Overview
The NXP Layerscape LS1012A processor, specifically the LS1012AXE7EKB model, is designed for intelligent integration and power efficiency, making it ideal for fanless, small form factor networking and IoT applications. This processor is optimized for battery-backed or USB-powered devices and integrates a single Arm® Cortex®-A53 core running up to 1GHz. It features a hardware packet forwarding engine and high-speed interfaces, delivering line-rate networking performance in an ultra-small size envelope with a typical power dissipation of 1W.
Key Specifications
| Specification | Value |
|---|---|
| Processor Core | Arm® Cortex®-A53 |
| Core Frequency | Up to 1.0 GHz |
| Package Type | VFLGA211 (9.6x9.6 mm) |
| Number of Cores | 1 |
| Architecture | 64-bit |
| Power Dissipation | Typical 1W |
| High-Speed Interfaces | Three-lane, 6 GHz multi-protocol SerDes (up to two Gigabit Ethernet) |
| Moisture Sensitivity Level (MSL) | 3 |
| Peak Package Body Temperature (PPT) | 260°C |
| Maximum Time at Peak Temperature | 40 seconds |
Key Features
- Single Arm® Cortex®-A53 core running up to 1GHz for efficient processing.
- Hardware packet forwarding engine for enhanced networking performance.
- High-speed interfaces including a three-lane, 6 GHz multi-protocol SerDes supporting up to two Gigabit Ethernet connections.
- Ultra-small form factor (VFLGA211 package) suitable for space-constrained applications.
- Low power dissipation (typical 1W) for battery-backed or USB-powered devices.
- Trust Architecture and software compatibility with higher-tier LS family devices for scalable and secure applications.
Applications
The LS1012AXE7EKB processor is designed for various IoT and networking applications, including:
- Fanless, small form factor networking devices.
- Battery-backed or USB-powered IoT devices.
- Space-constrained industrial and commercial networking solutions.
- Edge computing applications as part of NXP's EdgeVerse™ platform.
Q & A
- What is the core architecture of the LS1012AXE7EKB processor?
The LS1012AXE7EKB processor features a single Arm® Cortex®-A53 core with a 64-bit architecture. - What is the maximum frequency of the processor core?
The processor core can run up to 1.0 GHz. - What type of package does the LS1012AXE7EKB come in?
The LS1012AXE7EKB comes in a VFLGA211 package (9.6x9.6 mm). - What is the typical power dissipation of the LS1012AXE7EKB?
The typical power dissipation is 1W. - What high-speed interfaces does the LS1012AXE7EKB support?
The processor supports a three-lane, 6 GHz multi-protocol SerDes, including up to two Gigabit Ethernet connections. - Is the LS1012AXE7EKB suitable for space-constrained applications?
Yes, it is designed for ultra-small form factor applications. - What is the moisture sensitivity level (MSL) of the LS1012AXE7EKB?
The MSL is 3. - What is the peak package body temperature (PPT) for the LS1012AXE7EKB?
The PPT is 260°C. - How long can the LS1012AXE7EKB be exposed to the peak temperature?
It can be exposed for up to 40 seconds. - What applications is the LS1012AXE7EKB typically used for?
It is used for fanless, small form factor networking and IoT applications, as well as edge computing within NXP's EdgeVerse™ platform.
