MC33662LEFR2518
  • Share:

NXP USA Inc. MC33662LEFR2518

Manufacturer No:
MC33662LEFR2518
Manufacturer:
NXP USA Inc.
Package:
Bulk
Description:
INTERFACE CIRCUIT, PDSO8
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The MC33662LEFR2518 is a LIN (Local Interconnect Network) transceiver produced by NXP USA Inc. This component is designed to comply with the ISO 17987, LIN 2.x, and SAE J2602-2 standards, making it suitable for various automotive and industrial applications. The MC33662LEFR2518 is part of NXP's LINcell family, which provides reliable and efficient communication in vehicle networks and other distributed systems.

Key Specifications

ParameterValue
Package TypeSO8 (SOT96-4)
Total Part Weight76.526560 mg
Halogen FreeYes
Lead FreeYes
EU RoHS CompliantYes
TerminationTin (Sn)
Base AlloyCu alloy
Moisture Sensitivity Level / Floor Life3 / 168 hours
Peak Package Temperature260°C
Max Time at Peak Temperature40 sec.

Key Features

  • Compliance with ISO 17987, LIN 2.x, and SAE J2602-2 standards
  • Halogen-free and lead-free, ensuring environmental compliance
  • EU RoHS compliant
  • SO8 (SOT96-4) package type for compact design
  • Tin (Sn) termination and Cu alloy base for reliable connections
  • High temperature tolerance with a peak package temperature of 260°C

Applications

The MC33662LEFR2518 is primarily used in automotive and industrial applications where reliable LIN communication is essential. It is suitable for vehicle networks, distributed systems, and any environment requiring efficient and standardized communication protocols.

Q & A

  1. What is the MC33662LEFR2518 used for? The MC33662LEFR2518 is used as a LIN transceiver in automotive and industrial applications.
  2. What standards does the MC33662LEFR2518 comply with? It complies with ISO 17987, LIN 2.x, and SAE J2602-2 standards.
  3. Is the MC33662LEFR2518 environmentally compliant? Yes, it is halogen-free, lead-free, and EU RoHS compliant.
  4. What is the package type of the MC33662LEFR2518? The package type is SO8 (SOT96-4).
  5. What is the termination material of the MC33662LEFR2518? The termination material is Tin (Sn).
  6. What is the base alloy of the MC33662LEFR2518? The base alloy is Cu alloy.
  7. What is the peak package temperature of the MC33662LEFR2518? The peak package temperature is 260°C.
  8. How long can the MC33662LEFR2518 be exposed to the peak temperature? It can be exposed for 40 seconds.
  9. What is the moisture sensitivity level of the MC33662LEFR2518? The moisture sensitivity level is 3 / 168 hours.
  10. Is the MC33662LEFR2518 suitable for high-temperature environments? Yes, it is designed to handle high temperatures.

Product Attributes

Type:- 
Applications:- 
Mounting Type:- 
Package / Case:- 
Supplier Device Package:- 
0 Remaining View Similar

In Stock

-
251

Please send RFQ , we will respond immediately.

Same Series
CBC9W4S10HE2X/AA
CBC9W4S10HE2X/AA
CONN D-SUB RCPT 9POS CRIMP
RD15S10HV30/AA
RD15S10HV30/AA
CONN D-SUB RCPT 15POS CRIMP
DD26M2S5WV5X
DD26M2S5WV5X
CONN D-SUB HD PLUG 26P SLDR CUP
CBC13W3S10HE3X/AA
CBC13W3S10HE3X/AA
CONN D-SUB RCPT 13POS CRIMP
DD15S20J0S/AA
DD15S20J0S/AA
CONN D-SUB HD RCPT 15P SLDR CUP
DD26S20000
DD26S20000
CONN D-SUB HD RCPT 26P SLDR CUP
DD15S20JV5S/AA
DD15S20JV5S/AA
CONN D-SUB HD RCPT 15P SLDR CUP
CBC9W4S10HE3S/AA
CBC9W4S10HE3S/AA
CONN D-SUB RCPT 9POS CRIMP
DD26S200V30/AA
DD26S200V30/AA
CONN D-SUB HD RCPT 26P SLDR CUP
DD44S32000X
DD44S32000X
CONN D-SUB HD RCPT 44P VERT SLDR
DD44S32S60V30
DD44S32S60V30
CONN D-SUB HD RCPT 44P VERT SLDR
DD26S20L00
DD26S20L00
CONN D-SUB HD RCPT 26P SLDR CUP

