MCIMX6U5EVM10ACR
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NXP USA Inc. MCIMX6U5EVM10ACR

Manufacturer No:
MCIMX6U5EVM10ACR
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The MCIMX6U5EVM10ACR is a microprocessor from NXP USA Inc., part of the i.MX 6 series. This device features a dual-core ARM Cortex-A9 architecture, operating at a frequency of up to 1 GHz. It is packaged in a 624-pin Low Profile Fine-Pitch Ball Grid Array (LFBGA) and is designed for a wide range of applications requiring high-performance processing and multiple interface options.

Key Specifications

Parameter Value
Core Architecture ARM Cortex-A9
Number of Cores Dual-core
Operating Frequency Up to 1 GHz
Data Bus Width 32 bits
Package Type 624-pin LFBGA
Supply Voltage (Min) 1.5 V
Supply Voltage (Max) 1.8 V, 2.5 V, 2.8 V, 3.3 V
Interfaces Ethernet, I2C, PCIe, SPI, UART, USB, CAN, I2S, MMC/SD/SDIO, SAI, SSI
Moisture Sensitivity Level (MSL) 3 (168 hours)
Terminal Pitch 0.8 mm

Key Features

  • Dual-core ARM Cortex-A9 processor for high-performance processing.
  • Operating frequency of up to 1 GHz.
  • Multiple interface options including Ethernet, I2C, PCIe, SPI, UART, USB, CAN, I2S, MMC/SD/SDIO, SAI, and SSI.
  • Support for various supply voltages: 1.8 V, 2.5 V, 2.8 V, and 3.3 V.
  • Compliance with EU RoHS, ELV, and China RoHS directives.
  • Lead-free and halogen-free packaging.

Applications

  • Industrial automation and control systems.
  • Medical devices requiring high-performance processing.
  • Aerospace and defense applications.
  • Automotive infotainment and navigation systems.
  • Consumer electronics such as set-top boxes and digital media players.
  • IoT devices and smart home appliances.

Q & A

  1. What is the core architecture of the MCIMX6U5EVM10ACR?

    The MCIMX6U5EVM10ACR features a dual-core ARM Cortex-A9 architecture.

  2. What is the maximum operating frequency of this microprocessor?

    The maximum operating frequency is up to 1 GHz.

  3. What type of package does the MCIMX6U5EVM10ACR use?

    The device is packaged in a 624-pin Low Profile Fine-Pitch Ball Grid Array (LFBGA).

  4. What are the supported supply voltages for this microprocessor?

    The supported supply voltages are 1.8 V, 2.5 V, 2.8 V, and 3.3 V.

  5. Is the MCIMX6U5EVM10ACR compliant with environmental regulations?

    Yes, it is compliant with EU RoHS, ELV, and China RoHS directives.

  6. What are the key interfaces supported by this microprocessor?

    The device supports Ethernet, I2C, PCIe, SPI, UART, USB, CAN, I2S, MMC/SD/SDIO, SAI, and SSI interfaces.

  7. What is the moisture sensitivity level (MSL) of the MCIMX6U5EVM10ACR?

    The MSL is 3 (168 hours).

  8. What is the terminal pitch of the LFBGA package?

    The terminal pitch is 0.8 mm.

  9. Is the MCIMX6U5EVM10ACR lead-free and halogen-free?

    Yes, it is lead-free and halogen-free.

  10. What are some typical applications for the MCIMX6U5EVM10ACR?

    Typical applications include industrial automation, medical devices, aerospace and defense, automotive infotainment, consumer electronics, and IoT devices.

Product Attributes

Core Processor:ARM® Cortex®-A9
Number of Cores/Bus Width:2 Core, 32-Bit
Speed:1.0GHz
Co-Processors/DSP:Multimedia; NEON™ SIMD
RAM Controllers:LPDDR2, LVDDR3, DDR3
Graphics Acceleration:Yes
Display & Interface Controllers:Keypad, LCD
Ethernet:10/100/1000Mbps (1)
SATA:- 
USB:USB 2.0 + PHY (4)
Voltage - I/O:1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:-20°C ~ 105°C (TJ)
Security Features:
Package / Case:624-LFBGA
Supplier Device Package:624-MAPBGA (21x21)
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Similar Products

Part Number MCIMX6U5EVM10ACR MCIMX6U5EVM10ADR MCIMX6S5EVM10ACR MCIMX6U5DVM10ACR MCIMX6U5EVM10ABR MCIMX6U5EVM10AC
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Not For New Designs Active
Core Processor ARM® Cortex®-A9 ARM® Cortex®-A9 ARM® Cortex®-A9 ARM® Cortex®-A9 ARM® Cortex®-A9 ARM® Cortex®-A9
Number of Cores/Bus Width 2 Core, 32-Bit 2 Core, 32-Bit 1 Core, 32-Bit 2 Core, 32-Bit 2 Core, 32-Bit 2 Core, 32-Bit
Speed 1.0GHz 1.0GHz 1.0GHz 1.0GHz 1.0GHz 1.0GHz
Co-Processors/DSP Multimedia; NEON™ SIMD Multimedia; NEON™ SIMD Multimedia; NEON™ SIMD Multimedia; NEON™ SIMD Multimedia; NEON™ SIMD Multimedia; NEON™ SIMD
RAM Controllers LPDDR2, LVDDR3, DDR3 LPDDR2, LVDDR3, DDR3 LPDDR2, LVDDR3, DDR3 LPDDR2, LVDDR3, DDR3 LPDDR2, LVDDR3, DDR3 LPDDR2, LVDDR3, DDR3
Graphics Acceleration Yes Yes Yes Yes Yes Yes
Display & Interface Controllers Keypad, LCD Keypad, LCD Keypad, LCD Keypad, LCD Keypad, LCD Keypad, LCD
Ethernet 10/100/1000Mbps (1) 10/100/1000Mbps (1) 10/100/1000Mbps (1) 10/100/1000Mbps (1) 10/100/1000Mbps (1) 10/100/1000Mbps (1)
SATA - - - - - -
USB USB 2.0 + PHY (4) USB 2.0 + PHY (4) USB 2.0 + PHY (4) USB 2.0 + PHY (4) USB 2.0 + PHY (4) USB 2.0 + PHY (4)
Voltage - I/O 1.8V, 2.5V, 2.8V, 3.3V 1.8V, 2.5V, 2.8V, 3.3V 1.8V, 2.5V, 2.8V, 3.3V 1.8V, 2.5V, 2.8V, 3.3V 1.8V, 2.5V, 2.8V, 3.3V 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature -20°C ~ 105°C (TJ) -20°C ~ 105°C (TJ) -20°C ~ 105°C (TJ) 0°C ~ 95°C (TJ) -20°C ~ 105°C (TJ) -20°C ~ 105°C (TJ)
Security Features
Package / Case 624-LFBGA 624-LFBGA 624-LFBGA 624-LFBGA 624-LFBGA 624-LFBGA
Supplier Device Package 624-MAPBGA (21x21) 624-MAPBGA (21x21) 624-MAPBGA (21x21) 624-MAPBGA (21x21) 624-MAPBGA (21x21) 624-MAPBGA (21x21)

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