S9S08SG8E2MTJR
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NXP USA Inc. S9S08SG8E2MTJR

Manufacturer No:
S9S08SG8E2MTJR
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
IC MCU 8BIT 8KB FLASH 20TSSOP
Delivery:
Payment:
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Product Introduction

Overview

The S9S08SG8E2MTJR is an 8-bit microcontroller (MCU) from NXP USA Inc., part of the S08SG family. This MCU is designed for a range of applications, including LIN follower, general market, and high-temperature environments. It is built on the enhanced HCS08 core, offering a balance of performance and cost-effectiveness.

The S9S08SG8E2MTJR is particularly suited for high-temperature applications, having been qualified to meet or exceed AEC Grade 0 requirements, allowing it to operate up to 150 °C.

Key Specifications

Specification Details
Central Processor Unit (CPU) 40 MHz HCS08 CPU (36 MHz for temperatures greater than 125 °C)
Instruction Set HC08 instruction set with added BGND instruction
Interrupt/Reset Sources Support for up to 32 interrupt/reset sources
On-Chip Memory Flash, RAM; Flash read/program/erase over full operating voltage and temperature
Clock Source Options Oscillator (XOSC) with crystal or ceramic resonator range of 31.25 kHz to 38.4 kHz or 1 MHz to 16 MHz; Internal Clock Source (ICS)
Power-Saving Modes Two very low power stop modes, reduced power wait mode, very low power real-time interrupt
Operating Temperature Up to 150 °C
Package Type Various packages including MTJR (48-pin LQFP)

Key Features

  • High-Performance CPU: 40 MHz HCS08 CPU with enhanced instruction set.
  • Flexible Clock Options: Supports both external and internal clock sources, including oscillator and frequency-locked loop (FLL) controlled by internal or external reference.
  • Power Efficiency: Features two very low power stop modes, reduced power wait mode, and very low power real-time interrupt.
  • High-Temperature Capability: Qualified to meet or exceed AEC Grade 0 requirements, operating up to 150 °C.
  • Security Features: Includes memory security with a key mechanism to temporarily disengage memory security.
  • On-Chip Memory: Flash, RAM with flash read/program/erase capabilities over full operating voltage and temperature.

Applications

  • Automotive Systems: Used in auto-safety systems, engine and vehicle-performance monitoring, and engine control modules.
  • Robotics: Serves as the main brain in robotic applications, controlling actuators and sensors.
  • Medical Equipment: Utilized in X-ray machines, ECG machines, ultrasound systems, and imaging systems.
  • Home Automation: Employed in automated lighting systems, thermostats, HVAC systems, and energy-management systems.
  • Smart Electronics: Found in various consumer electronic devices such as smartphones, TVs, gaming consoles, and household appliances.

Q & A

  1. What is the maximum operating temperature of the S9S08SG8E2MTJR MCU?

    The S9S08SG8E2MTJR MCU can operate up to 150 °C, meeting or exceeding AEC Grade 0 requirements.

  2. What type of CPU does the S9S08SG8E2MTJR use?

    The MCU uses a 40 MHz HCS08 CPU, with a reduced frequency of 36 MHz for temperatures greater than 125 °C.

  3. What are the clock source options for this MCU?

    The MCU supports both external and internal clock sources, including an oscillator (XOSC) and an internal clock source (ICS) with a frequency-locked loop (FLL).

  4. Does the S9S08SG8E2MTJR have power-saving modes?

    Yes, it features two very low power stop modes, a reduced power wait mode, and a very low power real-time interrupt.

  5. What kind of memory does the S9S08SG8E2MTJR have?

    The MCU includes flash memory and RAM, with flash read/program/erase capabilities over the full operating voltage and temperature range.

  6. How many interrupt/reset sources does the MCU support?

    The S9S08SG8E2MTJR supports up to 32 interrupt/reset sources.

  7. What is the instruction set used by the S9S08SG8E2MTJR?

    The MCU uses the HC08 instruction set with the added BGND instruction.

  8. Does the MCU have security features?

    Yes, it includes memory security with a key mechanism to temporarily disengage memory security.

  9. In what types of applications is the S9S08SG8E2MTJR commonly used?

    The MCU is commonly used in automotive systems, robotics, medical equipment, home automation, and smart electronics.

  10. What is the package type for the S9S08SG8E2MTJR?

    The MCU is available in various packages, including the 48-pin LQFP (MTJR).

Product Attributes

Core Processor:S08
Core Size:8-Bit
Speed:40MHz
Connectivity:I²C, LINbus, SCI, SPI
Peripherals:LVD, POR, PWM, WDT
Number of I/O:16
Program Memory Size:8KB (8K x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:512 x 8
Voltage - Supply (Vcc/Vdd):2.7V ~ 5.5V
Data Converters:A/D 12x10b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package:20-TSSOP
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Similar Products

Part Number S9S08SG8E2MTJR S9S08SG8E2VTJR S9S08SG4E2MTJR S9S08SG8E2CTJR S9S08SG8E2MTGR S9S08SG8E2MTJ
Manufacturer NXP USA Inc. Freescale Semiconductor NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Active Active
Core Processor S08 S08 S08 S08 S08 S08
Core Size 8-Bit 8-Bit 8-Bit 8-Bit 8-Bit 8-Bit
Speed 40MHz 40MHz 40MHz 40MHz 40MHz 40MHz
Connectivity I²C, LINbus, SCI, SPI I²C, LINbus, SCI, SPI I²C, LINbus, SCI, SPI I²C, LINbus, SCI, SPI I²C, LINbus, SCI, SPI I²C, LINbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 16 16 16 16 12 16
Program Memory Size 8KB (8K x 8) 8KB (8K x 8) 4KB (4K x 8) 8KB (8K x 8) 8KB (8K x 8) 8KB (8K x 8)
Program Memory Type Flash Flash Flash Flash Flash Flash
EEPROM Size - - - - - -
RAM Size 512 x 8 512 x 8 256 x 8 512 x 8 512 x 8 512 x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V 2.7V ~ 5.5V 2.7V ~ 5.5V 2.7V ~ 5.5V 2.7V ~ 5.5V 2.7V ~ 5.5V
Data Converters A/D 12x10b A/D 12x10b A/D 12x10b A/D 12x10b A/D 8x10b A/D 12x10b
Oscillator Type Internal Internal Internal Internal Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 105°C (TA) -40°C ~ 125°C (TA) -40°C ~ 85°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 20-TSSOP (0.173", 4.40mm Width) 20-TSSOP (0.173", 4.40mm Width) 20-TSSOP (0.173", 4.40mm Width) 20-TSSOP (0.173", 4.40mm Width) 16-TSSOP (0.173", 4.40mm Width) 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package 20-TSSOP 20-TSSOP 20-TSSOP 20-TSSOP 16-TSSOP 20-TSSOP

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