MCIMX6S5EVM10ACR
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NXP USA Inc. MCIMX6S5EVM10ACR

Manufacturer No:
MCIMX6S5EVM10ACR
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
IC MPU I.MX6S 1.0GHZ 624MAPBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The MCIMX6S5EVM10ACR is a System-on-Chip (SoC) microprocessor developed by NXP USA Inc. This device is part of the i.MX6 Solo family, which is based on the ARM Cortex-A9 architecture. It is designed to provide high performance and efficiency for a variety of embedded system applications. The microprocessor operates at a clock speed of 1.0 GHz and is packaged in a 624-pin MAPBGA (21x21 mm) form factor.

Key Specifications

SpecificationDetails
Processor CoreARM Cortex-A9, 1 Core
Operating Frequency1.0 GHz
Package Type624-pin MAPBGA (21x21 mm)
Bit Width32-Bit
Process Technology40nm
Temperature RangeCommercial and Industrial grades available

Key Features

  • High Performance: The ARM Cortex-A9 core provides high processing power for demanding applications.
  • Low Power Consumption: The 40nm process technology helps in reducing power consumption, making it suitable for battery-powered devices.
  • Rich Peripherals: Includes a variety of peripherals such as USB, SATA, PCIe, and more, enhancing the device's connectivity and functionality.
  • Advanced Graphics and Video: Supports advanced graphics and video processing capabilities, making it ideal for multimedia applications.

Applications

  • Industrial Automation: Used in control systems, robotics, and other industrial automation applications.
  • Medical Devices: Suitable for medical imaging, patient monitoring, and other medical equipment.
  • Consumer Electronics: Found in smart home devices, set-top boxes, and other consumer electronics.
  • Automotive Systems: Used in infotainment systems, navigation, and other automotive applications.

Q & A

  1. What is the core architecture of the MCIMX6S5EVM10ACR?
    The MCIMX6S5EVM10ACR is based on the ARM Cortex-A9 architecture.
  2. What is the operating frequency of the MCIMX6S5EVM10ACR?
    The operating frequency is 1.0 GHz.
  3. What is the package type of the MCIMX6S5EVM10ACR?
    The package type is 624-pin MAPBGA (21x21 mm).
  4. What is the bit width of the MCIMX6S5EVM10ACR?
    The bit width is 32-Bit.
  5. What is the process technology used in the MCIMX6S5EVM10ACR?
    The process technology is 40nm.
  6. What are some of the key features of the MCIMX6S5EVM10ACR?
    High performance, low power consumption, rich peripherals, and advanced graphics and video capabilities.
  7. In which applications is the MCIMX6S5EVM10ACR commonly used?
    Industrial automation, medical devices, consumer electronics, and automotive systems.
  8. Where can I find detailed specifications for the MCIMX6S5EVM10ACR?
    Detailed specifications can be found on official NXP websites, Digi-Key, Mouser Electronics, and other authorized distributors.
  9. What is the temperature range for the MCIMX6S5EVM10ACR?
    The device is available in commercial and industrial temperature grades.
  10. Can the MCIMX6S5EVM10ACR be used in battery-powered devices?
    Yes, due to its low power consumption, it is suitable for battery-powered devices.

Product Attributes

Core Processor:ARM® Cortex®-A9
Number of Cores/Bus Width:1 Core, 32-Bit
Speed:1.0GHz
Co-Processors/DSP:Multimedia; NEON™ SIMD
RAM Controllers:LPDDR2, LVDDR3, DDR3
Graphics Acceleration:Yes
Display & Interface Controllers:Keypad, LCD
Ethernet:10/100/1000Mbps (1)
SATA:- 
USB:USB 2.0 + PHY (4)
Voltage - I/O:1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:-20°C ~ 105°C (TJ)
Security Features:
Package / Case:624-LFBGA
Supplier Device Package:624-MAPBGA (21x21)
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Similar Products

Part Number MCIMX6S5EVM10ACR MCIMX6U5EVM10ACR MCIMX6S5EVM10ADR MCIMX6S5DVM10ACR MCIMX6S5EVM10ABR MCIMX6S5EVM10AC
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Not For New Designs Active
Core Processor ARM® Cortex®-A9 ARM® Cortex®-A9 ARM® Cortex®-A9 ARM® Cortex®-A9 ARM® Cortex®-A9 ARM® Cortex®-A9
Number of Cores/Bus Width 1 Core, 32-Bit 2 Core, 32-Bit 1 Core, 32-Bit 1 Core, 32-Bit 1 Core, 32-Bit 1 Core, 32-Bit
Speed 1.0GHz 1.0GHz 1GHz 1.0GHz 1.0GHz 1.0GHz
Co-Processors/DSP Multimedia; NEON™ SIMD Multimedia; NEON™ SIMD Multimedia; NEON™ SIMD Multimedia; NEON™ SIMD Multimedia; NEON™ SIMD Multimedia; NEON™ SIMD
RAM Controllers LPDDR2, LVDDR3, DDR3 LPDDR2, LVDDR3, DDR3 LPDDR2, LVDDR3, DDR3 LPDDR2, LVDDR3, DDR3 LPDDR2, LVDDR3, DDR3 LPDDR2, LVDDR3, DDR3
Graphics Acceleration Yes Yes Yes Yes Yes Yes
Display & Interface Controllers Keypad, LCD Keypad, LCD Keypad, LCD Keypad, LCD Keypad, LCD Keypad, LCD
Ethernet 10/100/1000Mbps (1) 10/100/1000Mbps (1) 10/100/1000Mbps (1) 10/100/1000Mbps (1) 10/100/1000Mbps (1) 10/100/1000Mbps (1)
SATA - - - - - -
USB USB 2.0 + PHY (4) USB 2.0 + PHY (4) USB 2.0 + PHY (4) USB 2.0 + PHY (4) USB 2.0 + PHY (4) USB 2.0 + PHY (4)
Voltage - I/O 1.8V, 2.5V, 2.8V, 3.3V 1.8V, 2.5V, 2.8V, 3.3V 1.8V, 2.5V, 2.8V, 3.3V 1.8V, 2.5V, 2.8V, 3.3V 1.8V, 2.5V, 2.8V, 3.3V 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature -20°C ~ 105°C (TJ) -20°C ~ 105°C (TJ) -20°C ~ 105°C (TJ) 0°C ~ 95°C (TJ) -20°C ~ 105°C (TJ) -20°C ~ 105°C (TJ)
Security Features
Package / Case 624-LFBGA 624-LFBGA 624-LFBGA 624-LFBGA 624-LFBGA 624-LFBGA
Supplier Device Package 624-MAPBGA (21x21) 624-MAPBGA (21x21) 624-MAPBGA (21x21) 624-MAPBGA (21x21) 624-MAPBGA (21x21) 624-MAPBGA (21x21)

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