MCIMX6L2DVN10AB
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NXP USA Inc. MCIMX6L2DVN10AB

Manufacturer No:
MCIMX6L2DVN10AB
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The MCIMX6L2DVN10AB is an embedded microprocessor from NXP Semiconductors, part of the i.MX 6 series. This processor is built around the ARM Cortex-A9 core, operating at speeds up to 1 GHz. It is designed to provide high-performance processing with integrated multimedia and power management capabilities, making it suitable for a variety of applications including embedded systems, industrial automation, and automotive electronics.

Key Specifications

Parameter Specification
Manufacturer Part Number MCIMX6L2DVN10AB
Manufacturer NXP Semiconductors
Core ARM Cortex-A9
Operating Speed Up to 1 GHz
Package 432-MAPBGA (13x13)
Operating Temperature 0°C ~ 95°C (TJ)
Voltage 1.2V, 1.8V, 3.0V
Memory Interfaces LPDDR2, LVDDR3, DDR3, PSRAM, Cellular RAM
Interfaces USB 2.0 + PHY, Ethernet 10/100Mbps, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART

Key Features

  • High-Performance Processing: ARM Cortex-A9 core with NEON SIMD co-processor and multimedia co-processor.
  • Power Management: Smart speed technology, dynamic voltage and frequency scaling, and various low power modes.
  • Graphics Acceleration: Integrated 2D graphics accelerator, 2D BLit engine, and OpenVG 1.1 accelerator.
  • Interface Flexibility: Supports LCD controller, CMOS sensor interface, high-speed USB, Ethernet, and multiple serial interfaces.
  • Security Features: Secure ARM TrustZone (TZ) technology, boot security, cryptography, and tamper detection.
  • Peripheral Integration: Keypad and LCD display controllers, and comprehensive peripheral integration.

Applications

  • Embedded Systems: Suitable for various embedded applications requiring high-performance processing.
  • Industrial Automation: Used in industrial automation systems for control and monitoring.
  • Automotive Electronics: Applied in automotive systems for infotainment, navigation, and other control functions.
  • Consumer Products: Ideal for next-generation e-readers and smart devices due to its integrated EPD and LCD controllers.

Q & A

  1. What is the core architecture of the MCIMX6L2DVN10AB?

    The MCIMX6L2DVN10AB is based on the ARM Cortex-A9 core.

  2. What is the maximum operating speed of the processor?

    The processor operates at speeds up to 1 GHz.

  3. What types of memory interfaces does the processor support?

    The processor supports LPDDR2, LVDDR3, DDR3, PSRAM, and Cellular RAM.

  4. What security features are integrated into the processor?

    The processor includes Secure ARM TrustZone (TZ) technology, boot security, cryptography, and tamper detection.

  5. What are the key interfaces supported by the processor?

    The processor supports USB 2.0 + PHY, Ethernet 10/100Mbps, I2C, I2S, MMC/SD/SDIO, SPI, SSI, and UART interfaces.

  6. What is the operating temperature range of the processor?

    The operating temperature range is 0°C ~ 95°C (TJ).

  7. Is the processor RoHS compliant?
  8. What are the typical applications of the MCIMX6L2DVN10AB?

    The processor is used in embedded systems, industrial automation, automotive electronics, and consumer products like e-readers and smart devices.

  9. What is the package type of the MCIMX6L2DVN10AB?

    The processor is packaged in a 432-MAPBGA (13x13).

  10. Does the processor support power management features?

Product Attributes

Core Processor:ARM® Cortex®-A9
Number of Cores/Bus Width:1 Core, 32-Bit
Speed:1.0GHz
Co-Processors/DSP:Multimedia; NEON™ SIMD
RAM Controllers:LPDDR2, LVDDR3, DDR3
Graphics Acceleration:Yes
Display & Interface Controllers:Keypad, LCD
Ethernet:10/100Mbps (1)
SATA:- 
USB:USB 2.0 + PHY (3)
Voltage - I/O:1.2V, 1.8V, 3.0V
Operating Temperature:0°C ~ 95°C (TJ)
Security Features:
Package / Case:432-TFBGA
Supplier Device Package:432-MAPBGA (13x13)
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Similar Products

Part Number MCIMX6L2DVN10AB MCIMX6L3DVN10AB MCIMX6L2EVN10AB MCIMX6L2DVN10AC MCIMX6L2DVN10AA
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. Freescale Semiconductor
Product Status Active Active Active Active Obsolete
Core Processor ARM® Cortex®-A9 ARM® Cortex®-A9 ARM® Cortex®-A9 ARM® Cortex®-A9 ARM® Cortex®-A9
Number of Cores/Bus Width 1 Core, 32-Bit 1 Core, 32-Bit 1 Core, 32-Bit 1 Core, 32-Bit 1 Core, 32-Bit
Speed 1.0GHz 1.0GHz 1.0GHz 1.0GHz 1.0GHz
Co-Processors/DSP Multimedia; NEON™ SIMD Multimedia; NEON™ SIMD Multimedia; NEON™ SIMD Multimedia; NEON™ SIMD Multimedia; NEON™ SIMD
RAM Controllers LPDDR2, LVDDR3, DDR3 LPDDR2, LVDDR3, DDR3 LPDDR2, LVDDR3, DDR3 LPDDR2, LVDDR3, DDR3 LPDDR2, LVDDR3, DDR3
Graphics Acceleration Yes Yes Yes Yes Yes
Display & Interface Controllers Keypad, LCD Keypad, LCD Keypad, LCD Keypad, LCD Keypad, LCD
Ethernet 10/100Mbps (1) 10/100Mbps (1) 10/100Mbps (1) 10/100Mbps (1) 10/100Mbps (1)
SATA - - - - -
USB USB 2.0 + PHY (3) USB 2.0 + PHY (3) USB 2.0 + PHY (3) USB 2.0 + PHY (3) USB 2.0 + PHY (3)
Voltage - I/O 1.2V, 1.8V, 3.0V 1.2V, 1.8V, 3.0V 1.2V, 1.8V, 3.0V 1.2V, 1.8V, 3.0V 1.2V, 1.8V, 3.0V
Operating Temperature 0°C ~ 95°C (TJ) 0°C ~ 95°C (TJ) -40°C ~ 105°C (TA) 0°C ~ 95°C (TJ) 0°C ~ 95°C (TJ)
Security Features
Package / Case 432-TFBGA 432-TFBGA 432-TFBGA 432-TFBGA 432-TFBGA
Supplier Device Package 432-MAPBGA (13x13) 432-MAPBGA (13x13) 432-MAPBGA (13x13) 432-MAPBGA (13x13) 432-MAPBGA (13x13)

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