LPC4322JET100E
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NXP USA Inc. LPC4322JET100E

Manufacturer No:
LPC4322JET100E
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 32BIT 512KB FLSH 100TFBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The LPC4322JET100E, produced by NXP USA Inc., is a dual-core microcontroller unit (MCU) that integrates an Arm Cortex-M4 and an Arm Cortex-M0 processor. This MCU is designed to provide high performance and low power consumption, making it suitable for a variety of applications. The device features a 3-stage pipeline and uses a Harvard architecture with separate local instruction and data buses, as well as a third bus for peripherals.

Key Specifications

SpecificationValue
Processor CoresDual-core: Arm Cortex-M4 and Arm Cortex-M0
Flash Memory512 kB
SRAM136 kB
USB InterfacesTwo High-Speed (HS) USB
Display InterfaceLCD
EMCSupported
Package TypeTFBGA100

Key Features

  • Dual-core architecture with Arm Cortex-M4 and Arm Cortex-M0 processors for balanced performance and power efficiency.
  • 512 kB of flash memory and 136 kB of SRAM for ample storage and runtime memory.
  • Two High-Speed USB interfaces for fast data transfer and connectivity.
  • LCD interface for display applications.
  • EMC (Electromagnetic Compatibility) features to ensure robust operation in various environments.

Applications

The LPC4322JET100E is versatile and can be used in a wide range of applications, including:

  • Industrial automation and control systems.
  • Medical devices requiring high precision and reliability.
  • Consumer electronics such as smart home devices and appliances.
  • Automotive systems, including infotainment and control units.
  • IoT (Internet of Things) devices that require both performance and low power consumption.

Q & A

  1. What are the processor cores of the LPC4322JET100E?
    The LPC4322JET100E features dual-core processors: an Arm Cortex-M4 and an Arm Cortex-M0.
  2. How much flash memory does the LPC4322JET100E have?
    The device has 512 kB of flash memory.
  3. What is the SRAM capacity of the LPC4322JET100E?
    The SRAM capacity is 136 kB.
  4. Does the LPC4322JET100E support USB interfaces?
    Yes, it supports two High-Speed (HS) USB interfaces.
  5. Is the LPC4322JET100E suitable for display applications?
    Yes, it includes an LCD interface for display applications.
  6. What package type is the LPC4322JET100E available in?
    The device is offered in a TFBGA100 package.
  7. What are some key applications of the LPC4322JET100E?
    It is used in industrial automation, medical devices, consumer electronics, automotive systems, and IoT devices.
  8. Does the LPC4322JET100E have EMC features?
    Yes, it includes features for Electromagnetic Compatibility (EMC).
  9. What is the architecture of the processor in the LPC4322JET100E?
    The processor uses a Harvard architecture with separate local instruction and data buses, as well as a third bus for peripherals.
  10. How many stages does the pipeline of the Arm Cortex-M4 CPU have?
    The Arm Cortex-M4 CPU has a 3-stage pipeline.

Product Attributes

Core Processor:ARM® Cortex®-M4/M0
Core Size:32-Bit Dual-Core
Speed:204MHz
Connectivity:CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:Brown-out Detect/Reset, DMA, I²S, POR, WDT
Number of I/O:49
Program Memory Size:512KB (512K x 8)
Program Memory Type:Flash
EEPROM Size:16K x 8
RAM Size:104K x 8
Voltage - Supply (Vcc/Vdd):2.2V ~ 3.6V
Data Converters:A/D 4x10b; D/A 1x10b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 105°C (TA)
Mounting Type:Surface Mount
Package / Case:100-TFBGA
Supplier Device Package:100-TFBGA (9x9)
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Similar Products

Part Number LPC4322JET100E LPC4323JET100E LPC4325JET100E LPC4327JET100E LPC4312JET100E
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Active
Core Processor ARM® Cortex®-M4/M0 ARM® Cortex®-M4/M0 ARM® Cortex®-M4/M0 ARM® Cortex®-M4/M0 ARM® Cortex®-M4/M0
Core Size 32-Bit Dual-Core 32-Bit Dual-Core 32-Bit Dual-Core 32-Bit Dual-Core 32-Bit Dual-Core
Speed 204MHz 204MHz 204MHz 204MHz 204MHz
Connectivity CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, WDT Brown-out Detect/Reset, DMA, I²S, POR, WDT Brown-out Detect/Reset, DMA, I²S, POR, WDT Brown-out Detect/Reset, DMA, I²S, POR, WDT Brown-out Detect/Reset, DMA, I²S, POR, WDT
Number of I/O 49 49 49 49 49
Program Memory Size 512KB (512K x 8) 512KB (512K x 8) 768KB (768K x 8) 1MB (1M x 8) 512KB (512K x 8)
Program Memory Type Flash Flash Flash Flash Flash
EEPROM Size 16K x 8 16K x 8 16K x 8 16K x 8 16K x 8
RAM Size 104K x 8 104K x 8 136K x 8 136K x 8 104K x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V 2.2V ~ 3.6V 2.2V ~ 3.6V 2.2V ~ 3.6V 2.2V ~ 3.6V
Data Converters A/D 4x10b; D/A 1x10b A/D 4x10b; D/A 1x10b A/D 4x10b; D/A 1x10b A/D 4x10b; D/A 1x10b A/D 4x10b; D/A 1x10b
Oscillator Type Internal Internal Internal Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 100-TFBGA 100-TFBGA 100-TFBGA 100-TFBGA 100-TFBGA
Supplier Device Package 100-TFBGA (9x9) 100-TFBGA (9x9) 100-TFBGA (9x9) 100-TFBGA (9x9) 100-TFBGA (9x9)

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