website, as well as on distributor websites like Mouser, Digi-Key, and Avnet.
  9. What is the minimum order quantity for the S9S12GN16BMTJ?
    The minimum order quantity is 2000 units.
  10. How long is the lead time for the S9S12GN16BMTJ?
    The lead time is typically 12 weeks.

Product Attributes

Core Processor:CPU12V1
Core Size:16-Bit
Speed:25MHz
Connectivity:IrDA, LINbus, SCI, SPI
Peripherals:LVD, POR, PWM, WDT
Number of I/O:14
Program Memory Size:16KB (16K x 8)
Program Memory Type:Flash
EEPROM Size:512 x 8
RAM Size:1K x 8
Voltage - Supply (Vcc/Vdd):3.13V ~ 5.5V
Data Converters:A/D 8x10b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package:20-TSSOP
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Similar Products

Part Number S9S12GN16BMTJ S9S12GN16BVTJ
Manufacturer NXP USA Inc. NXP USA Inc.
Product Status Active Active
Core Processor CPU12V1 12V1
Core Size 16-Bit 16-Bit
Speed 25MHz 25MHz
Connectivity IrDA, LINbus, SCI, SPI IrDA, LINbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 14 14
Program Memory Size 16KB (16K x 8) 16KB (16K x 8)
Program Memory Type Flash Flash
EEPROM Size 512 x 8 512 x 8
RAM Size 1K x 8 1K x 8
Voltage - Supply (Vcc/Vdd) 3.13V ~ 5.5V 3.13V ~ 5.5V
Data Converters A/D 8x10b A/D 8x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount Surface Mount
Package / Case 20-TSSOP (0.173", 4.40mm Width) 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package 20-TSSOP 20-TSSOP

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