LPC1111FHN33/203,5
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NXP USA Inc. LPC1111FHN33/203,5

Manufacturer No:
LPC1111FHN33/203,5
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 32BIT 8KB FLASH 32HVQFN
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The LPC1111FHN33/203,5 is a 32-bit microcontroller from NXP USA Inc., based on the ARM Cortex-M0 core. This microcontroller is part of the LPC1100L series and is designed for entry-level applications requiring low power consumption and high performance. It features a 50 MHz processor, 8 KB of flash memory, and 4 KB of RAM. The device is packaged in a 32-pin HVQFN (7x7 mm) package, which is lead-free and RoHS compliant. This microcontroller is suitable for a variety of embedded systems and IoT applications due to its robust set of peripherals and low power characteristics.

Key Specifications

Parameter Value
Core Processor ARM® Cortex®-M0
Core Size 32-Bit Single-Core
Speed 50 MHz
Program Memory Type FLASH
Program Memory Size 8 KB (8K x 8)
RAM Size 4 KB x 8
Voltage - Supply (Vcc/Vdd) 1.8 V ~ 3.6 V
Package / Case 32-HVQFN (7x7 mm)
Number Of I/O 28
Operating Temperature -40°C ~ 85°C (TA)
Oscillator Type Internal
Peripherals Brown-out Detect/Reset, POR, WDT
Connectivity I²C, SPI, UART/USART
Data Converters A/D 8x10b
Lead Free Status / RoHS Status Lead free / RoHS Compliant

Key Features

  • ARM Cortex-M0 Core: Runs at frequencies up to 50 MHz, providing high performance and low power consumption.
  • Memory and Storage: 8 KB of flash memory and 4 KB of RAM, suitable for various embedded applications.
  • Peripherals: Includes brown-out detect/reset, power-on reset (POR), and watchdog timer (WDT) for robust system management.
  • Connectivity: Supports I²C, SPI, and UART/USART for versatile communication options.
  • Package and Compliance: Packaged in a 32-pin HVQFN (7x7 mm) which is lead-free and RoHS compliant.
  • Operating Temperature Range: Operates from -40°C to 85°C, making it suitable for a wide range of environmental conditions.

Applications

  • Embedded Systems: Ideal for various embedded applications requiring low power and high performance.
  • IoT Devices: Suitable for IoT devices due to its low power consumption and robust set of peripherals.
  • Industrial Automation: Can be used in industrial automation for control and monitoring systems.
  • Consumer Electronics: Applicable in consumer electronics such as smart home devices and wearables.
  • Automotive Systems: Can be integrated into automotive systems for various control and monitoring functions.

Q & A

  1. What is the core processor of the LPC1111FHN33/203,5?

    The core processor is the ARM® Cortex®-M0.

  2. What is the maximum operating frequency of the LPC1111FHN33/203,5?

    The maximum operating frequency is 50 MHz.

  3. How much flash memory does the LPC1111FHN33/203,5 have?

    The LPC1111FHN33/203,5 has 8 KB of flash memory.

  4. What is the RAM size of the LPC1111FHN33/203,5?

    The RAM size is 4 KB x 8.

  5. What are the supported communication interfaces?

    The device supports I²C, SPI, and UART/USART.

  6. What is the operating temperature range of the LPC1111FHN33/203,5?

    The operating temperature range is -40°C to 85°C.

  7. Is the LPC1111FHN33/203,5 RoHS compliant?

    Yes, the LPC1111FHN33/203,5 is lead-free and RoHS compliant.

  8. What type of package does the LPC1111FHN33/203,5 come in?

    The device is packaged in a 32-pin HVQFN (7x7 mm).

  9. What are some of the peripherals included in the LPC1111FHN33/203,5?

    The peripherals include brown-out detect/reset, power-on reset (POR), and watchdog timer (WDT).

  10. What is the supply voltage range for the LPC1111FHN33/203,5?

    The supply voltage range is 1.8 V to 3.6 V.

Product Attributes

Core Processor:ARM® Cortex®-M0
Core Size:32-Bit Single-Core
Speed:50MHz
Connectivity:I²C, SPI, UART/USART
Peripherals:Brown-out Detect/Reset, POR, WDT
Number of I/O:28
Program Memory Size:8KB (8K x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:4K x 8
Voltage - Supply (Vcc/Vdd):1.8V ~ 3.6V
Data Converters:A/D 8x10b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:32-VQFN Exposed Pad
Supplier Device Package:32-HVQFN (7x7)
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Part Number LPC1111FHN33/203,5 LPC1112FHN33/203,5 LPC1113FHN33/203,5 LPC1114FHN33/203,5 LPC1111FHN33/103,5 LPC1111FHN33/201,5 LPC1111FHN33/202,5
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Discontinued at Digi-Key Active Active
Core Processor ARM® Cortex®-M0 ARM® Cortex®-M0 ARM® Cortex®-M0 ARM® Cortex®-M0 ARM® Cortex®-M0 ARM® Cortex®-M0 ARM® Cortex®-M0
Core Size 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Speed 50MHz 50MHz 50MHz 50MHz 50MHz 50MHz 50MHz
Connectivity I²C, SPI, UART/USART I²C, SPI, UART/USART I²C, SPI, UART/USART I²C, SPI, UART/USART I²C, SPI, UART/USART I²C, SPI, UART/USART I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT
Number of I/O 28 28 28 28 28 28 28
Program Memory Size 8KB (8K x 8) 16KB (16K x 8) 24KB (24K x 8) 32KB (32K x 8) 8KB (8K x 8) 8KB (8K x 8) 8KB (8K x 8)
Program Memory Type Flash Flash Flash Flash Flash Flash Flash
EEPROM Size - - - - - - -
RAM Size 4K x 8 4K x 8 4K x 8 4K x 8 2K x 8 4K x 8 4K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V
Data Converters A/D 8x10b A/D 8x10b A/D 8x10b A/D 8x10b A/D 8x10b A/D 8x10b A/D 8x10b
Oscillator Type Internal Internal Internal Internal Internal Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 32-VQFN Exposed Pad 32-VQFN Exposed Pad 32-VQFN Exposed Pad 32-VQFN Exposed Pad 32-VQFN Exposed Pad 32-VQFN Exposed Pad 32-VQFN Exposed Pad
Supplier Device Package 32-HVQFN (7x7) 32-HVQFN (7x7) 32-HVQFN (7x7) 32-HVQFN (7x7) 32-HVQFN (7x7) 32-HVQFN (7x7) 32-HVQFN (7x7)

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