LPC1112FHN33/101,5
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NXP USA Inc. LPC1112FHN33/101,5

Manufacturer No:
LPC1112FHN33/101,5
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 32BIT 16KB FLASH 32HVQFN
Delivery:
Payment:
iso14001
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iso9001
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Product Introduction

Overview

The LPC1112FHN33/101,5 is a 32-bit microcontroller from NXP Semiconductors, based on the ARM Cortex-M0 architecture. This microcontroller is part of the LPC1100 series, known for its low power consumption and high performance. It is designed for a variety of applications requiring efficient processing and minimal power usage.

Key Specifications

Specification Details
Processor ARM Cortex-M0
Flash Memory 16 kB on-chip flash programming memory
SRAM Up to 4 kB SRAM
Package HVQFN33 - plastic thermal enhanced very thin quad flat package
GPIO Pins Up to 42 General Purpose I/O (GPIO) pins with configurable pull-up/pull-down resistors
Analog Peripherals 10-bit ADC with input multiplexing among 5, 6, or 8 pins depending on package size
Serial Interfaces UART with fractional baud rate generation, internal FIFO, and RS-485 support; Two SPI controllers; I2C-bus interface supporting full I2C-bus specification and Fast-mode Plus
Clock Generation 12 MHz internal RC oscillator; Crystal oscillator with an operating range of 1 MHz to 25 MHz; Programmable watchdog oscillator; PLL for CPU operation up to the maximum CPU rate
Power Supply Single power supply (1.8 V to 3.6 V)
Power Modes Sleep, Deep-sleep, and Deep power-down modes

Key Features

  • In-System Programming (ISP) and In-Application Programming (IAP) via on-chip bootloader software.
  • High-current output driver (20 mA) on one pin and high-current sink drivers (20 mA) on two I2C-bus pins in Fast-mode Plus.
  • Four general purpose counter/timers with up to eight capture inputs and up to 13 match outputs.
  • Programmable WatchDog Timer (WDT) and programmable windowed WDT on certain series.
  • Integrated Power Management Unit (PMU) to minimize power consumption during various power modes.
  • Unique device serial number for identification.
  • Processor wake-up from Deep-sleep mode via a dedicated start logic using up to 13 of the functional pins.

Applications

  • Industrial control systems
  • Consumer electronics
  • Medical devices
  • Automotive systems (non-safety critical)
  • IoT devices requiring low power and high efficiency

Q & A

  1. What is the processor architecture of the LPC1112FHN33/101,5?

    The LPC1112FHN33/101,5 is based on the ARM Cortex-M0 architecture.

  2. How much flash memory does the LPC1112FHN33/101,5 have?

    The LPC1112FHN33/101,5 has 16 kB of on-chip flash programming memory.

  3. What types of serial interfaces are supported by the LPC1112FHN33/101,5?

    The microcontroller supports UART, SPI, and I2C-bus interfaces.

  4. What are the power modes available on the LPC1112FHN33/101,5?

    The microcontroller supports Sleep, Deep-sleep, and Deep power-down modes.

  5. Can the LPC1112FHN33/101,5 be programmed in-system?
  6. What is the voltage range of the power supply for the LPC1112FHN33/101,5?

    The microcontroller operates on a single power supply ranging from 1.8 V to 3.6 V.

  7. Does the LPC1112FHN33/101,5 have any analog peripherals?
  8. How many GPIO pins are available on the LPC1112FHN33/101,5?
  9. What is the purpose of the integrated Power Management Unit (PMU)?

    The PMU is designed to minimize power consumption during various power modes.

  10. Can the LPC1112FHN33/101,5 be woken up from Deep-sleep mode?

Product Attributes

Core Processor:ARM® Cortex®-M0
Core Size:32-Bit Single-Core
Speed:50MHz
Connectivity:I²C, SPI, UART/USART
Peripherals:Brown-out Detect/Reset, POR, WDT
Number of I/O:28
Program Memory Size:16KB (16K x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:2K x 8
Voltage - Supply (Vcc/Vdd):1.8V ~ 3.6V
Data Converters:A/D 8x10b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:32-VQFN Exposed Pad
Supplier Device Package:32-HVQFN (7x7)
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Similar Products

Part Number LPC1112FHN33/101,5 LPC1112FHN33/103,5 LPC1112FHN33/201,5 LPC1112FHN33/102,5 LPC1111FHN33/101,5
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Discontinued at Digi-Key Active
Core Processor ARM® Cortex®-M0 ARM® Cortex®-M0 ARM® Cortex®-M0 ARM® Cortex®-M0 ARM® Cortex®-M0
Core Size 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Speed 50MHz 50MHz 50MHz 50MHz 50MHz
Connectivity I²C, SPI, UART/USART I²C, SPI, UART/USART I²C, SPI, UART/USART I²C, SPI, UART/USART I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT
Number of I/O 28 28 28 28 28
Program Memory Size 16KB (16K x 8) 16KB (16K x 8) 16KB (16K x 8) 16KB (16K x 8) 8KB (8K x 8)
Program Memory Type Flash Flash Flash Flash Flash
EEPROM Size - - - - -
RAM Size 2K x 8 2K x 8 4K x 8 2K x 8 2K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V
Data Converters A/D 8x10b A/D 8x10b A/D 8x10b A/D 8x10b A/D 8x10b
Oscillator Type Internal Internal Internal Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 32-VQFN Exposed Pad 32-VQFN Exposed Pad 32-VQFN Exposed Pad 32-VQFN Exposed Pad 32-VQFN Exposed Pad
Supplier Device Package 32-HVQFN (7x7) 32-HVQFN (7x7) 32-HVQFN (7x7) 32-HVQFN (7x7) 32-HVQFN (7x7)

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