Related Product By Categories

BC846AW135
BC846AW135
NXP USA Inc.
NOW NEXPERIA BC846AW - SMALL SIG
PMBT2907AYS115
PMBT2907AYS115
NXP USA Inc.
NOW NEXPERIA PMBT2907AYS SMALL S
AM26LS32ACDBR
AM26LS32ACDBR
Texas Instruments
QUAD RECEIVER RS-422/RS-423 16-P
BZV55-B47115
BZV55-B47115
NXP USA Inc.
NOW NEXPERIA BZV55-B43 - ZENER D
BZX84-C12/DG/B4215
BZX84-C12/DG/B4215
Nexperia USA Inc.
NOW NEXPERIA BZX84-C11 - ZENER D
74ALVC164245DGG,112
74ALVC164245DGG,112
Nexperia USA Inc.
BUS TRANSCEIVER, ALVC/VCX/A SERI
TEA1723AT/N1118
TEA1723AT/N1118
NXP USA Inc.
IC CTLR SMPS W/PWR SWITCH 7-SOIC
S912XEP100BMAL557
S912XEP100BMAL557
NXP USA Inc.
MICROCONTROLLER, 16-BIT, HCS12 C
PSD835G2-90UI
PSD835G2-90UI
STMicroelectronics
IC FLASH 4M PARALLEL 80LQFP
PSD854F2-70J
PSD854F2-70J
STMicroelectronics
IC FLASH 2M PARALLEL 52PLCC
AD9969JSTZ
AD9969JSTZ
Analog Devices Inc.
IC BROADBAND FRONT-END 100LQFP
PUMD3115
PUMD3115
Nexperia USA Inc.
NOW NEXPERIA PUMD3 - SMALL SIGNA

Related Product By Brand

PESD5V0S1BSF/S500315
PESD5V0S1BSF/S500315
NXP USA Inc.
TVS DIODE
S9S12G48F0MLFR
S9S12G48F0MLFR
NXP USA Inc.
IC MCU 16BIT 48KB FLASH 48LQFP
S9S12P32J0CFTR
S9S12P32J0CFTR
NXP USA Inc.
IC MCU 16BIT 32KB FLASH 48QFN
MIMXRT1171CVM8A
MIMXRT1171CVM8A
NXP USA Inc.
IC MCU 32BIT EXT MEM 289MAPBGA
P89LPC935FA,129
P89LPC935FA,129
NXP USA Inc.
IC MCU 8BIT 8KB FLASH 28PLCC
P89LPC938FDH,529
P89LPC938FDH,529
NXP USA Inc.
IC MCU 8BIT 8KB FLASH 28TSSOP
LS1028AXN7PQA
LS1028AXN7PQA
NXP USA Inc.
LS1028A-1500 XT NO SEC
MCIMX6L2EVN10ABR
MCIMX6L2EVN10ABR
NXP USA Inc.
I.MX 6 SERIES 32-BIT MPU ARM CO
74HC32PW/AUJ
74HC32PW/AUJ
NXP USA Inc.
IC GATE OR 4CH 2-INP 14TSSOP
74AHC1G66GW-Q100125
74AHC1G66GW-Q100125
NXP USA Inc.
SPST
SA614AD,602
SA614AD,602
NXP USA Inc.
IC FM IF SYSTEM LOW PWR 16-SOIC
MPXV5100GC6U
MPXV5100GC6U
NXP USA Inc.
SENSOR GAUGE PRESS 14.5PSI MAX