LPC1112FHN33/103,5
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NXP USA Inc. LPC1112FHN33/103,5

Manufacturer No:
LPC1112FHN33/103,5
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 32BIT 16KB FLASH 32HVQFN
Delivery:
Payment:
iso14001
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Product Introduction

Overview

The LPC1112FHN33/103,5 is a 32-bit ARM Cortex-M0 microcontroller produced by NXP USA Inc. This microcontroller operates at frequencies up to 50 MHz and is designed for low power consumption and efficient performance in embedded applications. It features 16 KB of on-chip flash memory and 2 KB of SRAM, making it suitable for a variety of industrial and consumer electronics applications, including automation systems, sensor interfaces, and low-power embedded devices.

Key Specifications

SpecificationDetails
Core ProcessorARM® Cortex®-M0
Core Size32-Bit Single-Core
Operating FrequencyUp to 50 MHz
Program Memory16 KB (16K x 8) FLASH
RAM Size2 KB
Package / Case32-HVQFN (7x7 mm)
Number Of I/O28
Operating Temperature-40°C ~ 85°C (TA)
Voltage - Supply (Vcc/Vdd)1.8 V ~ 3.6 V
ConnectivityI²C, SPI, UART/USART
PeripheralsBrown-out Detect/Reset, POR, WDT, 10-bit ADC
Oscillator TypeInternal RC oscillator, Crystal oscillator

Key Features

  • Supports various peripherals including UART, I2C, and SPI interfaces, along with a 10-bit ADC.
  • Integrated Power Management Unit (PMU) to minimize power consumption during Sleep, Deep-sleep, and Deep power-down modes.
  • Programmable WatchDog Timer (WDT) and programmable windowed WDT on the LPC1100L and LPC1100XL series.
  • Four general purpose counter/timers with up to eight capture inputs and up to 13 match outputs.
  • High-current sink drivers (20 mA) on two I2C-bus pins in Fast-mode Plus.
  • Unique device serial number for identification.

Applications

The LPC1112FHN33/103,5 is ideal for various applications requiring efficient processing, low power consumption, and multiple communication interfaces. These include:

  • Industrial and consumer electronics
  • Automation systems
  • Sensor interfaces
  • Low-power embedded devices

Q & A

  1. What is the core processor of the LPC1112FHN33/103,5?
    The core processor is the ARM® Cortex®-M0.
  2. What is the maximum operating frequency of the LPC1112FHN33/103,5?
    The maximum operating frequency is up to 50 MHz.
  3. How much flash memory and SRAM does the LPC1112FHN33/103,5 have?
    The device has 16 KB of flash memory and 2 KB of SRAM.
  4. What are the supported communication interfaces?
    The device supports UART, I2C, and SPI interfaces.
  5. What is the package type and size of the LPC1112FHN33/103,5?
    The device is housed in a 32-HVQFN package measuring 7x7 mm.
  6. What are the operating temperature and voltage supply ranges?
    The operating temperature range is -40°C ~ 85°C (TA), and the voltage supply range is 1.8 V ~ 3.6 V.
  7. Does the LPC1112FHN33/103,5 have any power-saving features?
    Yes, it has integrated PMU and supports Sleep, Deep-sleep, and Deep power-down modes.
  8. What peripherals are supported by the LPC1112FHN33/103,5?
    The device supports Brown-out Detect/Reset, POR, WDT, and a 10-bit ADC.
  9. Is the LPC1112FHN33/103,5 suitable for industrial applications?
    Yes, it is suitable for industrial and consumer electronics applications, including automation systems and sensor interfaces.
  10. How many I/O pins does the LPC1112FHN33/103,5 have?
    The device has 28 I/O pins.

Product Attributes

Core Processor:ARM® Cortex®-M0
Core Size:32-Bit Single-Core
Speed:50MHz
Connectivity:I²C, SPI, UART/USART
Peripherals:Brown-out Detect/Reset, POR, WDT
Number of I/O:28
Program Memory Size:16KB (16K x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:2K x 8
Voltage - Supply (Vcc/Vdd):1.8V ~ 3.6V
Data Converters:A/D 8x10b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:32-VQFN Exposed Pad
Supplier Device Package:32-HVQFN (7x7)
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Similar Products

Part Number LPC1112FHN33/103,5 LPC1112FHN33/203,5 LPC1111FHN33/103,5 LPC1112FHN33/101,5 LPC1112FHN33/102,5
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Discontinued at Digi-Key Active Discontinued at Digi-Key
Core Processor ARM® Cortex®-M0 ARM® Cortex®-M0 ARM® Cortex®-M0 ARM® Cortex®-M0 ARM® Cortex®-M0
Core Size 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Speed 50MHz 50MHz 50MHz 50MHz 50MHz
Connectivity I²C, SPI, UART/USART I²C, SPI, UART/USART I²C, SPI, UART/USART I²C, SPI, UART/USART I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT
Number of I/O 28 28 28 28 28
Program Memory Size 16KB (16K x 8) 16KB (16K x 8) 8KB (8K x 8) 16KB (16K x 8) 16KB (16K x 8)
Program Memory Type Flash Flash Flash Flash Flash
EEPROM Size - - - - -
RAM Size 2K x 8 4K x 8 2K x 8 2K x 8 2K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V
Data Converters A/D 8x10b A/D 8x10b A/D 8x10b A/D 8x10b A/D 8x10b
Oscillator Type Internal Internal Internal Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 32-VQFN Exposed Pad 32-VQFN Exposed Pad 32-VQFN Exposed Pad 32-VQFN Exposed Pad 32-VQFN Exposed Pad
Supplier Device Package 32-HVQFN (7x7) 32-HVQFN (7x7) 32-HVQFN (7x7) 32-HVQFN (7x7) 32-HVQFN (7x7)

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