LPC1111FHN33/103,5
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NXP USA Inc. LPC1111FHN33/103,5

Manufacturer No:
LPC1111FHN33/103,5
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 32BIT 8KB FLASH 32HVQFN
Delivery:
Payment:
iso14001
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iso9001
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Product Introduction

Overview

The LPC1111FHN33/103,5 is a 32-bit microcontroller from NXP Semiconductors, based on the ARM Cortex-M0 core. This microcontroller is part of the LPC1100 series, designed for general-purpose applications requiring low power consumption and high performance. It is packaged in a HVQFN33 plastic thermal enhanced very thin quad flat package, making it suitable for a variety of embedded systems.

Key Specifications

ParameterValue
Core ProcessorARM Cortex-M0
Maximum Clock FrequencyUp to 50 MHz
Flash Memory8 KB
SRAM4 KB
Package TypeHVQFN33 (plastic thermal enhanced very thin quad flat package)
Package Dimensions7 x 7 x 0.85 mm
ConnectivityI²C, SPI, UART/USART
Interrupt ControllerNested Vectored Interrupt Controller (NVIC)

Key Features

  • Low power consumption with multiple power modes
  • High performance ARM Cortex-M0 core
  • Integrated peripherals including I²C, SPI, and UART/USART
  • Nested Vectored Interrupt Controller (NVIC) for efficient interrupt handling
  • Small footprint HVQFN33 package for space-constrained designs

Applications

  • General-purpose embedded systems
  • Industrial control and automation
  • Internet of Things (IoT) devices
  • Consumer electronics
  • Automotive and industrial automation

Q & A

  1. What is the core processor of the LPC1111FHN33/103,5?
    The core processor is the ARM Cortex-M0.
  2. What is the maximum clock frequency of the LPC1111FHN33/103,5?
    The maximum clock frequency is up to 50 MHz.
  3. How much flash memory does the LPC1111FHN33/103,5 have?
    The LPC1111FHN33/103,5 has 8 KB of flash memory.
  4. What type of package does the LPC1111FHN33/103,5 use?
    The package type is HVQFN33 (plastic thermal enhanced very thin quad flat package).
  5. What are the dimensions of the HVQFN33 package?
    The dimensions are 7 x 7 x 0.85 mm.
  6. What connectivity options are available on the LPC1111FHN33/103,5?
    The available connectivity options include I²C, SPI, and UART/USART.
  7. Does the LPC1111FHN33/103,5 have an interrupt controller?
    Yes, it has a Nested Vectored Interrupt Controller (NVIC).
  8. What are some typical applications for the LPC1111FHN33/103,5?
    Typical applications include general-purpose embedded systems, industrial control and automation, IoT devices, consumer electronics, and automotive and industrial automation.
  9. How much SRAM does the LPC1111FHN33/103,5 have?
    The LPC1111FHN33/103,5 has 4 KB of SRAM.
  10. Is the LPC1111FHN33/103,5 suitable for low power applications?
    Yes, it is designed for low power consumption with multiple power modes.

Product Attributes

Core Processor:ARM® Cortex®-M0
Core Size:32-Bit Single-Core
Speed:50MHz
Connectivity:I²C, SPI, UART/USART
Peripherals:Brown-out Detect/Reset, POR, WDT
Number of I/O:28
Program Memory Size:8KB (8K x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:2K x 8
Voltage - Supply (Vcc/Vdd):1.8V ~ 3.6V
Data Converters:A/D 8x10b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:32-VQFN Exposed Pad
Supplier Device Package:32-HVQFN (7x7)
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Similar Products

Part Number LPC1111FHN33/103,5 LPC1111FHN33/203,5 LPC1112FHN33/103,5 LPC1111FHN33/101,5 LPC1111FHN33/102,5
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Discontinued at Digi-Key Active Active Active Discontinued at Digi-Key
Core Processor ARM® Cortex®-M0 ARM® Cortex®-M0 ARM® Cortex®-M0 ARM® Cortex®-M0 ARM® Cortex®-M0
Core Size 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Speed 50MHz 50MHz 50MHz 50MHz 50MHz
Connectivity I²C, SPI, UART/USART I²C, SPI, UART/USART I²C, SPI, UART/USART I²C, SPI, UART/USART I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT
Number of I/O 28 28 28 28 28
Program Memory Size 8KB (8K x 8) 8KB (8K x 8) 16KB (16K x 8) 8KB (8K x 8) 8KB (8K x 8)
Program Memory Type Flash Flash Flash Flash Flash
EEPROM Size - - - - -
RAM Size 2K x 8 4K x 8 2K x 8 2K x 8 2K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V
Data Converters A/D 8x10b A/D 8x10b A/D 8x10b A/D 8x10b A/D 8x10b
Oscillator Type Internal Internal Internal Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 32-VQFN Exposed Pad 32-VQFN Exposed Pad 32-VQFN Exposed Pad 32-VQFN Exposed Pad 32-VQFN Exposed Pad
Supplier Device Package 32-HVQFN (7x7) 32-HVQFN (7x7) 32-HVQFN (7x7) 32-HVQFN (7x7) 32-HVQFN (7x7)

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