S9S08SG8E2MTGR
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NXP USA Inc. S9S08SG8E2MTGR

Manufacturer No:
S9S08SG8E2MTGR
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
IC MCU 8BIT 8KB FLASH 16TSSOP
Delivery:
Payment:
iso14001
iso45001
iso9001
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Product Introduction

Overview

The S9S08SG8E2MTGR is a member of the S08SG family of 8-bit microcontrollers (MCUs) produced by NXP USA Inc. This MCU is designed to cater to a range of applications, including LIN follower and general market needs, with a particular emphasis on high-temperature operation. The S08SG family is known for its high performance and cost-effectiveness, making it a versatile choice for various embedded systems.

Key Specifications

SpecificationDetails
CoreEnhanced HCS08 core
Clock SourceOscillator (XOSC) — Loop-control Pierce oscillator; Crystal or ceramic resonator range of 31.25 kHz to 38.4 kHz or 1 MHz to 16 MHz
System ClockBUSCLK: Half of ICSOUT frequency; ICSOUT: Twice the bus frequency; ICSLCLK: For development tools to speed up BDC communications
MemoryStatic RAM; Nonvolatile registers in FLASH memory
General-Purpose I/OUp to 16 general-purpose I/O pins shared with on-chip peripheral functions
Temperature RangeUp to 150 °C TA for high-temperature devices
Package TypeVariety of package types available

Key Features

  • High-Performance Core: The enhanced HCS08 core provides efficient processing capabilities.
  • Flexible Clock Options: Supports various clock sources including crystal or ceramic resonators.
  • General-Purpose I/O: Up to 16 I/O pins that can be configured for different peripheral functions.
  • High-Temperature Operation: Qualified to meet or exceed AEC Grade 0 requirements, allowing operation up to 150 °C TA.
  • Security Features: Includes memory security options with a key mechanism to disengage security temporarily.

Applications

The S9S08SG8E2MTGR is suitable for a variety of applications, including:

  • LIN Follower Applications: Ideal for automotive and industrial control systems that require LIN (Local Interconnect Network) communication.
  • General Market Applications: Can be used in consumer electronics, industrial automation, and other general-purpose embedded systems.
  • High-Temperature Environments: Suitable for applications that require operation in high-temperature conditions.

Q & A

  1. What is the core type of the S9S08SG8E2MTGR MCU?
    The S9S08SG8E2MTGR uses the enhanced HCS08 core.
  2. What are the clock source options for this MCU?
    The MCU supports an oscillator (XOSC) with crystal or ceramic resonator ranges of 31.25 kHz to 38.4 kHz or 1 MHz to 16 MHz.
  3. How many general-purpose I/O pins does the S9S08SG8E2MTGR have?
    It has up to 16 general-purpose I/O pins.
  4. What is the maximum operating temperature for this MCU?
    The high-temperature devices can operate up to 150 °C TA.
  5. Does the S9S08SG8E2MTGR have any security features?
    Yes, it includes memory security options with a key mechanism.
  6. What types of applications is the S9S08SG8E2MTGR suitable for?
    It is suitable for LIN follower, general market, and high-temperature applications.
  7. What type of memory does the S9S08SG8E2MTGR have?
    The MCU includes static RAM and nonvolatile registers in FLASH memory.
  8. Can the I/O pins be configured for different functions?
    Yes, the I/O pins can be configured for different peripheral functions.
  9. How do you disengage memory security temporarily?
    Memory security can be temporarily disengaged using an 8-byte comparison key.
  10. What is the significance of AEC Grade 0 qualification?
    AEC Grade 0 qualification means the device is tested to operate reliably up to 150 °C TA.

Product Attributes

Core Processor:S08
Core Size:8-Bit
Speed:40MHz
Connectivity:I²C, LINbus, SCI, SPI
Peripherals:LVD, POR, PWM, WDT
Number of I/O:12
Program Memory Size:8KB (8K x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:512 x 8
Voltage - Supply (Vcc/Vdd):2.7V ~ 5.5V
Data Converters:A/D 8x10b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package:16-TSSOP
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Similar Products

Part Number S9S08SG8E2MTGR S9S08SG8E2MTJR S9S08SG8E2VTGR S9S08SG8E2WTGR S9S08SG4E2MTGR S9S08SG8E2CTGR S9S08SG8E2MTG
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. Freescale Semiconductor NXP USA Inc.
Product Status Active Active Active Active Active Active Active
Core Processor S08 S08 S08 S08 S08 S08 S08
Core Size 8-Bit 8-Bit 8-Bit 8-Bit 8-Bit 8-Bit 8-Bit
Speed 40MHz 40MHz 40MHz 40MHz 40MHz 40MHz 40MHz
Connectivity I²C, LINbus, SCI, SPI I²C, LINbus, SCI, SPI I²C, LINbus, SCI, SPI I²C, LINbus, SCI, SPI I²C, LINbus, SCI, SPI I²C, LINbus, SCI, SPI I²C, LINbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 12 16 12 12 12 12 12
Program Memory Size 8KB (8K x 8) 8KB (8K x 8) 8KB (8K x 8) 8KB (8K x 8) 4KB (4K x 8) 8KB (8K x 8) 8KB (8K x 8)
Program Memory Type Flash Flash Flash Flash Flash Flash Flash
EEPROM Size - - - - - - -
RAM Size 512 x 8 512 x 8 512 x 8 512 x 8 256 x 8 512 x 8 512 x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V 2.7V ~ 5.5V 2.7V ~ 5.5V 2.7V ~ 5.5V 2.7V ~ 5.5V 2.7V ~ 5.5V 2.7V ~ 5.5V
Data Converters A/D 8x10b A/D 12x10b A/D 8x10b A/D 8x10b A/D 8x10b A/D 8x10b A/D 8x10b
Oscillator Type Internal Internal Internal Internal Internal Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 105°C (TA) -40°C ~ 150°C (TA) -40°C ~ 125°C (TA) -40°C ~ 85°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 16-TSSOP (0.173", 4.40mm Width) 20-TSSOP (0.173", 4.40mm Width) 16-TSSOP (0.173", 4.40mm Width) 16-TSSOP (0.173", 4.40mm Width) 16-TSSOP (0.173", 4.40mm Width) 16-TSSOP (0.173", 4.40mm Width) 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package 16-TSSOP 20-TSSOP 16-TSSOP 16-TSSOP 16-TSSOP 16-TSSOP 16-TSSOP

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